公开(公告)号：WO2007032032A1

公开(公告)日：2007-03-22

申请号：PCT/IT2005/000529

申请日：2005-09-16

Applicant: STMICROELECTRONICS S.R.L. ,  MURARI, Bruno ,  RICOTTI, Giulio ,  DELLA TORRE, Luigi ,  VITALI, Andrea, Lorenzo

Inventor： MURARI, Bruno ,  RICOTTI, Giulio ,  DELLA TORRE, Luigi ,  VITALI, Andrea, Lorenzo

IPC: G01L1/02 ,  G01L9/00

CPC classification number: G01L9/0054 ,  G01L1/02 ,  G01L5/225 ,  G01L9/0045 ,  G01L9/0089 ,  G01L19/0645 ,  G01L19/146

Abstract: In a pressure sensor (35) , a pressure-sensor element (10) has a monolithic body (12) of semiconductor material, and a first main face (12a) and a second main face (12b) acting on which is a stress resulting from a pressure (P) the value of which is to be determined; and a package (36) encloses the pressure­sensor element (10) . The package (36) has an inner chamber (37) containing liquid material (38), and the -ores sure-sensor element (10) is arranged within the inner chamber (37) in such a manner that the first and second main faces (12a, 12b) are both in contact with the liquid material (38). In particular, the liquid material is a silicone gel.

Abstract translation: 在压力传感器（35）中，压力传感器元件（10）具有半导体材料的整体（12），并且作用于其上的应力产生的第一主面（12a）和第二主面（12b） 从压力（P）来确定其值; 并且包装（36）包围所述压力传感器元件（10）。 包装（36）具有容纳液体材料（38）的内部室（37），并且 - 确定传感器元件（10）以这样的方式设置在内部室（37）内，使得第一和第二主要面 （12a，12b）都与液体材料（38）接触。 特别地，液体材料是硅胶。

公开(公告)号：WO2008120256A1

公开(公告)日：2008-10-09

申请号：PCT/IT2007/000252

申请日：2007-04-03

Applicant: STMICROELECTRONICS S.R.L. ,  MURARI, Bruno ,  MASTROMATTEO, Ubaldo ,  RICOTTI, Giulio

Inventor： MURARI, Bruno ,  MASTROMATTEO, Ubaldo ,  RICOTTI, Giulio

IPC: H02N1/00

CPC classification number: H02N1/006

Abstract: An electrostatic micromotor (10') is provided with a fixed substrate (12), a mobile substrate (13) facing the fixed substrate (12), and electrostatic-interaction elements (14, 15, 17) enabling a relative movement of the mobile substrate (3) with respect to the fixed substrate (2) in a movement direction (x); the electrostatic micromotor is also provided with a capacitive position-sensing structure (18') configured to enable sensing of a relative position of the mobile substrate (13) with respect to the fixed substrate (12) in the movement direction (x). The capacitive position-sensing structure (18') is formed by at least one sensing indentation (22), extending within the mobile substrate (13) from a first surface (13a; 13b) thereof, and by at least one first sensing electrode (24), facing, in at least one given operating condition, the sensing indentation (22).

Abstract translation: 静电微电机（10'）设置有固定基板（12），面向固定基板（12）的移动基板（13）和静电相互作用元件（14,15,17），其能够使移动体 基板（3）相对于固定基板（2）在移动方向（x）上移动; 静电微型电动机还设置有电容位置感测结构（18'），其被配置为能够在移动方向（x）上感测移动衬底（13）相对于固定衬底（12）的相对位置。 电容式位置感测结构（18'）由至少一个感测压痕（22）形成，其从移动衬底（13）的第一表面（13a; 13b）延伸，并由至少一个第一感测电极 在至少一个给定的操作条件下面对感测缩进（22）。

公开(公告)号：WO2012084295A1

公开(公告)日：2012-06-28

申请号：PCT/EP2011/068359

申请日：2011-10-20

Applicant: STMICROELECTRONICS S.R.L. ,  PAGANI, Alberto ,  MURARI, Bruno

Inventor： PAGANI, Alberto ,  MURARI, Bruno

IPC: G01N27/20 ,  G01N33/38 ,  G01L1/18

CPC classification number: G01N27/00 ,  G01L1/26 ,  G01M5/0083

Abstract: Device (100) for detecting and monitoring local parameters within a solid structure (300). The device comprises an integrated detection module (1) made on a single chip, having an integrated functional circuitry portion (16) comprising at least one integrated sensor (10) and an integrated antenna (11), and electromagnetic means (2) for transmitting/receiving signals and energy exchange. The integrated functional circuitry portion (16) comprises a functional surface (18) facing towards the outside of the chip. A passivation layer (15) is arranged to completely cover at least the functional surface (18), so that the integrated detection module (1) is entirely hermetically sealed and galvanically insulated from the surrounding environment. The integrated antenna (11), the electromagnetic means (2) and the remote antenna (221) are operatively connected wirelessly through magnetic or electromagnetic coupling.

