公开(公告)号：JPH04298566A

公开(公告)日：1992-10-22

申请号：JP6412491

申请日：1991-03-28

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KATAOKA TOSHIYUKI ,  OIKAWA HIDEAKI ,  KOGA NOBUSHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

IPC: C08K7/02 ,  C08L77/00 ,  C08L77/10

Abstract: PURPOSE:To produce the title compsn. excellent in heat resistance, dimensional stability, mechanical strengths, and processability by compounding a specific arom. polyamide with a fibrous reinforcement in a specified ratio. CONSTITUTION:The title compsn. is produced by compounding 100 pts.wt. arom. polyamide having a backbone consisting of repeating units of formula I [wherein X is a condensed polycyclic arom. ring or a group of formula II; Y is a direct bond, -O-, -S-, -SO2-, -CO-, -CH2-, -C(CH3)2-, or -C(CF3)2-; R is 1-4C alkyl, alkoxy, halogen, or phenyl; a is 0-2; b is 0-4; and n is 1-1000] with 5-100 pts.wt. fibrous reinforcement (e.g. a glass fiber).

公开(公告)号：JPH04175373A

公开(公告)日：1992-06-23

申请号：JP31282790

申请日：1990-11-20

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TSUTSUMI TOSHIHIKO ,  NAKAKURA TOSHIYUKI ,  MORIKAWA SHUICHI ,  SHIMAMURA KATSUNORI ,  TAKAHASHI TOSHIAKI ,  MORITA ATSUSHI ,  KOGA NOBUSHI ,  YAMAGUCHI TERUHIRO ,  OTA MASAHIRO

IPC: C08L67/02 ,  C08L67/00 ,  C08L71/00 ,  C08L71/08 ,  C08L71/10 ,  C08L79/08

Abstract: PURPOSE:To improve the moldability of a polyimide resin and the dimensional stability of a molded item thereof during thermal treatment by compounding a specific polyimide resin with a polyetherketone resin and/or a polyester resin. CONSTITUTION:99.5-50wt.% polyimide resin having structural repeating units of the formal (wherein X is a direct bond, a 1-10C divalent hydrocarbon group, hexafluoroisopropylidene, carbonyl, thio, or sulfonyl; Y1, Y2, Y3, and Y4 are each H, lower alkyl, lower alkoxy, chlorine, or bromine; and R is a tetravalent 2C or higher aliph., alicyclic, monocyclic arom., or condensed polycyclic arom. group) is compounded with 0.1-50% polyetherketone or polyester resin to give the title compsn., which is esp. suitable for molding at a high temp. under a high pressure.

公开(公告)号：JPH03195771A

公开(公告)日：1991-08-27

申请号：JP33481389

申请日：1989-12-26

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OTA MASAHIRO ,  KOGA NOBUSHI ,  YAMAGUCHI TERUHIRO

IPC: C08L67/02 ,  C08L67/00 ,  C08L67/03 ,  C08L79/08

Abstract: PURPOSE:To obtain the title composition having the excellent characteristics inherent in polyimide as well as markedly improved in molding processability by incorporating a specific polyimide with a specified amount of a polyester resin. CONSTITUTION:(A) 99.9-50wt.% of a polyimide having recurring unit of formula III, produced by either heating dehydration or imidization using an imidizing agent of a polyamic acid having recurring unit of formula II (R is tetravalent group selected from 2C aliphatic group, alicyclic group, monocyclic aromatic group, etc.) prepared by reaction between an aromatic diamine of formula I and at least one tetracarboxylic dianhydride and (B) 0.1-50wt.% of a polyester resin [e.g. (aromatic) polyester capable of forming an anisotropic melt phase at

公开(公告)号：JPH0343286B2

公开(公告)日：1991-07-02

申请号：JP17658380

申请日：1980-12-16

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TSUBOI HIKOTADA ,  KAWAMATA MOTOO ,  OOBA MASAYUKI ,  KOGA NOBUSHI

IPC: C08F20/00 ,  C08F20/52 ,  C08F222/40 ,  C08F290/00 ,  C08F299/00

公开(公告)号：JPH0135853B2

公开(公告)日：1989-07-27

申请号：JP17016881

申请日：1981-10-26

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OOBA MASAYUKI ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

