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    ISOPROPENYLPHENYLMALEIMIDE DERIVATIVE
    155.
    发明专利
    ISOPROPENYLPHENYLMALEIMIDE DERIVATIVE 失效

    公开(公告)号：JPS6064958A

    公开(公告)日：1985-04-13

    申请号：JP12753284

    申请日：1984-06-22

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OOBA MASAYUKI ,  KAWAMATA MOTOO ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

    IPC: C07D207/444 ,  C07D207/452

    Abstract: NEW MATERIAL:A compound expressed by formula I (R is halogen or 1-4C alkyl; n is an integer 0-4, provided that R may be mutually different when n is >=2). EXAMPLE:p-Isopropenylphenylmaleimide. USE:Agricultural chemicals, vulcanization accelerators, coating materials and heat- resistant adhesives, having isopropenyl and cyclic double bonds in the molecule, rich in reactivity, and useful as electrical insulating materials, used widely in solventless varnishes, casting resins, and laminating resisns, etc. utilizing the low melting point. The solventless varnishes cause no product loss nor waste, and have great advantages in the pollution, safety hygiene and effective utilization of resources. PREPARATION:An isopropenylphenylmaleimide derivative expressed by formula IIis reacted with a dehydrating agent, e.g. acetic anhydride, in a solvent in the presence of a catalyst, e.g. cobalt acetate tetrahydrate, and a tertiary amine at 20-100 deg.C for 0.5-8hr, and an alcohol as a precipitant is added thereto to give the aimed compound expressed by formula I .

    CURABLE RESIN COMPOSITION
    157.
    发明专利
    CURABLE RESIN COMPOSITION 失效

    公开(公告)号：JPS5880344A

    公开(公告)日：1983-05-14

    申请号：JP17830481

    申请日：1981-11-09

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OOBA MASAYUKI ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

    IPC: C08L79/08 ,  C08G73/00 ,  C08G73/10 ,  C08G73/12

    Abstract: PURPOSE:To provide the titled compsn. excellent in heat resistance, rapid curing and adhesion and readily soluble in general-purpose org. solvents, comprising two specified maleimide compds. and an amino compd. CONSTITUTION:A maleimide compd. (A) selected from the group consisting of an N-(alkenylphenyl)maleimide deriv. of formulaI(wherein R1-6 is H, halogen, optionally branched 1-10C alkyl, phenyl, or phenyl substd. by optionally branched 1-10C alkyl, halogen, R7O-group, formula II, OH group, or cyano group; m1+m2+m4=5; R7 is optionally branched 1-10C alkyl, phenyl, or phenyl substd. by optionally branched 1-5C alkyl, halogen), a dimer thereof, and a polymer thereof, a maleimide compd. (B) other than component A (e.g., N-ethylmaleimide), and an amino compd. (C) are mixed homogeneously and allowed to react with one another at 50-200 deg.C for 0-20hr.

    IMIDE GROUP-CONTAINING POLYMER AND MANUFACTURE OF THE SAME
    159.
    发明专利
    IMIDE GROUP-CONTAINING POLYMER AND MANUFACTURE OF THE SAME 失效

    公开(公告)号：JPS5871919A

    公开(公告)日：1983-04-28

    申请号：JP17016981

    申请日：1981-10-26

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OOBA MASAYUKI ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

    IPC: B32B15/088 ,  B32B15/08 ,  C08G61/00 ,  C08G61/10 ,  C08G61/12

    Abstract: PURPOSE:To obtain titled polymer of outstanding thermal stability, with improved processability and workability, suitable for wire coating material, heat- resistant film, heat-resistant functional material, etc., by the reaction between a polymaleimide and a specific active methylene compound. CONSTITUTION:The objective polymer can be obtained by the reaction, at 0- 160 deg.C, either in the presence or absence of an organic solvent (e.g., dimethylformamide), between (A) a polymaleimide of formulaI[R is H, halogen, 1-5C alkyl, CF3 or phenyl; R1 is a divalent hydrocarbon group derived from an aldehyde or a ketone of formula O=R1 (R1 is a 1-8C divalent hydrocarbon group); l is 0.1-10],[e.g., 1-N-maleimide-2,4-bis(4'-N-maleimidebenzyl)benzene]and (B) an active methylene compound of formula II (R2 is CN, NO2, carboxyl, etc.), e.g., malononitrile.

    CURABLE RESIN COMPOSITION
    160.
    发明专利
    CURABLE RESIN COMPOSITION 失效

    公开(公告)号：JPS57192418A

    公开(公告)日：1982-11-26

    申请号：JP7576181

    申请日：1981-05-21

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OOBA MASAYUKI ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

    IPC: C08F20/00 ,  C08F20/52 ,  C08F222/40

    Abstract: PURPOSE:A curable resin composition having improved curability and processability, having heat resistance and being used as a solventless type, consisting of an ether linkage-containing aliphatic maleimide and a polyaromatic maleimide compound. CONSTITUTION:A curable composition consisting of an aliphatic maleimide represented by formulaI[wherein R1 is H, a 1-20C hydrocarbyl, a halogen atom, R2O-, (R2OC)-, (R2)OCNH-, OH, cyano or nitro (R2 is a 1-20C hydrocarbyl or its halogen-substituted group), Q is an l-valent aliphatic ether group and l>=1]and a polymaleimide represented by formula II. The present resin composition has an advantage that it can form cured products with good flexibility, because said aliphatic maleimide and said polymaleimide compound have melting points lower than those used in usual bismaleimide resins, have remarkably excellent solubility in organic solvents and, further, said aliphatic maleimide has no benzene ring in the molecule.

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