Abstract translation: 用于检测和监测固体结构（300）内的局部参数的装置（100）。 该装置包括在单个芯片上制成的集成检测模块（1），其具有包括至少一个集成传感器（10）和集成天线（11）的集成功能电路部分（16），以及电磁装置（2） /接收信号和能量交换。 集成功能电路部分（16）包括面向芯片外部的功能表面（18）。 钝化层（15）布置成完全覆盖至少功能表面（18），使得集成检测模块（1）完全被气密密封并与周围环境电隔离。 集成天线（11），电磁装置（2）和远程天线（221）通过磁或电磁耦合无线地可操作地连接。

公开(公告)号：WO2014155348A1

公开(公告)日：2014-10-02

申请号：PCT/IB2014/060249

申请日：2014-03-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： PAGANI, Alberto ,  MURARI, Bruno

IPC: G01N27/22

CPC classification number: G01N27/223 ,  G01N17/04

Abstract: An integrated electronic device 1 for detecting at least one parameter related to humidity and/or presence of water and/or acidity/basicity of an environment surrounding the device is described. Such device 1 comprises a separation layer 14 from the surrounding environment, comprising at least one portion of insulating material 14, and further comprises a first conductive member 11 and a second conductive member 12, made of an electrically conductive material, arranged inside the separation layer 14, with respect to the surrounding environment, and separated from the surrounding environment by the separation layer 14. The device 1 also comprises a measurement module 15, having two measurement terminals 151, 152, electrically connected with the first 11 and the second 12 conductive members, respectively; the measurement module 15 is configured to provide an electric potential difference between the first 11 and the second 12 conductive members. The device 1 further comprises electrode means 13, configured to act as an electrode, arranged outside of the separation layer 14, with respect to the first 11 and the second 12 conductive members; the electrode means 13 are arranged so as to form, with the first 11 and the second 12 conductive members, an electromagnetic circuit having an electromagnetic circuit overall impedance variable based upon the exposure to environmental conditions with a variable level of humidity and/or acidity/basicity. The measurement module 15 is configured to measure the electromagnetic circuit overall impedance, which is present between the measurement terminals 151, 152, and to determine the at least one parameter to be detected, based on the overall impedance measured.

Abstract translation: 描述了用于检测与湿度和/或水的存在和/或设备周围环境的酸度/碱度相关的至少一个参数的集成电子设备1。 这种装置1包括与周围环境的分离层14，其包括绝缘材料14的至少一部分，并且还包括布置在分离层内部的由导电材料制成的第一导电构件11和第二导电构件12 14，相对于周围环境，并且通过分离层14与周围环境分离。装置1还包括测量模块15，其具有两个测量端子151,152，与第一11和第二导电12电连接 成员分别; 测量模块15被配置为提供第一11和第二导电构件12之间的电位差。 装置1还包括电极装置13，其被配置为相对于第一11和第二导电构件作为布置在分离层14外侧的电极; 电极装置13被布置成与第一11和第二12导电构件形成电磁电路，该电磁电路具有基于暴露于具有可变湿度和/或酸度/湿度的环境条件的总体阻抗变化， 碱性。 测量模块15被配置为基于测量的总阻抗来测量存在于测量端子151,152之间的电磁回路总阻抗，并且确定要检测的至少一个参数。

公开(公告)号：WO2013174946A1

公开(公告)日：2013-11-28

申请号：PCT/EP2013/060669

申请日：2013-05-23

Applicant: STMICROELECTRONICS S.R.L.

