Abstract:
An integrated electronic device 1 for detecting at least one parameter related to humidity and/or presence of water and/or acidity/basicity of an environment surrounding the device is described. Such device 1 comprises a separation layer 14 from the surrounding environment, comprising at least one portion of insulating material 14, and further comprises a first conductive member 11 and a second conductive member 12, made of an electrically conductive material, arranged inside the separation layer 14, with respect to the surrounding environment, and separated from the surrounding environment by the separation layer 14. The device 1 also comprises a measurement module 15, having two measurement terminals 151, 152, electrically connected with the first 11 and the second 12 conductive members, respectively; the measurement module 15 is configured to provide an electric potential difference between the first 11 and the second 12 conductive members. The device 1 further comprises electrode means 13, configured to act as an electrode, arranged outside of the separation layer 14, with respect to the first 11 and the second 12 conductive members; the electrode means 13 are arranged so as to form, with the first 11 and the second 12 conductive members, an electromagnetic circuit having an electromagnetic circuit overall impedance variable based upon the exposure to environmental conditions with a variable level of humidity and/or acidity/basicity. The measurement module 15 is configured to measure the electromagnetic circuit overall impedance, which is present between the measurement terminals 151, 152, and to determine the at least one parameter to be detected, based on the overall impedance measured.
Abstract:
A planar electric circuit board may include a planar support of a foldable material defining a base surface and wings coupled to the base surface along respective folding lines so that the wings, when folded along the folding lines, are erected with respect to the base surface and remain in that position. An auxiliary circuit is on the planar support and may include pairs of capacitive coupling plates defined on the wings and on the base surface, and electric communication lines coupled to corresponding ones of the pairs of capacitive coupling plates.
Abstract:
A package (15) for devices (100) insertable into a solid structure (300) for detecting and monitoring one or more local parameters is described. The package (15) is made of a building material formed of particles of micrometric or sub-micrometric dimensions. A device (100) for detecting and monitoring one or more local parameters within a solid structure is further described. The device (100) comprises an integrated detection module (1), having at least one integrated sensor (10), and a package (15), having the above-mentioned characteristics, so arranged as to coat at least one portion of the device (100), comprising the integrated detection module (1). A method for manufacturing the device (100), and a system (200) for monitoring parameters in a solid structure (300), comprising such a device (100), are also described.
Abstract:
The present invention relates to a flexible antenna for NFC communication with SIM card of a mobile device, comprising a RF pad for establishing radio communication with another device. Each projection extending from the RF pad comprises on its end a SIM pad with a different orientation with respect to the orientation of the other SIM pads on the other projections.
Abstract:
A switching circuit (30) is described being inserted between a connection terminal (Xdcr) and an output terminal (LVout) of a transmission channel (1) and of the type comprising at least one first and one second switching transistor (MSW1, MSW2) which are high voltage MOS transistors of complementary type inserted, in series to each other and by having respective equivalent or body diodes (DSW1, DSW2) in anti-series, between the connection terminal (Xdcr) and the output terminal (LVout). Advantageously according to the invention, the switching circuit comprises at least one bootstrap circuit (31) connected to respective first and second control terminals (XG1, XG2) of these at least one first and one second switching transistor (MSW1, MSW2), as well as to respective first and second voltage references (VDD_P, VDD_M) and having values of parasite capacities between these first and second control terminals (XG1, XG2) and at least one first and one second bootstrap node (XB1, XB2) of at least one order of magnitude lower with respect to the gate-source capacities (Csw1, Csw2) of these at least one first and one second switching transistor (MSW1, MSW2).
Abstract:
A low voltage isolation switch (1) is described, inserted between an input terminal (HVout) suitable for receiving a high voltage signal (IM) and an output terminal (pzt) suitable for transmitting this high voltage signal (IM) to a load (PZ) of the type comprising at least one driving block (5) being inserted between a first and a second voltage reference (Vss, -Vss) and comprising a first driving transistor (M1), inserted, in series to a first driving diode (D1), between the first voltage reference (Vss) and a first driving central circuit node (Xd) and a second driving transistor (M2), in turn inserted, in series with a second driving diode (D2), between the driving central circuit node (Xd) and the second supply voltage reference (-Vss) as well as a control transistor (MD) connected across a diode block (7) comprising at least one first and one second transmission diode (DN1, DN2), connected in antiparallel, i.e. by having the anode terminal of the first diode connected to the cathode terminal of the second one and vice versa, between the input (HVout) and output (pzt) terminals of the low voltage isolation switch (1), this control transistor (MD) having a control terminal connected to the driving central circuit node (Xd) through a low voltage decoupling block (6), in turn inserted between a first and a second substrate terminal (SS1, SS2) and also comprising a first and a second parasite capacitive element (Par1, Par2) connected to these first and second substrate terminals (SS1, SS2) as well as comprising at least one first decoupling transistor (M3) and one second decoupling transistor inserted (M4), being in parallel to each other and having control terminals connected to the first and second parasite capacitive elements (Par1, Par2), respectively.
Abstract:
Bistable carbazole compounds of formula (I) are described, wherein M is Fe, Co, Ru or Os, preferably Fe, useful as basic functional units for computing systems based on the QCA (Quantum Cellular Automata) paradigm; a process for their preparation is also described.
Abstract:
An integrated buffer device (2) for a switched capacity circuit is described, comprising: - a buffer (7) having an output (OUT) for an output voltage dependent upon an input voltage (VIN) that can be supplied by a source (1) to the buffer device; - a capacitative switching component (C I ) that can be switched between a first and second condition in which it is connected, respectively, to the source and to the buffer to transfer the input voltage onto the output; said component being provided with a terminal (N2) having an associated stray capacity (C pi ). The device also comprises a charging and discharging device (SW CPIR , SW G ) configured to pre- charge the stray capacity at a reference voltage (REFM) before taking up the second condition and to pre-discharge the stray capacity before taking up the first condition.
Abstract:
In a microfluidic assembly (20), a microfluidic device (I1) is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (I1) . The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10')/ adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.
Abstract:
Described herein is a process for manufacturing an interaction structure for a storage medium, which envisages forming a first interaction head provided with a first conductive region having a sub-lithographic smaller dimension (W 1 ). The step of forming a first interaction head (7) envisages: forming on a surface (14) a first delimitation region (15) having a side wall; depositing a conductive portion (16b) having a deposition thickness substantially matching the sub- lithographic smaller dimension (W 1 ) on the side wall; and then defining the conductive portion. The sub- lithographic smaller dimension (W 1 ) is between 1 and 50 nm, preferably 20 nm.