公开(公告)号：EP1360143B1

公开(公告)日：2005-11-16

申请号：EP02708202.3

申请日：2002-02-04

Applicant: ROBERT BOSCH GMBH

Inventor： FISCHER, Frank ,  FREY, Wilhelm ,  METZGER, Lars

IPC: B81B3/00

CPC classification number: G01P15/125 ,  B81B2201/025 ,  B81C1/00619 ,  B81C2201/0112 ,  G01P15/0802 ,  G01P2015/0814

Abstract: The invention relates to a method for producing surface micromechanical structures having a high aspect ratio. At least one sacrificial layer (20) is provided between a substrate (30) and a functional layer (10). Trenches (60, 61) are provided in said functional layer (10) by means of a plasma etching process, said trenches uncovering at least some surface areas (21, 22) of the sacrificial layer (20). According to the invention, a further layer (70) is deposited at least partially on the lateral walls of the trenches, but not on the uncovered surface areas (21, 22) of the sacrificial layer (20), in order to increase the aspect ratio of said trenches. The invention also relates to a sensor, especially an acceleration or rotational rate sensor.

公开(公告)号：EP1087445A1

公开(公告)日：2001-03-28

申请号：EP99900292.6

申请日：1999-01-13

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： OHJI, Hiroshi Mitsubishi Denki Kabushiki Kaisha ,  TSUTSUMI, Kaz. Mitsubishi Denki Kabushiki Kaisha ,  FRENCH, Patrick, J.

IPC: H01L29/84 ,  G01L9/04 ,  G01P15/12 ,  G01P15/125

CPC classification number: G01P15/125 ,  B81B2201/025 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81C1/00182 ,  B81C2201/0114 ,  G01L9/0042 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0817 ,  G01P2015/0828

Abstract: An inertia force sensor having a mass body (11) which moves when force is applied to the sensor, at least one holding beam (12) for holding the mass body (11), and an anchor portion (13) for fixing an end portion of the holding beam (12), the sensor being designed to detect inertia force, which acts on the mass body (11), on the basis of a movement of the mass body (11). The sensor is characterized in that the mass body (11) is composed of a free standing structure (9) which is formed by removing an inner part of a silicon substrate (1) therefrom by means of an etching process within a single step, and the anchor portion (13) is composed of at least a part of a main body of the silicon substrate. Because the inertia force sensor is composed of single crystal silicon, its mechanical properties and reliability may be highly improved.

Abstract translation: 一种惯性力传感器，其具有在向传感器施加力时移动的质量体（11），用于保持质量体（11）的至少一个保持梁（12），以及用于固定端部的固定部（13） 所述传感器被设计成基于所述质量体（11）的运动来检测作用在所述质量体（11）上的惯性力。 传感器的特征在于，质量体（11）由通过在一个步骤内的蚀刻工艺除去硅衬底（1）的内部而形成的自立式结构（9）构成，以及 锚定部（13）由硅基板的主体的至少一部分构成。 由于惯性力传感器由单晶硅组成，因此其机械性能和可靠性可能得到很大改善。

公开(公告)号：EP3052901B8

公开(公告)日：2018-08-29

申请号：EP14851277.5

申请日：2014-10-02

Applicant: Robert Bosch GmbH

Inventor： FEYH, Ando ,  O'BRIEN, Gary

IPC: G01D21/02 ,  G01P15/08 ,  G01P13/00 ,  G01L9/06 ,  G01L7/08

CPC classification number: B81B7/02 ,  B81B2201/025 ,  B81B2201/0264 ,  G01C25/00 ,  G01D21/02 ,  G01L19/0092 ,  G01L19/12 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18

Abstract: In accordance with one embodiment, a single chip combination inertial and pressure sensor device includes a substrate, an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure, and a pressure sensor including a gap formed in the sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane.

