公开(公告)号：US08211751B2

公开(公告)日：2012-07-03

申请号：US12810279

申请日：2008-12-12

Applicant: Satoshi Yamamoto ,  Hirokazu Hashimoto

Inventor： Satoshi Yamamoto ,  Hirokazu Hashimoto

IPC: H01L21/50

CPC classification number: B81C1/00317 ,  B81C2201/0104 ,  B81C2201/0108 ,  B81C2201/0125 ,  B81C2203/0118 ,  B81C2203/0145 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process.

Abstract translation: 一种制造半导体器件的方法包括：将具有光学透明性的第一衬底和第二衬底接合的接合步骤，其中功能元件彼此设置在其上，使得功能元件面向第一衬底; 减薄所述第一和第二基板中的至少一个的薄化步骤; 以及通孔形成步骤，在第一和第二基板之间的接合部分的至少一部分中形成与空腔连通的空腔和通孔。 根据本发明，可以防止由于空腔的存在或不存在引起的不规则或裂纹，并且更规则地使基板变薄。 此外，可以使用更方便的工艺来制造能够有助于具有该器件的器件和电子设备的小型化的半导体器件。

公开(公告)号：US20120043649A1

公开(公告)日：2012-02-23

申请号：US13202951

申请日：2010-02-24

Applicant: Abdennour Abbas ,  Didier Guillochon ,  Bertrand Bocquet ,  Philippe Supiot

Inventor： Abdennour Abbas ,  Didier Guillochon ,  Bertrand Bocquet ,  Philippe Supiot

IPC: H01L21/02 ,  H01L29/02

CPC classification number: B81C1/00071 ,  B81B2201/0214 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C2201/0108 ,  B81C2201/018

Abstract: The present invention relates to a process for fabricating microchannels on a substrate and to a substrate comprising these microchannels, the invention being especially applicable to the fabrication of microstructured substrates for microelectronic, microfluidic and/or micromechanical systems.The process includes a step (a) of producing at least one or at least two patterns 2 on the surface of a bottom layer 1 and a step (b) of depositing, on top of the bottom layer and the pattern or patterns, a layer 3 of polymer material obtained by polymerizing an organic or organometallic monomer that contains siloxane functional groups, for example tetramethyldisiloxane, in a plasma-enhanced, optionally remote plasma-enhanced, chemical vapor deposition reactor (PECVD or optionally RPECVD) reactor.The layer of polymer material is deposited so as to create, in place of the pattern and after development by decomposing this pattern, or between the two patterns without development/decomposition, a channel 4a, 4b, 4c, 4d closed over at least part of its length.

Abstract translation: 本发明涉及一种用于在衬底上制造微通道的方法以及包括这些微通道的衬底，本发明特别适用于微电子，微流体和/或微机械系统的微结构化衬底的制造。 该方法包括在底层1的表面上产生至少一个或至少两个图案2的步骤（a）和在底层和图案或图案的顶部上沉积层（b）的步骤 通过聚合含有硅氧烷官能团的有机或有机金属单体（例如四甲基二硅氧烷）在等离子体增强的，任选地远程等离子体增强的化学气相沉积反应器（PECVD或任选的RPECVD）反应器中获得的聚合物材料3。 沉积聚合物材料层，以通过分解该图案或在两个图案之间或不在显影/分解下产生代替图案和显影之后，通道4a，4b，4c，4d在至少部分 它的长度。

公开(公告)号：US07923194B2

公开(公告)日：2011-04-12

申请号：US12273114

申请日：2008-11-18

Applicant: Paul A. Kohl ,  Paul J. Joseph ,  Hollie K. Reed ,  Sue Ann Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

Inventor： Paul A. Kohl ,  Paul J. Joseph ,  Hollie K. Reed ,  Sue Ann Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

IPC: G03F7/00 ,  G03F7/004 ,  G03F7/20 ,  G03F7/26

CPC classification number: B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

Abstract: Compositions, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary composition, among others, includes a polymer and a catalytic amount of a negative tone photoinitiator.

