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131.发明公开
公开(公告)号：EP2120523A2
公开(公告)日：2009-11-18
申请号：EP09005017.0
申请日：2009-04-04
Applicant: SEMIKRON Elektronik GmbH & Co. KG
Inventor： Backhaus, Klaus, Dr.
IPC: H05K7/14
CPC classification number: H05K5/006 , H05K1/0271 , H05K1/18 , H05K1/189 , H05K7/142 , H05K2201/09063 , H05K2201/10015 , H05K2201/1003 , H05K2201/10166 , H05K2201/105
Abstract: Es wird ein Anordnung mit einem Hauptträger und einer Leiterplatte beschrieben. Auf der Leiterplatte sind leichte und schweren elektrischen und / oder elektronischen Bauelementen befestigt, wobei mindestens ein schweres Bauelement mechanisch fest mit dem Hauptträger und elektrisch leitend mit Leiterbahnen eines ersten Abschnitts der Leiterplatte verbunden ist. Dieser erste Abschnitt ist elektrisch leitend mit einem zweiten Abschnitt der Leiterplatte verbunden und mittels einer Entkopplungseinrichtung von dem zweiten Abschnitt der Leiterplatte bezüglich mechanischer Schwingungen entkoppelt.
Abstract translation: 该装置具有轻和重的电气或电子部件（142，4）固定在印刷电路板（1）。 重分量E.G. 变压器，被机械地牢固连接到主载体（3）和导电地连接到电路板的一个部分（10）的导体条迹。 所述电路板的部分导电地连接到电路板的另一部分（14）。 前者部从后面的段解耦关于使用去耦装置（18）的机械振动E.G. 灵活的部分。
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公开(公告)号：EP0101359B1
公开(公告)日：1988-02-10
申请号：EP83401545.5
申请日：1983-07-27
Applicant: DAV INDUSTRIES
Inventor： Viennois, Jean-Paul , Baudry, Jean-Pierre , Albert, Paul , Fadla, Roger
CPC classification number: H05K7/026 , H01R12/523 , H05K1/144 , H05K3/202 , H05K3/3447 , H05K2201/10303 , H05K2201/105
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公开(公告)号：KR1020100065201A
公开(公告)日：2010-06-15
申请号：KR1020107009875
申请日：2008-10-01
Applicant: 네스텍 소시에테아노님
CPC classification number: A47J31/441 , A47J31/407 , A47J31/542 , A47J31/545 , F24H1/101 , F24H9/2028 , H01H37/52 , H05K1/18 , H05K3/306 , H05K2201/10151 , H05K2201/10166 , H05K2201/10181 , H05K2201/10189 , H05K2201/10424 , H05K2201/105 , H05K2201/2036
Abstract: An in-line heating device(1, 2, 3) for a liquid food or beverage preparation machine in which liquid is circulated through the heating deviceand then guided into a brewing chamber. This heating device comprises: a thermoblock with a metal mass (1) that incorporates an inlet, an outlet and a heating chamber extending therebetween to form a passage for guiding said liquid circulating through said mass, the mass being arranged to accumulate heat and to supply heat to the liquid; and one or more electric components (60,75) that are rigidly secured onto or into the thermoblock and that are connected to a printed circuit board and/or a flex-print arranged to control the thermoblock. The electric components are rigidly connected to the printed circuit board and/or flex-print, in particular via rigid connector pins or blades or rigid plug and socket members.
Abstract translation: 一种用于液体食品或饮料制备机器的在线加热装置（1,2,3），其中液体通过加热装置循环，然后被引导到煮泡室中。 该加热装置包括：具有金属块（1）的热块，其包括入口，出口和在其间延伸的加热室，以形成用于引导循环通过所述物料的液体的通道，所述物质被布置成积聚热量并供应 热到液体; 以及一个或多个刚性地固定到热块上并且连接到布置成控制热块的印刷电路板和/或柔性印刷的电气部件（60,75）。 电气部件刚性地连接到印刷电路板和/或柔性印刷，特别是通过刚性连接器针或刀片或刚性插头和插座构件连接。
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公开(公告)号：KR100868842B1
公开(公告)日：2008-11-14
申请号：KR1020070060976
申请日：2007-06-21
Applicant: 미쓰비시덴키 가부시키가이샤
IPC: B62D5/04 , B60R16/02 , B60R16/023
CPC classification number: H05K7/20509 , H01L2924/0002 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962 , H01L2924/00
Abstract: 본 발명은, 파워 기판 등의 부품을 폐지함에 의해, 장치가 소형화됨과 함께 비용이 저감되는 등의 전자 제어 장치를 얻는 것을 목적으로 하는 것으로서, 상기 목적을 달성하기 위한 해결 수단에 따른 전자 제어 장치(1)는, 하우징(3)과, 히트싱크(5)와, 이 히트싱크(5)에 탑재된 반도체 스위칭 소자(2)와, 히트싱크(5)와 대향하여 마련되어 있는 회로 기판(4)과, 회로 기판(4)과 반도체 스위칭 소자(2)를 접속한 도전판(6a)과, 히트싱크(5)와 협동하여 반도체 스위칭 소자(2) 및 회로 기판(4)을 격납한 커버(7)를 구비하고, 도전판(6a)의 프레스 피트 단자부(6ap)는, 회로 기판(4)의 스루홀(4a)에 압입되어 있고, 또한 각 도전판(6a)은, 반도체 스위칭 소자(2)의 각 단자(VS)가 도출하는 도출 방향에 따라 배치되어 단자(VS)와 접합되어 있다.
