HEAT-RESISTANT ADHESIVE SOLUTION
    142.
    发明专利

    公开(公告)号:JPH07228857A

    公开(公告)日:1995-08-29

    申请号:JP11645794

    申请日:1994-05-30

    Abstract: PURPOSE:To obtain an adhesive solution of industrially great value, excellent in preservation stability and good in bonding strength. CONSTITUTION:This heat-resistant adhesive solution contains a polyimide copolymer obtained by thermally reacting a diamine component containing 1,3-bis (3-aminophenoxy)benzene or the 1,3-bis(3-aminophenoxy)benzene and other diamines at a specific molar ratio with benzophenonetetracarboxylic dianhydride or two or more tetracarboxylic dianhydrides selected from the benzophenonetetracarboxylic dianhydride and other specific tetracarboxylic dianhydrides in the presence of a dicarboxylic acid anhydride and/or a monoamino compound in an organic solvent.

    146.
    发明专利
    失效

    公开(公告)号:JPH05306387A

    公开(公告)日:1993-11-19

    申请号:JP11116792

    申请日:1992-04-30

    Abstract: PURPOSE:To obtain an adhesive bondable at low temperature under low pressure, useful for electronic materials, etc., having excellent adhesiveness, comprising a polyamic acid having a specific repeating structural unit, etc. CONSTITUTION:The adhesive comprises a polyamic acid and/or a polyimide which contains polymer molecule ends hindered with an aromatic dicarboxylic acid anhydride (e.g. phthalic anhydride) of formula I (Z is bifunctional group selected from a group consisting of monocyclic aromatic group and noncondensed polycyclic aromatic group) and has a repeating structural unit of formula II [Y is group of formula III or IV (X is direct bond, CO or O bifunctional group). The adhesive is preferably dissolved in a solvent to give a solution, which is used for adhesion.

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