Abstract translation: 提供了组合物，其使用方法及其分解方法。 一个示例性组合物，其中包括聚合物和催化量的负色调光引发剂。

公开(公告)号：US20100307786A1

公开(公告)日：2010-12-09

申请号：US12797649

申请日：2010-06-10

Applicant: Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

Inventor： Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

IPC: H05K5/06

CPC classification number: B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among others, includes a micro electro-mechanical device formed on a substrate layer; and a thermally decomposable sacrificial structure protecting at least a portion of the micro electro-mechanical device, where the sacrificial structure is formed on the substrate layer and surrounds a gas cavity enclosing an active surface of the micro electro-mechanical device. Other systems and methods are also provided.

Abstract translation: 本公开的实施例提供了用于生产微机电装置包装的系统和方法。 简要描述，在架构中，系统的一个实施例包括形成在基底层上的微电子机械装置; 以及可热分解的牺牲结构，其保护所述微机电装置的至少一部分，其中所述牺牲结构形成在所述基底层上并且围绕包围所述微机电装置的有效表面的气体腔。 还提供了其他系统和方法。

公开(公告)号：US07799516B2

公开(公告)日：2010-09-21

申请号：US10686697

申请日：2003-10-16

Applicant: Paul A. Kohl ,  SueAnn Bidstrup Allen ,  Xiaoqun Wu ,  Clifford Lee Henderson

Inventor： Paul A. Kohl ,  SueAnn Bidstrup Allen ,  Xiaoqun Wu ,  Clifford Lee Henderson

IPC: G03F7/40 ,  G03F7/20 ,  G03F7/30 ,  G03F7/36

CPC classification number: G03F7/004 ,  B81B2201/058 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C1/00103 ,  B81C2201/0108 ,  C08J3/28 ,  C08K5/0041 ,  G03F7/40 ,  Y10T428/24479

Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.

Abstract translation: 提供聚合物，其使用方法及其分解方法。 一个示例性聚合物，其中包括具有牺牲聚合物和光引发剂的光可定义聚合物。

公开(公告)号：US07795061B2

公开(公告)日：2010-09-14

申请号：US11321134

申请日：2005-12-29

Applicant: Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

Inventor： Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

IPC: H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/047 ,  B81C2201/0108 ,  B81C2201/0111 ,  G02B26/001

Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.

Abstract translation: 可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。 一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电 导电层。 另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体 在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电 导电层和第二导电层。

公开(公告)号：US20100062142A1

公开(公告)日：2010-03-11

申请号：US12348589

申请日：2009-01-05

Applicant: Mingwei Zhu ,  Yanfeng Chen ,  Zhenlin Wang ,  Yanqing Lu ,  Haixiong Ge ,  Yuefeng Tang

Inventor： Mingwei Zhu ,  Yanfeng Chen ,  Zhenlin Wang ,  Yanqing Lu ,  Haixiong Ge ,  Yuefeng Tang

IPC: B05D3/00

CPC classification number: B81C1/00476 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055 ,  B81B2203/0338 ,  B81B2203/0361 ,  B81C2201/0108

Abstract: A novel method suitable for commercially mass production of hollow microneedle with high quality for delivery of drugs across or into biological tissue is provided. It typically includes the following processes: (1) coating an elongated template of a first material with a second material to form a cover; (2) removing tips of the template and cover to form an opening in the cover; and (3) removing the template of the first material to obtain hollow microneedles of the second material. This simple, efficient and cost-effective fabrication method can mass produce hollow microneedle arrays involving no complicated and expensive equipments or techniques, which can be used in commercial fabrication of hollow needles for delivering drugs or genes across or into skin or other tissue barriers with advantages of minimal damage, painless, long-term and continuous usages.

Abstract translation: 提供了一种适用于商业上大规模生产用于将药物跨越或进入生物组织的高品质的中空微针的新方法。 它通常包括以下过程：（1）用第二材料涂覆第一材料的细长模板以形成盖子; （2）去除模板和盖子的尖端以在盖子上形成开口; 和（3）去除第一材料的模板以获得第二材料的中空微针。 这种简单，高效和成本有效的制造方法可以大规模生产中空微针阵列，其不涉及复杂而昂贵的设备或技术，其可用于商业制造用于将药物或基因跨越或进入皮肤或其它组织屏障的中空针 最小的伤害，无痛，长期和持续的使用。

