公开(公告)号：WO01020955A1

公开(公告)日：2001-03-22

申请号：PCT/IE2000/000106

申请日：2000-09-13

IPC: H05K7/20 ,  H01L23/36 ,  H01L25/00 ,  H02M3/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/0203 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/368 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/10545 ,  H01L2924/00

Abstract: A PCB assembly (1) in this case a DC-DC converter comprising a single layer board (2), mounts power semi-conductor devices forming high heat generating components (3) and various cores of magnetic material forming heat dissipating components (4). Tracks of heat conductive coupling material (6) lie above or below each heat generating component (3) and project into one of the heat dissipating components (4) and beside the others. In one embodiment, the heat generating components (3) are housed within a heat dissipating component (3). In another PCB assembly, there is an additional plug-in PCB which may itself carry heat generating components (3) or only heat dissipating components (4). In the latter case, the heat generating components (3) are mounted on the PCB assembly below the additional plug-in PCB.

Abstract translation: 在这种情况下，PCB组件（1）是包括单层板（2）的DC-DC转换器，安装形成高发热部件（3）的功率半导体器件和形成散热部件（4）的各种磁性材料芯， 。 导热耦合材料（6）的轨道位于每个发热部件（3）的上方或下方，并且投射到其中一个散热部件（4）中。 在一个实施例中，发热部件（3）容纳在散热部件（3）内。 在另一个PCB组件中，还有一个额外的插入式PCB，其本身可以携带发热部件（3）或仅散热部件（4）。 在后一种情况下，发热部件（3）安装在附加插入式PCB下面的PCB组件上。

公开(公告)号：WO99050909A1

公开(公告)日：1999-10-07

申请号：PCT/JP1999/001457

申请日：1999-03-23

IPC: H01R33/76 ,  H01L23/04 ,  H01L23/32 ,  H01R33/94 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R12/523 ,  H01L23/32 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10704 ,  H01L2924/00

Abstract: A semiconductor socket converter module having a simplified low-cost structure composed of a plurality of circuit boards of high connection reliability and adapted for replacement of I/O terminals, for example, to upgrade a semiconductor package on a motherboard. The module structure comprises a socket board adapted to receive a semiconductor package, a converter board that carries the socket board and a signal converter device, and a circuit board interposed between the socket board and the converter board, the circuit board including holes for receiving general I/O pins on the socket board and further including conductor patterns for connecting particular I/O pins on the socket board electrically with the signal converter device.

Abstract translation: 一种半导体插座转换器模块，其具有由具有高连接可靠性的多个电路板组成的简化的低成本结构，并且适于替换I / O端子，以升级主板上的半导体封装。 模块结构包括适于接收半导体封装的插座板，承载插座板的转换器板和信号转换器装置，以及插在插座板和转换器板之间的电路板，电路板包括用于接收通用的孔 插座板上的I / O引脚，并且还包括用于连接插座板上的特定I / O引脚与电信号转换器装置的导体图案。

公开(公告)号：WO99035689A1

公开(公告)日：1999-07-15

申请号：PCT/JP1999/000005

申请日：1999-01-05

IPC: H01L25/18 ,  H01L23/32 ,  H01L23/498 ,  H01L25/10 ,  H01L25/11 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L23/32 ,  H01L23/49827 ,  H01L2224/16 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10704

Abstract: A semiconductor socket converter module having a simplified low-cost structure composed of a plurality of circuit boards of high connection reliability and adapted for replacement of I/O terminals, for example, to upgrade a semiconductor package on a motherboard. The module structure comprises a first circuit board provided with replacement connection circuits and having conductor pins for external connections on its lower side, a second circuit board carrying a semiconductor package on its upper side and having I/O terminals projecting downward and corresponding to the conductor pins for external connections, and a daughter board interposed between the first and second circuit boards and having conductor patterns connected with the replacement connection circuit and with particular ones of the I/O pins, the conductor pins for external connections being connected electrically with the particular I/O pins through the replacement connection circuit.

Abstract translation: 一种半导体插座转换器模块，其具有由具有高连接可靠性的多个电路板组成的简化的低成本结构，并且适于替换I / O端子，以升级主板上的半导体封装。 该模块结构包括：第一电路板，设置有替换连接电路，并具有用于其下侧的外部连接的导体引脚;第二电路板，其上侧承载有半导体封装，并且具有向下突出并对应于导体的I / O端子 用于外部连接的引脚和插入在第一和第二电路板之间并具有与替换连接电路和特定I / O引脚连接的导体图案的子板，用于外部连接的导体引脚与特定的 I / O引脚通过替换连接电路。