Inventor： PAGANI, Alberto ,  MURARI, Bruno ,  ZIGLIOLI, Federico Giovanni ,  RONCHI, Marco ,  RICOTTI, Giulio

IPC: G01D11/24 ,  G01M5/00

CPC classification number: G01D11/245 ,  B28B23/0031 ,  G01K17/00 ,  G01L1/18 ,  G01M5/00 ,  G01N33/383

Abstract: A package (15) for devices (100) insertable into a solid structure (300) for detecting and monitoring one or more local parameters is described. The package (15) is made of a building material formed of particles of micrometric or sub-micrometric dimensions. A device (100) for detecting and monitoring one or more local parameters within a solid structure is further described. The device (100) comprises an integrated detection module (1), having at least one integrated sensor (10), and a package (15), having the above-mentioned characteristics, so arranged as to coat at least one portion of the device (100), comprising the integrated detection module (1). A method for manufacturing the device (100), and a system (200) for monitoring parameters in a solid structure (300), comprising such a device (100), are also described.

Abstract translation: 描述了可插入到用于检测和监视一个或多个局部参数的实体结构（300）中的装置（100）的封装（15）。 包装（15）由由微米或亚微米尺寸的颗粒形成的建筑材料制成。 进一步描述用于检测和监视固体结构内的一个或多个局部参数的装置（100）。 装置（100）包括具有至少一个集成传感器（10）的集成检测模块（1）和具有上述特征的封装（15），其被布置成涂覆该装置的至少一部分 （100），包括所述集成检测模块（1）。 还描述了用于制造装置的方法（100），以及用于监视包括这种装置（100）的实体结构（300）中的参数的系统（200）。

公开(公告)号：WO2007113878A1

公开(公告)日：2007-10-11

申请号：PCT/IT2006/000229

申请日：2006-04-06

Applicant: STMICROELECTRONICS S.R.L. ,  RIVA, Caterina ,  MURARI, Bruno ,  FRATTINI, Giovanni

Inventor： RIVA, Caterina ,  MURARI, Bruno ,  FRATTINI, Giovanni

IPC: G11B9/00

CPC classification number: G11B9/1409 ,  B82Y10/00 ,  G11B9/14

Abstract: Described herein is a process for manufacturing an interaction structure for a storage medium, which envisages forming a first interaction head provided with a first conductive region having a sub-lithographic smaller dimension (W 1 ). The step of forming a first interaction head (7) envisages: forming on a surface (14) a first delimitation region (15) having a side wall; depositing a conductive portion (16b) having a deposition thickness substantially matching the sub- lithographic smaller dimension (W 1 ) on the side wall; and then defining the conductive portion. The sub- lithographic smaller dimension (W 1 ) is between 1 and 50 nm, preferably 20 nm.

Abstract translation: 这里描述的是用于制造用于存储介质（4）的相互作用结构（6）的方法，其设想形成具有第二导电区域（22）的第一相互作用头部（7），所述第一导电区域具有次光刻尺寸较小（Wi） 。 形成第一相互作用头（7）的步骤设想：在表面（14）上形成具有侧壁（15b）的第一限定区域（15）; 在所述侧壁（15b）上沉积具有基本上与所述亚光刻较小尺寸（Wi）匹配的沉积厚度的导电部分（16b）; 然后限定导电部分。 亚光刻尺寸较小（Wi）在1至50nm之间，优选20nm。

公开(公告)号：EP3913681A3

公开(公告)日：2022-03-16

申请号：EP21174210.1

申请日：2021-05-17

Applicant: STMicroelectronics S.r.l.

Inventor： FERRARI, Paolo ,  VILLA, Flavio Francesco ,  ZULLINO, Lucia ,  NOMELLINI, Andrea ,  SEGHIZZI, Luca ,  ZANOTTI, Luca ,  SCOLARI, Martina ,  MURARI, Bruno

IPC: H01L27/16 ,  H01L35/22 ,  H01L35/34 ,  H01L31/052

Abstract: A method of fabricating a thermoelectric converter comprises: providing a layer (115; 215) of a Silicon-based material having a first surface and a second surface, opposite to and separated from the first surface by a Silicon-based material layer thickness; forming a plurality of first thermoelectrically active elements (133a; 237; 330a) of a first thermoelectric semiconductor material having a first Seebeck coefficient, and forming a plurality of second thermoelectrically active elements (133b; 249; 330b) of a second thermoelectric semiconductor material having a second Seebeck coefficient, wherein the first and second thermoelectrically active elements are formed to extend through the Silicon-based material layer (115; 215) thickness, from the first surface to the second surface; forming electrically conductive interconnections (143, 413; 257, 413) in correspondence of the first surface and of the second surface of the layer of Silicon-based material (115; 215),, for electrically interconnecting the plurality of first thermoelectrically active elements and the plurality of second thermoelectrically active elements, and forming an input electrical terminal (257') and an output electrical terminal (257") electrically connected to the electrically conductive interconnections, wherein the first thermoelectric semiconductor material and the second thermoelectric semiconductor material comprise Silicon-based materials selected among porous Silicon or polycrystalline SiGe or polycrystalline Silicon.