公开(公告)号：EP3030875B1

公开(公告)日：2018-05-23

申请号：EP14834662.0

申请日：2014-07-31

Applicant: Robert Bosch GmbH

Inventor： FEYH, Ando ,  O'BRIEN, Gary

IPC: G01L9/12 ,  B81B7/02 ,  G01P15/125 ,  G01P15/18 ,  G01P1/02 ,  G01P15/08

CPC classification number: G01P15/0802 ,  B81B3/0021 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0264 ,  G01C19/5769 ,  G01C19/5783 ,  G01L1/14 ,  G01L1/18 ,  G01P1/023 ,  G01P15/125 ,  G01P15/14 ,  G01P15/18 ,  G01P2015/0862 ,  G01P2015/088

Abstract: In one embodiment, the process flow for a capacitive pressures sensor is combined with the process flow for an inertial sensor. In this way, an inertial sensor is realized within the membrane layer of the pressure sensor. The device layer is simultaneously used as z-axis electrode for out-of-plane sensing in the inertial sensor, and/or as the wiring layer for the inertial sensor. The membrane layer (or cap layer) of the pressure sensor process flow is used to define the inertial sensor sensing structures. Insulating nitride plugs in the membrane layer are used to electrically decouple the various sensing structures for a multi-axis inertial sensor, allowing for fully differential sensing.

公开(公告)号：EP3052901A4

公开(公告)日：2017-03-01

申请号：EP14851277

申请日：2014-10-02

Applicant: BOSCH GMBH ROBERT

Inventor： FEYH ANDO ,  O'BRIEN GARY

IPC: G01D21/02 ,  G01L7/08 ,  G01L9/06 ,  G01P13/00 ,  G01P15/08

CPC classification number: B81B7/02 ,  B81B2201/025 ,  B81B2201/0264 ,  G01C25/00 ,  G01D21/02 ,  G01L19/0092 ,  G01L19/12 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18

Abstract: In accordance with one embodiment, a single chip combination inertial and pressure sensor device includes a substrate, an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure, and a pressure sensor including a gap formed in the sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane.

Abstract translation: 根据一个实施例，单芯片组合惯性和压力传感器装置包括基板，惯性传感器和可移动感测结构，所述惯性传感器包括可移动地支撑在所述基板上方的可移动感测结构以及邻近所述可移动感测结构定位的第一固定电极， 包括在可移动感测结构正上方的位置处的传感器中形成的间隙以及形成在装置的盖层中的柔性膜，柔性膜限定间隙的边界并且被配置为朝向和远离间隙弯曲 对柔性膜上方压力变化的响应。

公开(公告)号：EP3030875A4

公开(公告)日：2017-01-11

申请号：EP14834662

申请日：2014-07-31

Applicant: BOSCH GMBH ROBERT

Inventor： FEYH ANDO ,  O'BRIEN GARY

IPC: G01L9/12 ,  B81B7/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/18

CPC classification number: G01P15/0802 ,  B81B3/0021 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0264 ,  G01C19/5769 ,  G01C19/5783 ,  G01L1/14 ,  G01L1/18 ,  G01P1/023 ,  G01P15/125 ,  G01P15/14 ,  G01P15/18 ,  G01P2015/0862 ,  G01P2015/088

Abstract: In one embodiment, the process flow for a capacitive pressures sensor is combined with the process flow for an inertial sensor. In this way, an inertial sensor is realized within the membrane layer of the pressure sensor. The device layer is simultaneously used as z-axis electrode for out-of-plane sensing in the inertial sensor, and/or as the wiring layer for the inertial sensor. The membrane layer (or cap layer) of the pressure sensor process flow is used to define the inertial sensor sensing structures. Insulating nitride plugs in the membrane layer are used to electrically decouple the various sensing structures for a multi-axis inertial sensor, allowing for fully differential sensing.

Abstract translation: 在一个实施例中，电容式压力传感器的工艺流程与惯性传感器的工艺流程相结合。 以这种方式，在压力传感器的膜层内实现惯性传感器。 器件层同时用作惯性传感器中的平面外感测的z轴电极，和/或用作惯性传感器的布线层。 使用压力传感器工艺流程的膜层（或盖层）来定义惯性传感器感测结构。 膜层中的绝缘氮化物塞用于电耦合用于多轴惯性传感器的各种感测结构，允许完全差分感测。

公开(公告)号：EP2455328A3

公开(公告)日：2014-07-16

申请号：EP11190201.1

申请日：2011-11-22

Applicant: Honeywell International, Inc.