公开(公告)号：KR101535064B1

公开(公告)日：2015-07-09

申请号：KR1020080005361

申请日：2008-01-17

Applicant: 삼성디스플레이 주식회사

Inventor： 강은정 ,  강석원 ,  이영근 ,  신호식

IPC: G02F1/1335

CPC classification number: H05K3/323 ,  G02B6/0073 ,  G02B6/0083 ,  H05K3/28 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2201/10333 ,  Y02P70/611 ,  Y10S362/80 ,  Y10T29/4913

Abstract: 본발명은표시장치용광원모듈및 이를포함하는표시장치에관한것으로, 적어도두개의금속배선각각의일부가노출된실장기판과, 상기노출된금속배선쌍에두 전극이각기대응되도록배치된복수의발광다이오드및 상기실장기판상에마련되어상기노출된금속배선쌍과상기두 전극을각기전기적으로연결하는이방전도성필름을포함하는광원모듈및 이를포함하는표시장치를제공한다. 이와같이이방전도성필름을이용하여저온에서발광다이오드를실장하여열에의한발광다이오드의광학적특성변화를최소화할수 있다.

公开(公告)号：KR101040506B1

公开(公告)日：2011-06-09

申请号：KR1020097002420

申请日：2007-07-03

Applicant: 해리스 코포레이션

Inventor： 스미스,스티븐씨. ,  스나이더,스티븐알.

IPC: H01R33/76 ,  H01L23/12 ,  H01L21/60 ,  H05K3/34

CPC classification number: H05K3/32 ,  H05K3/4015 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2201/10962 ,  Y02P70/611

Abstract: 볼 그리드 어레이(BGA) 연결 시스템은 매트릭스 패턴으로 배치된 볼 그리드 어레이(BGA)를 형성하는 복수의 전도성 볼을 포함하는 집적회로(IC) 패키지를 구비하고 있다. 인쇄회로기판(PCB)은 대응하는 매트릭스 패턴으로 배치되는 복수의 볼 소켓을 구비하고 있다. 각각의 볼 소켓은 한 측이 PCB에 결합하고, 반대 측이 BGA의 전도성 볼을 착좌하도록 구성되는 베이스를 구비하고 있다. 복수의 프롱(prongs)이 상기 베이스에 안정되어 연장하며, 상기 베이스에 접촉하여 전도성 볼을 수용하고 보유하도록 구성된다.
볼 소켓, 집적회로(IC), 기판, 전도성, 매트릭스 패턴

公开(公告)号：KR101011055B1

公开(公告)日：2011-01-25

申请号：KR1020047014767

申请日：2003-03-20

Applicant: 콤스코프 테크놀로지스 엘엘씨

Inventor： 뷰온델몬트찰스제이. ,  멘델손조셉패트릭 ,  브라운리차드윌리암 ,  리민 ,  슈왈츠리차드프랭클린 ,  유파사니산자이수드하카르

IPC: H05K3/36 ,  H05K1/14

CPC classification number: H05K3/368 ,  B23K2201/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: 2개의 회로 기판 사이에 기계적/전기적 상호접속 및 그에 따라 요구되는 상호접속 부품을 제공하는 본 발명의 방법은 각각 미부, 견부 및 헤드부를 갖는 핀과 소켓을 포함한다. 미부는 제1 기판의 도금된 관통 구멍 내에 끼워 맞춤되도록 크기가 설정되고, 헤드부는 자동화 장비가 헤드부를 포획하는 것을 허용하고 도금된 관통 구멍 내부에 삽입될 때 그 상부에 안착되는 것을 허용하도록 크기가 설정되고, 견부는 도금된 관통 구멍의 내측에 안착되고 헤드부 아래에 그리고 도금된 관통 구멍 밑으로 미리 정해진 양의 땜납이 유동하는 것을 허용하지만 미부보다 아래로 유동하는 것을 허용하지 않도록 도금된 관통 구멍에 대해 크기가 설정되어 관통 구멍 내에 핀의 중심을 맞추는 것을 돕는다. 땜납 재유동 온도로 가열하면, 핀의 헤드부와 소켓의 견부 주연 둘레에 땜납 고리가 소켓의 견부와 핀의 헤드 아래로 유동하고, 그로 인해 핀과 제1 기판 사이 및 소켓과 제2 기판 사이에 땜납된 전기적 연결부를 형성한다. 소켓과 핀을 정렬하고 소켓의 공동 내에 핀의 미부를 삽입함으로써 분리 가능하고 신뢰성 있는 기계적 전기적 상호접속부가 제1 기판과 제2 기판 사이에 형성된다.
소켓, 핀, 땜납, 상호접속부, 재유동 온도