公开(公告)号：EP3205997B1

公开(公告)日：2019-06-19

申请号：EP17156382.8

申请日：2017-02-15

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  MURARI, Bruno ,  CONTI, Sebastiano

IPC: B81B7/00 ,  G01L19/06 ,  G01L9/00 ,  G01L15/00

公开(公告)号：EP3913681A2

公开(公告)日：2021-11-24

申请号：EP21174210.1

申请日：2021-05-17

Applicant: STMicroelectronics S.r.l.

Inventor： FERRARI, Paolo ,  VILLA, Flavio Francesco ,  ZULLINO, Lucia ,  NOMELLINI, Andrea ,  SEGHIZZI, Luca ,  ZANOTTI, Luca ,  SCOLARI, Martina ,  MURARI, Bruno

IPC: H01L27/16 ,  H01L35/22 ,  H01L35/34 ,  H01L31/052

Abstract: A method of fabricating a thermoelectric converter comprises: providing a layer (115; 215) of a Silicon-based material having a first surface and a second surface, opposite to and separated from the first surface by a Silicon-based material layer thickness; forming a plurality of first thermoelectrically active elements (133a; 237; 330a) of a first thermoelectric semiconductor material having a first Seebeck coefficient, and forming a plurality of second thermoelectrically active elements (133b; 249; 330b) of a second thermoelectric semiconductor material having a second Seebeck coefficient, wherein the first and second thermoelectrically active elements are formed to extend through the Silicon-based material layer (115; 215) thickness, from the first surface to the second surface; forming electrically conductive interconnections (143, 413; 257, 413) in correspondence of the first surface and of the second surface of the layer of Silicon-based material (115; 215),, for electrically interconnecting the plurality of first thermoelectrically active elements and the plurality of second thermoelectrically active elements, and forming an input electrical terminal (257') and an output electrical terminal (257") electrically connected to the electrically conductive interconnections, wherein the first thermoelectric semiconductor material and the second thermoelectric semiconductor material comprise Silicon-based materials selected among porous Silicon or polycrystalline SiGe or polycrystalline Silicon.

公开(公告)号：EP3252449A1

公开(公告)日：2017-12-06

申请号：EP16206884.5

申请日：2016-12-23

Applicant: STMicroelectronics S.r.l.

Inventor： CALTABIANO, Daniele ,  ABBASI GAVARTI, Mohammad ,  MURARI, Bruno ,  BRIOSCHI, Roberto ,  GIUSTI, Domenico

IPC: G01L9/00 ,  G01L1/04

Abstract: A load-sensing device (10), arranged in a package (12) forming a chamber (24). The package (12) has a deformable substrate (21) configured, in use, to be deformed by an external force. A sensor unit (11) is in direct contact with the deformable substrate (21) and is configured to detect deformations of the deformable substrate. An elastic element (15) is arranged within of the chamber (24) and acts between the package (12) and the sensor unit (11) to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. For example, the deformable substrate is a base (21) of the package (12), and the elastic element is a metal lamina (15) arranged between the lid (22) of the package (12) and the sensor unit (11). The sensor unit (11) may be a semiconductor die integrating piezoresistors.

Abstract translation: 负载感测装置（10），其布置在形成腔室（24）的包装（12）中。 包装（12）具有可变形的基底（21），该基底在使用中被配置为通过外力而变形。 传感器单元（11）与可变形基板（21）直接接触并且被配置为检测可变形基板的变形。 弹性元件（15）布置在腔室（24）内并且作用在封装（12）和传感器单元（11）之间，以在传感器单元上​​产生保持传感器单元与可变形基底 。 例如，可变形衬底是封装（12）的基座（21），并且弹性元件是布置在封装（12）的盖（22）和传感器单元（11）之间的金属薄片（15） 。 传感器单元（11）可以是集成压敏电阻器的半导体管芯。