公开(公告)号：US20090236310A1

公开(公告)日：2009-09-24

申请号：US11918269

申请日：2006-04-14

Applicant: Vincent Linder ,  Byron Gates ,  Declan Ryan ,  Babak Amirparviz ,  George M. Whitesides

Inventor： Vincent Linder ,  Byron Gates ,  Declan Ryan ,  Babak Amirparviz ,  George M. Whitesides

IPC: B44C1/22

CPC classification number: B81C1/00246 ,  B81C2201/0108 ,  B81C2203/0735 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: The present invention provides fabrication methods using sacrificial materials comprising polymers. In some embodiments, the polymer may be treated to alter its solubility with respect to at least one solvent (e.g., aqueous solution) used in the fabrication process. The preparation of the sacrificial materials is rapid and simple, and dissolution of the sacrificial material can be carried out in mild environments. Sacrificial materials of the present invention may be useful for surface micromachining, bulk micromachining, and other microfabrication processes in which a sacrificial layer is employed for producing a selected and corresponding physical structure.

Abstract translation: 本发明提供了使用包含聚合物的牺牲材料的制造方法。 在一些实施方案中，可以处理聚合物以改变其相对于在制造过程中使用的至少一种溶剂（例如水溶液）的溶解度。 牺牲材料的制备是快速和简单的，牺牲材料的溶解可以在温和的环境中进行。 本发明的牺牲材料可用于表面微加工，体微加工和其它微加工工艺，其中牺牲层用于产生选定的和相应的物理结构。

公开(公告)号：US20080200029A1

公开(公告)日：2008-08-21

申请号：US12001330

申请日：2007-12-10

Applicant: Joontae Song ,  Hyunsuk Hwang

Inventor： Joontae Song ,  Hyunsuk Hwang

IPC: H01L21/44 ,  H01L21/311

CPC classification number: B81C1/00944 ,  B81C2201/0108

Abstract: Provided is a method of fabricating a microstructure, and more specifically, a method of fabricating a structure of a Micro Electro Mechanical System (MEMS), which includes the step of applying and patterning a material for the sacrificial layer on a silicon substrate, and forming a post with the same material as the sacrificial layer material, so that a stiction problem can be prevented in advance at the time of fabricating the microstructure, only one process needs to be added to simplify fabrication of a post, and the sacrificial layer can be formed in a desired shape because a photoresist is used as the sacrificial layer material.

Abstract translation: 提供一种制造微结构的方法，更具体地说，一种制造微机电系统（MEMS）的结构的方法，其包括在硅衬底上施加和图案化用于牺牲层的材料的步骤，并且形成 具有与牺牲层材料相同的材料的柱，使得在制造微结构时可以预先防止静电问题，仅需要添加一个工艺以简化柱的制造，并且牺牲层可以是 形成为期望的形状，因为光致抗蚀剂被用作牺牲层材料。

公开(公告)号：US07365019B2

公开(公告)日：2008-04-29

申请号：US11203524

申请日：2005-08-12

Applicant: Lynn David Bollinger ,  Iskander Tokmouline

Inventor： Lynn David Bollinger ,  Iskander Tokmouline

IPC: H01L21/306

CPC classification number: H01L21/31138 ,  B81B2203/0353 ,  B81C1/00476 ,  B81C1/00619 ,  B81C99/0025 ,  B81C2201/0108 ,  B81C2201/0132 ,  G03F7/427 ,  H01J37/32055 ,  H01J37/32825 ,  H01L21/02057 ,  H01L21/02063 ,  H05H1/42 ,  H05H2240/10 ,  H05H2245/123

Abstract: A system that generates an intense hot gas stream is described to etch a polymer on a substrate used in the manufacture of semiconductor and MEMS devices with no surface damage. The etching process is particularly useful to remove a polymer from relatively high aspect Height-to-Width and Width-to-Height ratio holes that can include trenches, having relatively large aspect ratios for removal of polymers used in connection with the manufacturing of microstructures.

Abstract translation: 描述了产生强烈热气流的系统来蚀刻用于制造半导体和MEMS器件的衬底上的聚合物，其没有表面损伤。 蚀刻工艺特别适用于从相对较高的方面的高度 - 宽度和宽度 - 高度比的孔中除去聚合物，该孔可以包括沟槽，具有相对较大的纵横比用于去除与微结构制造有关的聚合物。