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    APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS
    111.
    发明申请
    APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS 审中-公开
    装有内层的装置支持表面装配组件

    公开(公告)号：WO9524730A3

    公开(公告)日：1996-02-15

    申请号：PCT/US9502678

    申请日：1995-03-09

    Applicant: PANDA PROJECT

    Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M

    IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H01L

    CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.

    Abstract translation: 半导体管芯封装（30）包括多个导电引线（11）和用于承载电信号的多层结构（10），所述多层结构（10）包括多层绝缘材料（12a-12d ），每个层包括在该层的相对侧上的第一表面和第二表面。 每个引线（11）延伸到完全延伸通过至少一个层的相应的阱（15），并且在一个层的一个表面上底部，阱（15）不通过该表面延伸并电耦合 涉及形成在其对应的井（15）内的导电接合结构（13）。

    APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS
    112.
    发明申请
    APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS 审中-公开
    装有内层的装置支持表面装配组件

    公开(公告)号：WO1995024730A2

    公开(公告)日：1995-09-14

    申请号：PCT/US1995002678

    申请日：1995-03-09

    Applicant: THE PANDA PROJECT

    Inventor： THE PANDA PROJECT ,  CRANE, Stanford, W., Jr. ,  PORTUONDO, Maria, M.

    IPC: H01L00/00

    CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

    Abstract translation: 一种包括多层衬底的装置，所述多层衬底包括多层绝缘材料，至少一个阱形成在至少一层中，所述阱从所述多层衬底的外表面延伸到所述多层衬底的内表面 以及在所述多层基板的内表面上的所述阱内形成的导电部件; 以及具有延伸到阱中的至少一个导电引线或导线并与形成在多层基板的内表面上的导电部件直接物理接触的器件。 另外，制造装置的方法包括以下步骤：形成包括多层绝缘材料的多层基板，至少一层形成在至少一层中的阱，所述阱从多层的外表面延伸 在多层基板的内表面上形成有在多层基板的内表面上的导电部件， 并且将至少一个导电引线或线从器件延伸到阱中，使得引线或引线与形成在多层衬底的内表面上的导电部件直接物理接触。

    PRINTED WIRING BOARD CAPABLE OF SUPPRESSING MOUNTING FAILURE OF SURFACE MOUNT DEVICE FOR FLOW SOLDERING
    114.
    发明申请
    PRINTED WIRING BOARD CAPABLE OF SUPPRESSING MOUNTING FAILURE OF SURFACE MOUNT DEVICE FOR FLOW SOLDERING 审中-公开
    印刷电路板，可以防止表面安装装置的安装失败，用于流动焊接

    公开(公告)号：US20160227648A1

    公开(公告)日：2016-08-04

    申请号：US15013286

    申请日：2016-02-02

    Applicant: FANUC Corporation

    Inventor： Takeshi SAWADA ,  Yuichi OKOUCHI ,  Daisuke MIURA

    IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

    CPC classification number: H05K3/3426 ,  H05K3/305 ,  H05K2201/10772 ,  Y02P70/613

    Abstract: The width of a lead-terminal connection pad on a printed wiring board is not greater than the width of a lead terminal. Therefore, a wider space can be secured between adjacent solder joints, so that bridge failure can be suppressed. Further, the length of projection of the lead-terminal connection pad at the proximal portion of the lead terminal is shorter than that of a lead-terminal connection pad on a conventional printed wiring board. Thus, a solder pool at the proximal portion of the lead terminal can be reduced to suppress bridge defect.

    Abstract translation: 印刷电路板上的引线端子连接焊盘的宽度不大于引线端子的宽度。 因此，可以在相邻的焊点之间确保更宽的空间，从而可以抑制桥接故障。 此外，引线端子连接焊盘在引线端子的基端部的突出长度比传统印刷电路板上的引线端子连接焊盘的突出长度短。 因此，可以减少引线端子的近端部分的焊料池，以抑制桥接缺陷。

    Lead pin for package substrate
    116.
    发明授权
    Lead pin for package substrate 失效
    封装基板引脚

    公开(公告)号：US08142240B2

    公开(公告)日：2012-03-27

    申请号：US12805214

    申请日：2010-07-19

    Applicant: Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

    Inventor： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

    IPC: H01R4/02

    CPC classification number: H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

    Abstract: Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

    Abstract translation: 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

    Lead pin for package boards
    117.
    发明授权
    Lead pin for package boards 失效
    封装板引脚

    公开(公告)号：US07893355B2

    公开(公告)日：2011-02-22

    申请号：US12232316

    申请日：2008-09-15

    Applicant: Hueng Jae Oh ,  Jin Won Choi

    Inventor： Hueng Jae Oh ,  Jin Won Choi

    IPC: H01R4/18

    CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00

    Abstract: Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.

    Abstract translation: 提供一种用于封装板的引脚，包括直径朝向其中间部分增加的圆盘形头部，并且具有六边形垂直横截面形状; 以及形成为从头部的上表面的中心突出的连接销。

    Lead pin for package substrate
    118.
    发明申请
    Lead pin for package substrate 失效
    封装基板引脚

    公开(公告)号：US20110014827A1

    公开(公告)日：2011-01-20

    申请号：US12805214

    申请日：2010-07-19

    Applicant: Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

    Inventor： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

    IPC: H01R13/04

    CPC classification number: H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

    Abstract: Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

    Abstract translation: 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

    Attachment Member Surface-Mount Component Comprising the Attachment Member, and Mounting Structure Using the Attachment Member
    119.
    发明申请
    Attachment Member Surface-Mount Component Comprising the Attachment Member, and Mounting Structure Using the Attachment Member 审中-公开
    附件部件表面安装部件，包括附件，以及使用附件的安装结构

    公开(公告)号：US20100227506A1

    公开(公告)日：2010-09-09

    申请号：US12160342

    申请日：2007-01-11

    Applicant: Yuzo Kawahara

    Inventor： Yuzo Kawahara

    IPC: H01R13/46

    CPC classification number: H05K3/3426 ,  H01R12/707 ,  H01R12/727 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10772 ,  Y02P70/613

    Abstract: An electrical connector includes an insulating housing provided with a mating connector receiving recessed part for receiving a mating connector. The housing includes side surfaces provided with attachment member accommodating recessed parts. A metal plate is accommodated in each of the attachment member accommodating recessed parts. The metal plate includes a fastening part and a solder connection part. The solder connection part extends downward from a lower edge of the fastening part.

    Abstract translation: 电连接器包括设置有用于接收配合连接器的配合连接器接收凹部的绝缘壳体。 壳体包括设置有容纳凹部的附接构件的侧表面。 金属板容纳在每个附接构件容纳凹部中。 金属板包括紧固部和焊接部。 焊接连接部分从紧固部分的下边缘向下延伸。

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