Inventor： Horning, Robert D. ,  Supino, Ryan

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B2201/025 ,  B81B2203/0136

Abstract: A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one fixed anchor having a second plurality of combs. The first plurality of combs is interleaved with the second plurality of combs. Each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields.

公开(公告)号：EP1645847B1

公开(公告)日：2014-07-02

申请号：EP04425753.3

申请日：2004-10-08

Applicant: STMicroelectronics Srl

Inventor： Lasalandra, Ernesto ,  Merassi, Angelo ,  Zerbini, Sarah

IPC: G01C19/56 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P1/00 ,  H03H9/02 ,  H01L23/34 ,  B81B7/00 ,  B81B3/00

CPC classification number: B81C1/0069 ,  B81B3/0081 ,  B81B2201/025 ,  B81C1/00158 ,  B81C1/00666 ,  G01C19/56 ,  G01C19/5755 ,  G01P1/006 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  H03H9/02448 ,  H03H2009/02496 ,  Y10T29/43

Abstract: A micro-electromechanical device includes a semiconductor body (5), in which at least one first microstructure (2) and one second microstructure (3) of reference are integrated. The first microstructure (2) and the second microstructure (3) are arranged in the body (5) so as to undergo equal strains as a result of thermal expansions of said body (5; 105; 205; 305). Furthermore, the first microstructure (2) is provided with movable parts (6) and fixed parts (7) with respect to the body (5), and the second microstructure (3) has a shape that is substantially symmetrical to the first microstructure (2) and is fixed with respect to the body (5).

公开(公告)号：EP2187168A4

公开(公告)日：2013-04-03

申请号：EP08790513

申请日：2008-08-29

Applicant: PANASONIC CORP

Inventor： OHKOSHI HIDEO ,  MITANI TOMOHIRO

IPC: G01C19/56 ,  G01P15/08

CPC classification number: G01P1/003 ,  B81B7/0058 ,  B81B2201/025 ,  B81C1/0023 ,  G01C19/5607 ,  G01P1/023 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Abstract translation: 惯性传感器包括用于处理从角速度感测元件（32）提供的信号的振荡型角速度感测元件（32），用于处理信号的电容器（36）和用于容纳角速度感测的封装（38） 元件（32），IC（34），电容器（36）。 元件（32）和IC（34）经由隔离器（36）容纳在封装（38）中，隔离器由TAB带（46），放置有IC（34）的板（40）形成，其中角速度感测元件 32）层叠在IC（34）上，外框架（44）放置在板（40）的外部并与板（40）分离，并且经由布线图案（42）耦合到板（40）。

公开(公告)号：EP2145854A1

公开(公告)日：2010-01-20

申请号：EP09165609.0

申请日：2009-07-16

Applicant: Thales

Inventor： PARBAUD, Serge ,  SARNO, Claude

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  B81B2201/025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/00

Abstract: L'invention concerne un dispositif électro-mécanique comportant un boitier et au moins un composant reporté dans le boitier caractérisé en ce qu 'il comporte en outre au moins une interface à base de nanotubes (12) assurant une liaison mécanique de filtrage vibratoire et thermique entre ledit composant et le boitier.
Avantageusement l'interface à base de nanotubes (12) peut également servir d'interface électrique et/ou thermique avec les contacts électriques dont est équipé le boîtier.

Abstract translation: 该装置具有在电子部件（11），例如 惯性传感器，表面安装在一个基片（10），其中，所述基板是在包并入。 机械或机电基于碳纳米管的接口（12）提供机械链接，所述部件和所述基片之间的振动和热过滤。 导电胶：如导电聚合物胶即 各向异性导电粘接剂（ACA）提供的链接与所述组件和与所述基板的界面。 因此独立claimsoft包括用于制造机电装置的方法。