公开(公告)号：US20180348259A1

公开(公告)日：2018-12-06

申请号：US16040621

申请日：2018-07-20

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John Knickerbocker ,  Yang Liu ,  Maurice Mason ,  Lubomyr T. Romankiw

IPC: G01R1/073 ,  H01L23/00 ,  B81C1/00 ,  G01R31/26 ,  B81B3/00 ,  B23K35/00

CPC classification number: G01R1/0735 ,  B23K35/00 ,  B81B3/00 ,  B81B2201/02 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81C1/00626 ,  G01R31/2607 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/73207 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01104

Abstract: A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.

公开(公告)号：US20180155187A1

公开(公告)日：2018-06-07

申请号：US15828044

申请日：2017-11-30

Applicant: SILICON INTEGRATED SYSTEMS CORP.

Inventor： Wen-Chi LIN ,  Ssu-Che YANG ,  Keng-Nan CHEN

IPC: B81B7/02 ,  G01P15/125 ,  B81B7/00 ,  B81C1/00 ,  G05F3/02 ,  H02M3/07 ,  G06G7/184

CPC classification number: B81B7/02 ,  B81B7/007 ,  B81B2201/02 ,  B81C1/00301 ,  G01N27/4148 ,  G01P15/125 ,  G05F3/02 ,  G06G7/184 ,  H02M3/073 ,  H03H9/1057

Abstract: A sensing device includes a MEMS sensor and an adjustable amplifier. The MEMS sensor is configured to generate an input signal according to environmental changes. The adjustable amplifier has a first input terminal, a second input terminal, a third input terminal, a fourth input terminal and a first output terminal. The first input terminal is electrically connected to the MEMS sensor for receiving the input signal. The second input terminal is electrically connected to a first signal terminal for receiving a first common-mode signal. The third input terminal is electrically connected to the first output terminal. The fourth input terminal is electrically connected to a second signal terminal. An electric potential of a first output signal output by the first output terminal of the adjustable amplifier is related to electric potentials of the input signal, the first signal terminal and the second signal terminal.

公开(公告)号：US09903718B2

公开(公告)日：2018-02-27

申请号：US14723676

申请日：2015-05-28

Applicant: InvenSense, Inc.

Inventor： Matthew J. Thompson ,  Ilya Gurin

IPC: G01C19/5762 ,  G01C19/5755 ,  B81B3/00

CPC classification number: G01C19/5755 ,  B81B3/0018 ,  B81B2201/02

Abstract: A system and/or method for utilizing mechanical motion limiters to control proof mass amplitude in MEMS devices (e.g., MEMS devices having resonant MEMS structures, for example various implementations of gyroscopes, magnetometers, accelerometers, etc.). As a non-limiting example, amplitude control for a MEMS gyroscope proof mass may be accomplished during normal (e.g., steady state) gyroscope operation utilizing impact stops (e.g., bump stops) of various designs. As another non-limiting example, amplitude control for a MEMS gyroscope proof mass may be accomplished utilizing non-impact limiters (e.g., springs) of various designs, for example springs exhibiting non-linear stiffness characteristics through at least a portion of their normal range of operation.

公开(公告)号：US20170363486A1

公开(公告)日：2017-12-21

申请号：US15534310

申请日：2015-12-09

Applicant: Paul D OKULOV

Inventor： Paul D OKULOV

IPC: G01L1/00 ,  G01L1/04 ,  G01M5/00

CPC classification number: G01L1/005 ,  B81B2201/02 ,  G01L1/04 ,  G01L1/044 ,  G01M5/0033 ,  G01M5/0083

Abstract: A low power consumption multi-contact micro electro-mechanical strain/displacement sensor and miniature autonomous self-contained systems for recording of stress and usage history with direct output suitable for fatigue and load spectrum analysis are provided. In aerospace applications the system can assist in prediction of fatigue of a component subject to mechanical stresses as well as in harmonizing maintenance and overhauls intervals. In alternative applications, i.e. civil structures, general machinery, marine and submarine vessels, etc., the system can autonomously record strain history, strain spectrum or maximum values of the strain over a prolonged period of time using an internal power supply or a power supply combined with an energy harvesting device. The sensor is based on MEMS technology and incorporates a micro array of flexible micro or nano-size cantilevers. The system can have extremely low power consumption while maintaining precision and temperature/humidify independence.

