公开(公告)号：US08477506B2

公开(公告)日：2013-07-02

申请号：US13464903

申请日：2012-05-04

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K1/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

公开(公告)号：US20120314348A1

公开(公告)日：2012-12-13

申请号：US13267801

申请日：2011-10-06

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K7/00 ,  B32B38/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其被模制成包括装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路。

公开(公告)号：US20110069448A1

公开(公告)日：2011-03-24

申请号：US12736942

申请日：2009-05-29

Applicant: Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

Inventor： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract translation: 该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。 根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。