Abstract:
The invention relates to a method for operating a switch actuating device (11), having the following steps: outputting the pixels of the signal excursions (49, 79) caused in the approach phase (3) and the signal excursions (50, 80) caused in the translation phase to a signal analyzing unit, wherein the non-tactile gestures are performed using the heat-emitting part, and a waiting level which has a lower value than the values of the extreme values of the signal excursions is reached between the signal excursions during the waiting phase (4) of the signal; monitoring the signal and identifying the occurrence of a sequence of the signal excursions and the signal waiting level lying chronologically between the signal excursions; proceeding with the next step as soon as the sequence has been identified; checking whether the signal excursions caused in the approach phase have a direction opposite the signal excursions caused in the translation phase; proceeding with the next step if the check is positive; checking whether the time offset of the signal excursions caused in the approach phase lie within a first specified span of time; proceeding with the next step if the check is positive; and checking whether the time offset of the chronologically first and the chronologically last signal excursion caused in the translation phase lies within two thresholds, the lower threshold of which is larger than null.
Abstract:
The invention relates to an ATR infrared spectrometer (1) for analyzing the chemical composition of a sample, having an elongated ATR crystal (2), an infrared light emitter line (8) arranged on an ATR crystal (2) inlet surface (4) which is arranged at one longitudinal end of the ATR crystal (2), and an infrared light detector line (10) arranged at the other longitudinal end of the ATR crystal (2). Infrared light emitted from the infrared light emitter line (8) directly enters the ATR crystal (2) via the inlet surface (4) and is guided in the ATR crystal (2) to the infrared light detector line (10) while undergoing total internal reflection and interacting with the sample, which is arranged between the infrared light emitter line (8) and the infrared light detector line (10) adjacently to the ATR crystal (2). The total extension (13) of all the infrared light-detecting regions (18) of the infrared light detector line (10) with respect to the direction perpendicular to the longitudinal axis (21) of the ATR crystal corresponds maximally to the width (14) of the ATR crystal (2) and is greater than the total extension (12) of all the infrared light-emitting regions (17) of the infrared light emitter line (8).
Abstract:
The invention relates to an infrared light detector, comprising at least one sensor chip (3, 4), which has a layer element (5, 8) that is produced from a pyroelectrically sensitive material and further has a base electrode (6, 9) and a head electrode (7, 10), to which the layer element (5, 8) is connected for tapping electric signals generated in the layer element (5, 8) by irradiation of the at least one sensor chip with light (2), and further comprising a transimpedance amplifier (11, 12) for amplifying the signals with an operational amplifier (19, 25), which is asymmetrically operated by a supply voltage source (13) having a positive supply voltage and to the inverting input (21, 27) of which the base electrode (6, 9) is connected. At the voltage supply source (13), a voltage divider (15) that is connected to ground (14) is provided with a partial node (18), to which a partial voltage that is smaller than the supply voltage is applied and which is electrically coupled to the non-inverting input (20, 26) and the head electrode (7, 10).
Abstract:
A method for producing an infrared light detector (1) has the steps of: providing a plurality of connection pins (11, 12), which are kept parallel to one another and arranged with one of the longitudinal ends (17, 18) thereof in a horizontal plane, and a printed circuit board (6) with a planar underside (8), in which a recess (15, 16) of the same form in each case is provided for each of the connection pins (11, 12); filling the recesses (15, 16) with a solder paste, so that in each of the recesses (15, 16) there is a solder paste body (21) with the same amount of solder paste; positioning the printed circuit board (6) over the connection pins (11, 12), so that each of the connection pins (11, 12) extends with its longitudinal end (17, 18) in the recess (15, 16) assigned to it and dips in the solder paste body (21) located in the respective recess (15, 16); liquefying the solder paste bodies (21), so that electrically conducting connections are formed between the connection pins (11, 12) and the solder paste bodies (21) and, on account of the surface tension in the solder paste bodies (21) and the dead weight of the printed circuit board (6), the underside (8) of the printed circuit board (6) is aligned parallel to the horizontal plane; solidifying the solder paste bodies (21), so that mechanically secure connections are formed by the solder paste bodies (21) between the printed circuit board (6) and the connection pins (11, 12) and the alignment of the underside (8) of the printed circuit board (6) parallel to the horizontal plane is fixed.
Abstract:
The invention relates to a device (1) for detecting thermal radiation, comprising at least one stack (10) having at least one detector carrier (11) with at least one thermal detector element (111) for converting the thermal radiation to an electrical signal, at least one circuit carrier (12) having at least one readout circuit (121, 122) for reading out the electrical signal, and at least one cover (13) for covering the detector element. The detector carrier and the cover are arranged on each other in such a manner that at least one first stack cavity (14) of the stack is produced between the detector element of the detector carrier and the cover, said cavity being delimited by the detector carrier and the cover. The circuit carrier and the detector carrier are arranged on each other in such a manner that at least one second stack cavity (15) of the stack is produced between the detector carrier and the circuit carrier, said cavity being delimited by the circuit carrier and the detector carrier. The first stack cavity and/or the second stack cavity are or can be evacuated. The invention also relates to a method for producing said device. The detector carrier, circuit carrier and the cover are preferably produced from silicon. The production is preferably carried out on the wafer level: Functionalized silicon substrates are stacked, firmly interconnected and then subdivided. The detector elements are preferably pyroelectric detector elements. The device according to the invention is used in motion detectors, presence detectors and thermal imaging cameras.