公开(公告)号：US09666787B2

公开(公告)日：2017-05-30

申请号：US14785903

申请日：2014-03-20

Applicant: SONY CORPORATION

Inventor： Hidetoshi Kabasawa ,  Hiroshi Ozaki ,  Kazuo Takahashi ,  Satoshi Mitani

IPC: H01L23/10 ,  H01L41/113 ,  G01C19/5783 ,  G01C19/5769 ,  G01L9/00 ,  H01L41/047 ,  H01L41/053 ,  B81B7/00 ,  B81C1/00 ,  H01L23/48 ,  H01L25/16 ,  H01L21/768

CPC classification number: H01L41/1132 ,  B81B7/008 ,  B81B2201/02 ,  B81B2207/012 ,  B81C1/00238 ,  G01C19/5769 ,  G01C19/5783 ,  G01L9/0073 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/162 ,  H01L41/0474 ,  H01L41/0533 ,  H01L41/113 ,  H01L41/1138 ,  H01L2224/16225

Abstract: A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.

公开(公告)号：US20170129772A1

公开(公告)日：2017-05-11

申请号：US15407676

申请日：2017-01-17

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHUN-WEN CHENG ,  YI-CHUAN TENG ,  CHENG-YU HSIEH ,  LEE-CHUAN TSENG ,  SHIH-CHANG LIU ,  SHIH-WEI LIN

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/008 ,  B81B3/0005 ,  B81B7/0041 ,  B81B2201/02 ,  B81B2207/012 ,  B81C1/00277 ,  B81C1/00293 ,  B81C2203/0145 ,  B81C2203/0172 ,  B81C2203/019 ,  B81C2203/0792 ,  H01L2224/11

Abstract: A semiconductor structure includes: a first device; a second device contacted with the first device, wherein a chamber is formed between the first device and the second device; a first hole disposed in the second device and defined between a first end with a first circumference and a second end with a second circumference; a second hole disposed in the second device and aligned to the first hole; and a sealing object for sealing the second hole. The first end links with the chamber, and the first circumference is different from the second circumference, the second hole is defined between the second end and a third end with a third circumference, and the second circumference and the third circumference are smaller than the first circumference.

公开(公告)号：US20170113918A1

公开(公告)日：2017-04-27

申请号：US15293147

申请日：2016-10-13

Applicant: Vmicro ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

Inventor： Benjamin WALTER ,  Marc FAUCHER

IPC: B81B3/00

CPC classification number: B81B3/0045 ,  B81B3/0021 ,  B81B3/0024 ,  B81B3/0086 ,  B81B2201/02 ,  B81B2201/031 ,  B81B2203/0118 ,  G01P15/123 ,  G01Q10/045 ,  G01Q20/04

Abstract: A microelectromechanical device comprising a mechanical structure extending along a longitudinal direction, linked to a planar substrate by an anchorage situated at one of its ends and able to flex in a plane parallel to the substrate, the mechanical structure comprises a joining portion, which links it to each anchorage and includes a resistive region exhibiting a first and second zone for injecting an electric current to form a resistive transducer, the resistive region extending in the longitudinal direction from an anchorage and arranged so a flexion of the mechanical structure in the plane parallel to the substrate induces a non-zero average strain in the resistive region and vice versa; wherein: the first injection zone is carried by the anchorage; and the second injection zone is carried by a conducting element not fixed to the substrate and extending in a direction, termed lateral, substantially perpendicular to the longitudinal direction.

