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    MULTI-CHANNEL BACKSIDE WAFER INSPECTION
    143.
    发明公开
    MULTI-CHANNEL BACKSIDE WAFER INSPECTION 审中-公开
    MEHRKANALIGERÜCKSEITIGEWAFERINSPEKTION

    公开(公告)号：EP3087593A4

    公开(公告)日：2017-07-26

    申请号：EP14874432

    申请日：2014-12-23

    Applicant: KLA-TENCOR CORP

    Inventor： BOBROV YAKOV

    IPC: H01L21/66 ,  G01B11/24 ,  G01N21/95

    CPC classification number: G01N21/8806 ,  G01B11/24 ,  G01N21/9501 ,  G01N2201/02 ,  G01N2201/06113 ,  H01L22/12

    Abstract: A system for inspecting a backside surface of a wafer with multi-channel focus control includes a set of inspection sub-systems including a first inspection sub-system positioned and an additional inspection sub-system. The first and additional inspection sub-systems include an optical assembly, an actuation assembly, where the optical assembly is disposed on the actuation assembly, and a positional sensor configured to sense a position characteristic between a portion of the optical assembly and the backside surface of the wafer. The system also includes a controller configured to acquire one or more wafer profile maps of the backside surface of the wafer and adjust a first focus position of the first inspection sub-system or an additional focus position of the additional inspection sub-system based on the received one or more wafer profile maps.

    Abstract translation: 利用多通道聚焦控制来检查晶片的背面的系统包括一组检查子系统，其包括定位的第一检查子系统和附加的检查子系统。 第一和另外的检查子系统包括光学组件，致动组件，其中光学组件布置在致动组件上，以及位置传感器，被配置为感测光学组件的一部分和光学组件的背面表面之间的位置特性 晶圆。 该系统还包括控制器，该控制器被配置为获取晶片的背侧表面的一个或多个晶片轮廓图并且基于该第一检查子系统的第一焦点位置或附加检查子系统的附加焦点位置 接收一个或多个晶片轮廓图。

    SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
    144.
    发明公开
    SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD 审中-公开
    SUBSTRATINSPEKTIONSVORRICHTUNG UND SUBSTRATINSPEKTIONSVERFAHREN

    公开(公告)号：EP3187861A4

    公开(公告)日：2017-07-19

    申请号：EP15822847

    申请日：2015-07-08

    Applicant: SUMITOMO CHEMICAL CO

    Inventor： FUJIKURA HAJIME

    IPC: G01N21/956 ,  G01N21/94 ,  H01L21/66

    CPC classification number: G01N21/9501 ,  G01N21/94 ,  G01N21/956 ,  G01N2201/02 ,  G01N2223/634 ,  G06T7/0004 ,  G06T2207/30148

    Abstract: A wafer inspection apparatus including a light emitter configured to emit light onto a to-be-inspected surface of a wafer, an imaging unit configured to obtain an image formed by the light emitted from the light emitter and reflected by the to-be-inspected surface, a moving unit configured to move a to-be-inspected position on the to-be-inspected surface by controlling a position of one of the wafer and the light emitter, and an inspecting unit configured to inspect the to-be-inspected surface by detecting a scatter image formed by the light that is emitted from the light emitter and scattered by a defect of the to-be-inspected surface, where the scatter image is formed outside an outline of the image formed by the light emitted from the light emitter.

    Abstract translation: 1。一种晶片检查装置，其特征在于，具备：发光部，其对晶片的被检查面照射光;摄像部，其获取由所述发光部射出并被所述被检查部反射的光形成的图像 通过控制晶圆和发光体中的一方的位置来移动被检查面上的被检查位置的移动单元以及检查被检查单元的检查单元 通过检测由光发射器发射并被待检查表面的缺陷散射的光形成的散射图像，其中散射图像形成在由从光发射器发射的光形成的图像的轮廓外部 光发射器。

    LIGHT-INDUCED FLUORESCENT MEASURING DEVICE
    146.
    发明授权
    LIGHT-INDUCED FLUORESCENT MEASURING DEVICE 有权
    设备用于测量光诱导荧光

    公开(公告)号：EP2881726B1

    公开(公告)日：2017-03-08

    申请号：EP13825500.5

    申请日：2013-07-05

    Applicant: Ushio Denki Kabushiki Kaisha ,  Kyushu University, National University Corporation

    Inventor： OKI, Yuji ,  YOSHIOKA, Hiroaki ,  MORITA, Kinichi

    IPC: G01N21/64 ,  G01N27/447 ,  G01N33/00

    CPC classification number: G01N21/645 ,  G01N21/6402 ,  G01N27/44721 ,  G01N33/0057 ,  G01N2201/02 ,  G01N2201/0221 ,  G01N2201/06113

    Abstract: Provided is a small and easy-to-carry light-induced fluorescence measuring device capable of minimizing alignment displacements in an optical system due to impact and so forth, suppressing reflected light and scattered light and so forth from entering a fluorescence measuring unit, and capable of carrying out fast and high-performance measurements. A laser light source (1) for emitting excitation light, a sample case (2), a photomultiplier tube (4) constituting the fluorescence measuring unit, a fluorescence collecting optical system (3) and so forth are embedded in a resin material (6) that is transparent to the excitation light and the light including fluorescence emitted from a sample (S). The resin material (6) is provided in at least part of a light path that guides the fluorescence in the fluorescence collecting optical system (3), and this resin forms a housing that holds the laser light source (1), the fluorescence collecting optical system (3), the photomultiplier (4) and so forth. A pigment having wavelength characteristics for absorbing the excitation light, Raman light generated from the resin, and so forth is contained substantially in a uniform manner in a resin region (61) that surrounds the light path through which the excitation light and the light including the fluorescence pass, so as to absorb all these types of light travelling outside the light path.

    MOTION STRATEGIES FOR SCANNING MICROSCOPE IMAGING
    148.
    发明公开
    MOTION STRATEGIES FOR SCANNING MICROSCOPE IMAGING 审中-公开
    BEWEGUNGSSTRATEGIEN ZUM SCANNEN MIKROSKOPISCHER BILDER

    公开(公告)号：EP3063523A1

    公开(公告)日：2016-09-07

    申请号：EP14857971.7

    申请日：2014-10-31

    Applicant: 3Scan Inc.

    Inventor： GOODMAN, Matthew ,  DANIEL, Cody

    IPC: G01N1/06

    CPC classification number: G02B21/362 ,  B26D5/007 ,  G01N1/06 ,  G01N1/286 ,  G01N21/55 ,  G01N2001/2873 ,  G01N2201/02 ,  G01N2201/06113 ,  G02B21/002 ,  G02B21/32

    Abstract: Motion strategies in two and three dimensions for scanning microscope imaging are described. An object, sample, or specimen is mounted on a precision three- dimensional stage. The object is moved concurrently with respect to a first axis and a second axis orthogonal to the first against a cutting tool to cut the object. An image of the cut portion is generated as the object is moved. The cutting tool may act as an optical waveguide for illuminating the portion of the object cut. An optical element captures images of the cut and illuminated object. The object may further be concurrently moved with respect to a third axis orthogonal to both the first and second.

    Abstract translation: 描述了二维和三维扫描显微镜成像的运动策略。 物体，样品或样品安装在精密三维平台上。 物体相对于第一轴线和第二轴线与第一轴线相对于切割工具同时移动以切割物体。 随着对象的移动，生成切割部分的图像。 切割工具可以用作用于照射被切割部分的光波导。 光学元件捕获切割和照射物体的图像。 该物体可以进一步相对于与第一和第二两者正交的第三轴同时移动。

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