Abstract translation: 本发明的用于在两个电路板之间提供机械/电互连以及因此所需的互连部件的方法包括销和插座，每个销和插座具有尾部，肩部和头部。 尾大小被设置为配合在穿过第一基板的通孔镀覆，头部的尺寸设置成允许所述自动化设备内时所允许的插入来捕获所述头部和通孔的镀安装在上 组，并且，肩部被镀覆，使得它不允许但允许尾下面上镀的内侧贯通孔和流至休息焊料预定流的向下头部下方的量和通孔的通孔镀 帮助将引脚置于通孔内。 当加热到流动温度钎焊材料之间，在所述头部和所述销上的插座的肩部周缘焊环，并流下肩部和插座的销的头部，从而在销和所述第一基板和所述插座和所述第二基板之间 由此形成焊接的电连接部分。 通过将插座和销对齐并将销的尾部插入插座的空腔中，在第一和第二基板之间形成可分离且可靠的机械和电气互连。

公开(公告)号：KR1020090029286A

公开(公告)日：2009-03-20

申请号：KR1020097002420

申请日：2007-07-03

Applicant: 해리스 코포레이션

Inventor： 스미스,스티븐씨. ,  스나이더,스티븐알.

IPC: H01R33/76 ,  H01L23/12 ,  H01L21/60 ,  H05K3/34

CPC classification number: H05K3/32 ,  H05K3/4015 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2201/10962 ,  Y02P70/611

Abstract: A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

Abstract translation: 球栅阵列（BGA）连接系统包括集成电路（IC）封装，其包括形成以矩阵图案布置的球栅阵列（BGA）的多个导电球。 印刷电路板（PCB）包括以相应的矩阵图形排列的多个球窝。 每个球窝包括具有接合PCB的一侧的基座和被配置用于安置BGA的导电球的相对侧。 多个插脚被固定到基座并从基座延伸并且被构造成接纳和保持导电球与基座接触。

公开(公告)号：US20180310409A1

公开(公告)日：2018-10-25

申请号：US15841324

申请日：2017-12-14

Applicant: BOSJOB COMPANY LTD.

Inventor： Liang-huan WENG ,  Min-hsiang WENG

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  B23K9/10

CPC classification number: H05K1/18 ,  B23K9/1006 ,  H05K1/0263 ,  H05K1/144 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10522 ,  H05K2201/10651 ,  H05K2201/10901

Abstract: A stacked output structure of a capacitive power supply for welding equipment, having a plurality of capacitors to be connected in parallel, two electrodes of each capacitor are respectively provided with a pin including a long pin and a short pin; at least two PCB bus plates placed in stack are provided above the capacitor is provided. A lower PCB bus plate is connected with the short pin; and a pass-through hole is provided, at a position corresponds to the long pin, on the lower PCB bus plate. The long pin passes through the pass-through hole in the lower PCB bus plate and is connected with an upper PCB bus plate. There is a gap between the long pin and an inner wall of the pass-through hole.

公开(公告)号：US09768527B2

公开(公告)日：2017-09-19

申请号：US15288538

申请日：2016-10-07

Applicant: AVX Corporation

Inventor： Peter Bishop

IPC: H01R4/24 ,  H01R4/48 ,  H01R12/53 ,  H01R12/71 ,  H05K3/32 ,  H01R4/18 ,  H01R12/70 ,  H01R13/62 ,  H05K1/11 ,  H01R101/00 ,  H05K3/34

CPC classification number: H01R4/2404 ,  H01R4/183 ,  H01R4/4836 ,  H01R12/53 ,  H01R12/70 ,  H01R12/7076 ,  H01R12/718 ,  H01R13/62 ,  H01R2101/00 ,  H05K1/111 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

公开(公告)号：US09696023B2

公开(公告)日：2017-07-04

申请号：US14653945

申请日：2013-12-16

Applicant: LEELEDS LIGHTING (XIAMEN) CO., LTD.

Inventor： Linhua Wang ,  Xiaolei Zhu ,  Lin Zhou ,  Han Zhao

IPC: F21V23/06 ,  H01R33/18 ,  H01R33/22 ,  F21V23/00 ,  H05K3/36 ,  F21K9/23 ,  F21K9/238 ,  H05K3/30 ,  F21K9/232 ,  F21Y115/10

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An electric connecting member and an LED lamp using the electric connecting member are provided. The electric connecting member is used for the electric connection between a light source substrate and a driving board of the LED lamp, and comprises an input terminal and an output terminal. The LED lamp comprises the driving board and the light source substrate. The output terminal is provided on the driving board of the LED lamp. The input terminal is disposed upon the light source substrate and is electrically connected to the light source substrate. The output terminal comprises two contacts, and one end of each of the two contacts is electrically connected to the driving board respectively. The input terminal comprises two connection heads which are respectively provided corresponding to the two contacts. One end of each of the two connection heads is electrically connected to the light source substrate respectively.