公开(公告)号：US20160155927A1

公开(公告)日：2016-06-02

申请号：US14785903

申请日：2014-03-20

Applicant: SONY CORPORATION

Inventor： Hidetoshi KABASAWA ,  Hiroshi OZAKI ,  Kazuo TAKAHASHI ,  Satoshi MITANI

IPC: H01L41/113 ,  H01L41/047 ,  H01L41/053 ,  G01C19/5769

CPC classification number: H01L41/1132 ,  B81B7/008 ,  B81B2201/02 ,  B81B2207/012 ,  B81C1/00238 ,  G01C19/5769 ,  G01C19/5783 ,  G01L9/0073 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/162 ,  H01L41/0474 ,  H01L41/0533 ,  H01L41/113 ,  H01L41/1138 ,  H01L2224/16225

Abstract: A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.

Abstract translation: 提供了一种能够实现小型化和降低成本的传感器装置和电子设备。 根据本技术的实施例的传感器装置包括传感器元件和半导体元件。 半导体元件包括第一表面，第二表面和通孔。 第一表面包括第一端子，传感器元件安装在该第一端子上并且是非活动表面。 第二表面包括用于外部连接的第二端子，并且是活动表面。 通孔将第一表面和第二表面彼此电连接。

公开(公告)号：US20150311664A1

公开(公告)日：2015-10-29

申请号：US14541071

申请日：2014-11-13

Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

Inventor： Vladimir BULOVIC ,  Jeffrey Hastings LANG ,  Apoorva MURARKA ,  Annie I-Jen WANG ,  Wendi CHANG

IPC: H01S3/106 ,  H01S3/0941 ,  H01S3/07 ,  G02B26/00 ,  H01S3/16 ,  H01S3/13 ,  H01S3/105 ,  H01S3/0933 ,  H01S3/08

CPC classification number: H01S3/1053 ,  B81B2201/02 ,  B81B2201/042 ,  B81C1/00158 ,  B81C1/00634 ,  B81C2201/0194 ,  G01L1/24 ,  G01L9/0005 ,  G01L9/0072 ,  G01L11/02 ,  G02B26/001 ,  H01L29/84 ,  H01S3/07 ,  H01S3/08059 ,  H01S3/0933 ,  H01S3/094 ,  H01S3/0941 ,  H01S3/106 ,  H01S3/1305 ,  H01S3/16 ,  H01S3/1693

Abstract: The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.

Abstract translation: 本公开涉及在无溶剂环境中微机电系统（“MEMS”）的微接触印刷的方法和装置。 所公开的实施方案使得能够在聚对二甲苯层上形成复合膜并将复合结构转移到接收结构以形成由复合膜覆盖的一个或多个微腔。 聚对二甲苯膜的厚度可以在约100nm-2微米的范围内; 200nm-1微米，200-300nm，300-500nm，500nm至1微米和1-30微米。 接下来，在聚对二甲苯之上形成一个或多个二次层以产生复合膜。 复合膜可以具有约100nm至700nm至几微米的厚度。 可以测量复合膜的响应于外力的偏转，以提供无接触检测器。 相反，可以使用外部偏压来致动复合膜，以产生与施加的偏压相称的偏转。 所公开的实施例的应用包括可调激光器，麦克风，微型扬声器，远程激活的无接触压力传感器等。

公开(公告)号：US20150241476A1

公开(公告)日：2015-08-27

申请号：US14708198

申请日：2015-05-09

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John Knickerbocker ,  Yang Liu ,  Maurice Mason ,  Lubomyr T. Romankiw

IPC: G01R1/073 ,  B81B3/00 ,  G01R31/26

CPC classification number: G01R1/0735 ,  B23K35/00 ,  B81B3/00 ,  B81B2201/02 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81C1/00626 ,  G01R31/2607 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/73207 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01104

Abstract: A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.

Abstract translation: 在物品上形成表面突起的方法，以及附着有突起物的物品。 该物品可以是集成电路（IC）芯片，用于IC芯片的测试探针或任何合适的衬底或纳米结构。 表面突起电镀到模板或模具晶片上，转移到制品上，并容易地与模板晶片分离。 因此，附着的突起可以是例如IC芯片或衬底上的微凸起或微柱，探针头上的测试探针或微机或微传感器中的一个或多个悬臂膜或其它微电子 机械系统（MEMS）形成，而不会削弱MEMS结构。