전자 제어 장치Abstract translation: 本发明的目的是获得一种电子控制装置，例如通过取消诸如电源板的部件来缩小尺寸并降低成本的装置，并且设置有电子控制装置 图1所示的电子设备1包括壳体3，散热器5，安装在散热器5上的半导体开关元件2，与散热器5相对设置的电路板4， 连接电路板4和半导体开关元件2的导电板6a以及与散热器5配合存储半导体开关元件2和电路板4的盖7。 并且，导电板6a的压配端子部分6ap被压配到电路板4的通孔4a中，并且每个导电板6a被压配合 沿着各引出端VS引出的引出方向排列，并与端子VS接合。
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公开(公告)号：KR1020080061233A
公开(公告)日：2008-07-02
申请号：KR1020070060976
申请日：2007-06-21
Applicant: 미쓰비시덴키 가부시키가이샤
IPC: B62D5/04 , B60R16/02 , B60R16/023
CPC classification number: H05K7/20509 , H01L2924/0002 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962 , H01L2924/00
Abstract: An electronic control apparatus is provided to eliminate some parts so as to reduce the size and the cost of production thereof, while improving the reliability of electrical connection. An electronic control apparatus comprises a housing(3), a heat sink(5), a power device(2), connectors(9), a circuit board(4), a plurality of conductive plates(6a) and a cover(7). The housing is made of an insulating resin(3a) and has a pair of opening portions at opposite ends thereof. The heat sink is attached to one end of the housing. The power device is mounted on the heat sink and has terminals. Connectors are formed integral with the housing and include connector terminals having press-fit terminal portions(6ap) formed at their tip ends. The circuit board is arranged in opposition to the heat sink, and has an electronic circuit including a control circuit for controlling the power device. The conductive plates have their basal portions held by the housing and electrically connect the circuit board and the power device to each other. The cover is attached to the other end of the housing for receiving the power device and the circuit board in cooperation with the heat sink.
Abstract translation: 提供电子控制装置以消除一些部件，从而在提高电连接的可靠性的同时减小其生产的尺寸和成本。 电子控制装置包括壳体（3），散热器（5），电力设备（2），连接器（9），电路板（4），多个导电板（6a）和盖 ）。 壳体由绝缘树脂（3a）制成，并且在其相对端具有一对开口部分。 散热器连接到外壳的一端。 功率器件安装在散热器上，并具有端子。 连接器与壳体形成一体，并且包括具有形成在其末端处的压配端子部分（6ap）的连接器端子。 电路板与散热器相对地布置，并且具有包括用于控制功率器件的控制电路的电子电路。 导电板的基部由壳体保持，并将电路板和功率器件彼此电连接。 盖子连接到壳体的另一端，用于与散热器协作接收电力设备和电路板。
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Patent Agency Ranking
公开(公告)号：KR1020080061230A
公开(公告)日：2008-07-02
申请号：KR1020070058199
申请日：2007-06-14
Applicant: 미쓰비시덴키 가부시키가이샤
IPC: B62D5/04 , B60R16/023 , B60R16/02
CPC classification number: H05K7/20509 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962
Abstract: An electronic control apparatus is provided to eliminate some parts so as to reduce the size and the cost of production thereof, while improving the reliability of electrical connection. An electronic control apparatus comprises a housing(3), a heat sink, a power device(2), a circuit board and a plurality of conductive plates(6a,6b,6c). The heat sink is arranged in the housing. The power device is mounted on the heat sink and has terminals(VS,GT1,OUT,GT2,GND). The circuit board is arranged in opposition to the heat sink, and has an electronic circuit including a control circuit for controlling the power device. The conductive plates electrically connect the circuit board and the power device to each other. The conductive plates are arranged in a lead-out direction in which the individual terminals of the power device lead out, so that the conductive plates are bonded to the individual terminals of the power device.
