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    Wiring board and method of manufacturing the same
    122.
    发明授权
    Wiring board and method of manufacturing the same 有权
    接线板及其制造方法

    公开(公告)号：US09237649B2

    公开(公告)日：2016-01-12

    申请号：US14285733

    申请日：2014-05-23

    Applicant: KYOCERA SLC Technologies Corporation

    Inventor： Hidetoshi Yugawa

    IPC: H05K1/11 ,  H05K3/00 ,  H05K1/03 ,  H05K3/42 ,  H05K3/46

    CPC classification number: H05K1/115 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09854 ,  H05K2201/2054 ,  H05K2201/2072 ,  H05K2203/1476

    Abstract: A wiring board 10 includes a lower wiring conductor 1, an upper insulating layer 2 laminated on the lower wiring conductor 1 and having a via hole 5 where a bottom surface is the lower wiring conductor 1, and a via conductor 3 connected to the lower wiring conductor 1 and filling the via hole 5; and the upper insulating layer 2 includes a first resin layer 2a and a second resin layer 2b sequentially laminated on the lower wiring conductor 1, the via hole 5 has an annular groove 5a over a whole circumference of the inner wall in a boundary between both resin layers 2a and 2b, and the via conductor 3 fills the groove 5.

    Abstract translation: 布线基板10具有：下布线导体1，层叠在下布线导体1上的上绝缘层2，底面是下布线导体1的通路孔5;以及与下布线 导体1并填充通孔5; 并且上绝缘层2包括顺序地层叠在下布线导体1上的第一树脂层2a和第二树脂层2b，通孔5在两个树脂之间的边界内的内壁的整个圆周上具有环形槽5a 层2a和2b，通孔导体3填充槽5。

    WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACTURING WIRING BOARD
    124.
    发明申请
    WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACTURING WIRING BOARD 有权
    接线板，使用其的安装结构以及制造接线板的方法

    公开(公告)号：US20150037611A1

    公开(公告)日：2015-02-05

    申请号：US14380207

    申请日：2013-02-20

    Applicant: KYOCERA Corporation

    Inventor： Tadashi Nagasawa ,  Katsura Hayashi

    IPC: H05K1/03 ,  H05K3/46

    CPC classification number: H05K1/036 ,  H05K3/3436 ,  H05K3/4602 ,  H05K3/4661 ,  H05K3/467 ,  H05K3/4673 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068

    Abstract: A wiring board (3) according to an embodiment of the present invention includes an inorganic insulating layer (11A); a first resin layer (12A) on one main surface of the inorganic insulating layer (11A); a second resin layer (13A) on another main surface of the inorganic insulating layer (11A); and a conductive layer (8) partially on one main surface of the second resin layer (13A), the one main surface being on an opposite side to the inorganic insulating layer (11A). The inorganic insulating layer (11A) includes a plurality of first inorganic insulating particles (14) which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles (14). A part of the first resin layer (12A) and a part of the second resin layer (13A) are located inside the gaps (G).

    Abstract translation: 根据本发明实施例的布线板（3）包括无机绝缘层（11A）; 在无机绝缘层（11A）的一个主表面上的第一树脂层（12A）; 在无机绝缘层（11A）的另一个主表面上的第二树脂层（13A）; 以及部分地在所述第二树脂层（13A）的一个主表面上的导电层（8），所述一个主表面与所述无机绝缘层（11A）相反。 无机绝缘层（11A）包括多个第一无机绝缘粒子（14），它们在由多个第一无机绝缘粒子包围的第一无机绝缘粒子和间隙（G）的一部分彼此结合 14）。 第一树脂层（12A）的一部分和第二树脂层（13A）的一部分位于间隙（G）的内部。

    CONDUCTIVE PATTERN, METHOD FOR FORMING THE SAME, PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF THE SAME
    126.
    发明申请
    CONDUCTIVE PATTERN, METHOD FOR FORMING THE SAME, PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF THE SAME 审中-公开
    导电图案，其形成方法，印刷线路板及其制造方法

