Abstract:
An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.
Abstract:
An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.
Abstract:
An object of the present invention is to obtain a wiring board that achieves both of high mounting position accuracy and high solder strength in a circumferential direction. On the wiring board, an electronic component including a plurality of pins is mounted. The wiring board includes a base substrate, a plurality of wires provided on the base substrate, a resist covering the wires, and a plurality of footprints connected to the wires and having entire surfaces exposed in openings of the resist. The pins are soldered to the footprints by reflow. In the openings of the resist, directions in which the pins are led out are parallel to directions in which the wires are led out.
Abstract:
The width of a lead-terminal connection pad on a printed wiring board is not greater than the width of a lead terminal. Therefore, a wider space can be secured between adjacent solder joints, so that bridge failure can be suppressed. Further, the length of projection of the lead-terminal connection pad at the proximal portion of the lead terminal is shorter than that of a lead-terminal connection pad on a conventional printed wiring board. Thus, a solder pool at the proximal portion of the lead terminal can be reduced to suppress bridge defect.
Abstract:
An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
Abstract:
Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.
Abstract:
Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.
Abstract:
Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.
Abstract:
An electrical connector includes an insulating housing provided with a mating connector receiving recessed part for receiving a mating connector. The housing includes side surfaces provided with attachment member accommodating recessed parts. A metal plate is accommodated in each of the attachment member accommodating recessed parts. The metal plate includes a fastening part and a solder connection part. The solder connection part extends downward from a lower edge of the fastening part.
Abstract:
A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.