Abstract translation: 提供电子控制装置以消除一些部件，从而在提高电连接的可靠性的同时减小其生产的尺寸和成本。 电子控制装置包括壳体（3），散热器，功率器件（2），电路板和多个导电板（6a，6b，6c）。 散热器布置在外壳中。 功率器件安装在散热器上，并具有端子（VS，GT1，OUT，GT2，GND）。 电路板与散热器相对地布置，并且具有包括用于控制功率器件的控制电路的电子电路。 导电板将电路板和功率器件彼此电连接。 导电板沿导电方向排列，其中功率器件的各个端子引出，使得导电板接合到功率器件的各个端子。
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137.发明专利
公开(公告)号：JP2010129656A
公开(公告)日：2010-06-10
申请号：JP2008300848
申请日：2008-11-26
Applicant: Nec Computertechno Ltd , エヌイーシーコンピュータテクノ株式会社
Inventor： YOKOUCHI KAZUHITO
IPC: H05K7/14
CPC classification number: H05K1/18 , H05K1/181 , H05K3/308 , H05K3/341 , H05K2201/10318 , H05K2201/10409 , H05K2201/105 , Y02P70/611 , Y10T29/49124
Abstract: PROBLEM TO BE SOLVED: To provide a mezzanine printed circuit board by reducing the wiring density and the number of the layers of the printed circuit board. SOLUTION: A stud 2 is a structure which supports a mounted component such as other printed circuit board or a device and the like on a printed circuit board 1. The structure is surface-mounted on the printed circuit board 1 by a solder connection, a press-fit connection or the like. The structure is constructed by a columnar structure and the like which are surface-mounted at its one end on the printed circuit board 1 and fastened at its other end to the mounted component. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：通过减少布线密度和印刷电路板的层数来提供夹层印刷电路板。 解决方案：螺柱2是在印刷电路板1上支撑诸如其它印刷电路板或装置等的安装部件的结构。该结构通过焊料表面安装在印刷电路板1上 连接，压合连接等。 该结构由柱状结构等构成，该柱状结构等在其一端表面安装在印刷电路板1上，并将其另一端固定在安装部件上。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP4410242B2
公开(公告)日：2010-02-03
申请号：JP2006352269
申请日：2006-12-27
Applicant: 三菱電機株式会社
CPC classification number: H05K7/20509 , H01L2924/0002 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962 , H01L2924/00
Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.
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139.发明专利Protection structure for electronic circuit, and method of manufacturing the same 审中-公开电子电路的保护结构及其制造方法
公开(公告)号：JP2009272414A
公开(公告)日：2009-11-19
申请号：JP2008120908
申请日：2008-05-07
Applicant: Honda Motor Co Ltd , 本田技研工業株式会社
Inventor： BUNGO KEIICHIRO
CPC classification number: H05K3/284 , H05K5/064 , H05K2201/105 , H05K2203/1316 , Y10T29/49826
Abstract: PROBLEM TO BE SOLVED: To make the consumption of a potting material less without impairing resistance against vibration although an ECU electronic control unit used for a general engine or a power generator has a potting material charged in the whole case conventionally. SOLUTION: An electronic circuit protection structure has a recessed portion 11 made on the case 3 to correspond to the shape of a large-size electronic component 2a mounted on a substrate 1. Then, the potting material 6 is charged only between the large-size electronic component 2a and recessed portion 11. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：尽管用于通用发动机或发电机的ECU电子控制单元通常具有以整体方式充电的灌封材料，但是为了不损害耐振动性而使灌封材料消耗更少。 解决方案：电子电路保护结构具有形成在壳体3上的凹部11，以对应于安装在基板1上的大尺寸电子部件2a的形状。然后，灌封材料6仅在 大尺寸电子部件2a和凹部11。版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2008166382A
公开(公告)日：2008-07-17
申请号：JP2006352269
申请日：2006-12-27
Applicant: Mitsubishi Electric Corp , 三菱電機株式会社
Inventor： TOMINAGA TSUTOMU , KIMATA MASAHIRO , KIFUKU TAKAYUKI , AKIYAMA SHUZO , FUJIMOTO TADAYUKI
CPC classification number: H05K7/20509 , H01L2924/0002 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an electronic controller which is miniaturized and whose cost is reduced by eliminating a component such as a power substrate. SOLUTION: The electronic controller 1 includes a housing 3, a heat sink 5, a semiconductor switching element 2 loaded on the heat sink 5, a circuit board 4 installed to confront with the heat sink 5, a conduction board 6a connecting the circuit board 4 and the semiconductor switching element 2, a cover 7 storing the semiconductor switching element 2 and the circuit board 4 in cooperation with the heat sink 5. Press fitting terminal parts 6ap of the conduction board 6a are press-fitted to through holes 4a of the circuit board 4. The respective conduction boards 6a are arranged along a derivation direction from which respective terminals VS of the semiconductor switching element 2 derive and are bonded to the terminals VS. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种小型化的电子控制器，并且通过消除诸如电源基板的部件来降低成本。 解决方案：电子控制器1包括壳体3，散热器5，加载在散热器5上的半导体开关元件2，安装成与散热器5相对的电路板4，连接 电路板4和半导体开关元件2，与散热器5协作存储半导体开关元件2和电路板4的盖体7.压接配线端子部件6ap与导电板6a压入通孔4a 相应的导电板6a沿着半导体开关元件2的各个端子VS导出并被结合到端子VS的导出方向排列。 版权所有（C）2008，JPO＆INPIT
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