    公开(公告)号：US20140161971A1

    公开(公告)日：2014-06-12

    申请号：US14183379

    申请日：2014-02-18

    Applicant: FUJIFILM CORPORATION

    Inventor： Seishi KASAI

    IPC: C09D11/00

    CPC classification number: C09D11/52 ,  B41M5/0023 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0269 ,  H05K2203/1476

    Abstract: A forming method of a conductive pattern including a base material and a pattern of a composition gradient layer in which the composition continuously changes from a metal to a resin in a thickness direction from the farthest side to the base material toward the nearest side to the base material, includes: ejecting at least two kinds of ink compositions of an ink composition containing a metal and an ink composition containing a compound capable of being cured with active energy ray, or a polymer or oligomer, onto the base material by an inkjet method to fabricate the composition gradient layer.

    Abstract translation: 一种导电图案的形成方法，其包括基材和组合物梯度层的图案，其中组合物从最远侧到基底至最靠近基底的从金属到树脂在厚度方向上连续变化 材料包括：通过喷墨方法将含有金属的油墨组合物和含有能够用活性能量射线固化的化合物或聚合物或低聚物的油墨组合物的至少两种油墨组合物喷射到基材上 制作组成梯度层。

    LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR
    127.
    发明申请
    LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR 审中-公开
    使用的层状结构和感光干膜

    公开(公告)号：US20120301825A1

    公开(公告)日：2012-11-29

    申请号：US13569715

    申请日：2012-08-08

    Applicant: Takahiro YOSHIDA ,  Shouji Minegishi ,  Masao Arima

    Inventor： Takahiro YOSHIDA ,  Shouji Minegishi ,  Masao Arima

    IPC: G03F7/004

    CPC classification number: G03F7/095 ,  G03F7/0047 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269

    Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is lower in a surface layer region away from the substrate than in other region, so that a linear thermal expansion coefficient of the layer as a whole is maintained as low as possible. Preferably, the photosensitive resin layer or cured film layer comprises at least two layers having different inorganic filler contents, wherein the inorganic filler content in the layer on the surface side away from the substrate is lower than the inorganic filler content in the other layer. A photosensitive dry film containing the photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.

    Abstract translation: 在至少具有基板和形成在基板上并含有无机填料的感光性树脂层或固化膜层的分层结构中，感光性树脂层或固化膜层中的无机填料的含量在表面层区域 远离衬底而不是在其他区域，使得整个层的线性热膨胀系数保持尽可能低。 优选地，感光性树脂层或固化膜层包含至少两层具有不同无机填料含量的层，其中离开基材的表面侧的层中的无机填料含量低于另一层中的无机填料含量。 含有感光性树脂层的感光性干膜适合用作印刷电路板的阻焊剂或层间树脂绝缘层。

    Multilayer ceramic substrate
    130.
    发明授权
    Multilayer ceramic substrate 有权
    多层陶瓷基板

    公开(公告)号：US08053682B2

    公开(公告)日：2011-11-08

    申请号：US12467542

    申请日：2009-05-18

    Applicant: Yun Hwi Park ,  Bong Gyun Kim ,  Yoon Hyuck Choi

    Inventor： Yun Hwi Park ,  Bong Gyun Kim ,  Yoon Hyuck Choi

    IPC: H05K1/11

    CPC classification number: H05K3/4061 ,  H05K1/0242 ,  H05K3/4629 ,  H05K2201/0269 ,  H05K2201/096 ,  H05K2203/082 ,  Y10T428/24322 ,  Y10T428/24926

    Abstract: There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.

    Abstract translation: 提供了一种包括能够防止导电性和信号损失的双层结构的导电通孔的多层陶瓷基板。 多层陶瓷基板包括：多个电介质层; 以及形成在所述电介质层的至少一部分上的电路图形部分，所述电路图形部分包括至少一个导电通路和导电图案，其中所述至少一个导电通孔包括外周部分和内周部分， 沿着贯穿电介质层的通路孔的内壁形成的周边部分，并且由包含金属的第一导电材料形成，并且内周部分填充在外周部分中，并由具有收缩起始温度的第二导电材料形成 高于第一导电材料的收缩起始温度。

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