IPC: C08L79/08 ,  C08G73/00 ,  C08G73/06 ,  C08G73/10 ,  C08G73/12 ,  C08L45/00 ,  C08L77/00

公开(公告)号：JPS6330893B2

公开(公告)日：1988-06-21

申请号：JP16403379

申请日：1979-12-19

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TSUBOI HIKOTADA ,  KAWAMATA MOTOO ,  OOBA MASAYUKI ,  KOGA NOBUSHI

IPC: C07D207/452

公开(公告)号：JPS6320330A

公开(公告)日：1988-01-28

申请号：JP16377886

申请日：1986-07-14

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YAMATANI NORIMASA ,  KOGA NOBUSHI ,  BABA KENICHI

IPC: C08G69/32

Abstract: PURPOSE:To produce an aromatic polyamide excellent in heat resistance and wide in a molding temperature range, by reacting N,N'-diphenyl-m- phenylenediamine with an aromatic carboxylic acid dihalide in an organic solvent. CONSTITUTION:Phenol is reacted with m-phenylenediamine and cyclohexane in the presence of a hydrogen transfer catalyst in an autoclave to obtain N,N'- diphenyl-m-phenylenediamine (A). Component A is reacted with an aromatic dicarboxylic acid dihalide (B) of formula I (wherein Ar is a bivalent aromatic group and X is a halogen) at 80-300 deg.C for 2-20hr in equivalent amounts in an organic solvent (e.g., xylene) to obtain an N-phenyl-substituted aromatic polyamide resin having repeating units of formula II.

公开(公告)号：JPS638455A

公开(公告)日：1988-01-14

申请号：JP15174286

申请日：1986-06-30

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YAMATANI NORIMASA ,  KOGA NOBUSHI ,  BABA KENICHI

IPC: C08L27/12 ,  C08L79/08 ,  C08L87/00

Abstract: PURPOSE:The titled composition suitable as various bearing materials, piston rings, etc., capable of being injection molded, having a low coefficient of friction and improved wear resistance, obtained by blending a specific novel polyimide with a specific amount of a fluoroplastic. CONSTITUTION:100pts.wt. polyimide resin having a repeating unit shown by formula III obtained by reacting an ether diamine shown by formula I (Y is straight bond and 1-10C bifunctional hydrocarbon, etc.) with one or more tetracarboxylic acid dianhydrides shown by formula II (R is >=2C aliphatic group, etc.) is blended with 5-100pts.wt., preferably 10-60pts.wt. powdery fluoroplastic (e.g. tetrafluoroethylene resin, etc.) having 1-25mu particle size.

公开(公告)号：JPS62265350A

公开(公告)日：1987-11-18

申请号：JP10851386

申请日：1986-05-14

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YAMATANI NORIMASA ,  KOGA NOBUSHI ,  BABA KENICHI

IPC: C08L79/08 ,  C08K7/02 ,  C08L77/00

Abstract: PURPOSE:To provide the title compsn. having excellent heat resistance, moldability and mechanical strength, by blending a specified polyimide resin with an arom. polyamide fiber. CONSTITUTION:An etherdiamine (a) of formula I (wherein Y is a direct bond, a 1-10 C bivalent hydrocarbon group, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl or oxide) [e.g., 4,4'-bis(3-aminophenoxy)biphenyl] is reacted with tetracarboxylic acid dianhydride (b) of formula II (wherein R is a tetrava lent group selected from the group consisting of a 2 C or higher aliph. group, a cyclic aliph. group, a monocyclic arom. group, a condensed polycyclic arom. group and a non-condensed ring type arom. group wherein arom. groups are linked with each other directly or through a bridging member) (e.g., pyromellitic dianhydride) to obtain a polyimide resin (A) having a repeating unit of the formula III. 100pts.wt. component A is blended with 5-100pts.wt. arom. polyam ide fiber (B) (e.g., a fiber of formula IV) and optionally, an antioxidant, a ther mal stabilizer, a lubricant, a colorant, other thermoplastic resin, etc.

公开(公告)号：JPS61287938A

公开(公告)日：1986-12-18

申请号：JP12827485

申请日：1985-06-14

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YAMATANI NORIMASA ,  KOGA NOBUSHI ,  BABA KENICHI

IPC: C08G73/00 ,  C08F20/00 ,  C08F20/52 ,  C08F22/40 ,  C08G73/10 ,  C08J5/24

Abstract: PURPOSE:To produce a prepreg sheet excellent in melt flow and heat resistance, by impregnating a fibrous reinforcement with a specified polyamic acid oligomer and imidating the oligomer. CONSTITUTION:A fibrous reinforcement is impregnated with an organic solvent solution, viscosity of 10-50,000cP, containing 2-60wt% polyamic acid oligomer of a weight-average MW of 500-10,000 of formula I (wherein R1 is a group of formula II or III, X is -CH2-, formula IV, -O-, -S-, -SO2-, a direct bond between aromatic rings, R2 is a group of formula V or VI, Y is -CH2-, formula IV, -O-, -S-, -SO2-, formula VII or VIII or a direct bond between aromatic rings, and n is an average of 0.5-10), and the oligomer is imidated either by dehydration by heating to 100-300 deg.C for 30-6hr or by adding a dehydrating/imidating agent to obtain a prepreg sheet containing a polyimide oilgomer of formula IX. Aplurality of said sheets are laminated and heated to a temperature higher than the glass transition temperature of the polyimide oligomer to obtain a lamination molding.