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    Method and apparatus for soldering ball grid array modules to substrates
    151.
    发明授权
    Method and apparatus for soldering ball grid array modules to substrates 失效
    将球栅阵列模块焊接到基板的方法和装置

    公开(公告)号：US5924622A

    公开(公告)日：1999-07-20

    申请号：US683767

    申请日：1996-07-17

    Applicant: John Gillette Davis ,  Joseph Michael Kielbasa

    Inventor： John Gillette Davis ,  Joseph Michael Kielbasa

    IPC: H01L21/60 ,  B23K3/06 ,  B23K35/02 ,  B23K35/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  B23K1/00 ,  B23K3/00

    CPC classification number: H05K3/321 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/3436 ,  H05K3/3484 ,  B23K2201/42 ,  B23K35/025 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0485 ,  H05K3/3478 ,  Y02P70/613 ,  Y10T156/10

    Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240.degree. C. and in the case of the conduction adhesive, will cure below about 240.degree. C. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.

    Abstract translation: 提供了一种用于将具有焊接材料的球栅阵列或列格栅阵列的模块附接到以给定图案或覆盖区布置的模块的方法和装置，其具有以相同图案排列的连接器焊盘阵列的基板。 预成型的对准装置具有与模块上的球栅阵列或列图案相同的图案或覆盖区中的通孔阵列，以及衬底上的接触焊盘图案。 预制件中的通孔填充有可以是焊膏或固体焊料或可固化导电粘合剂的焊料材料。 焊料优选是铅锡共晶体，但是在任何情况下都具有小于约240℃的熔点，并且在导电粘合剂的情况下，将在低于约240℃下固化。在固体焊料的情况下， 焊剂材料的薄膜可以施加到预成型件的相对面上，以防止焊料从其中移出，并且当焊料回流时用作焊剂。

    Solder spray leveller
    153.
    发明授权
    Solder spray leveller 失效
    焊锡平整机

    公开(公告)号：US5876499A

    公开(公告)日：1999-03-02

    申请号：US691851

    申请日：1996-09-09

    Applicant: Peter P. Lymn

    Inventor： Peter P. Lymn

    IPC: B23K1/20 ,  B23K3/06 ,  B23K3/08 ,  H05K3/34

    CPC classification number: H05K3/3468 ,  B23K1/206 ,  B23K3/0653 ,  B23K3/0692 ,  B23K3/08 ,  B23K2201/42 ,  H05K2203/044 ,  H05K2203/0746 ,  H05K2203/0776 ,  H05K2203/1509

    Abstract: An improved horizontal solder leveller for applying molten solder to boards while removing residual flux therefrom include a single pair of upper and lower solder sparge bars with outlet nozzles arranged so as to direct solder jets from one sparge bar toward the jets from the other sparge bar in the gap formed between the sparge bars. The gap between the sparge bars and the speed of the solder jets is sufficient to remove residual flux from a board passing therethrough as molten solder is applied to the board. An oil guide is included that directs oil to form curtains immediately upstream and downstream of the sparge bar gap to form a barrier to air flow in the gap. An oil trough upstream and downstream of the lower sparge bar limits the vertical extent of the oil curtains. Preferably a pair of castellated infeed rollers and outfeed rollers are used to move boards through the leveller.

    Abstract translation: 用于将熔融焊料施加到板上同时从其中除去剩余焊剂的改进的水平焊锡平整器包括单对上下焊料喷射棒，其具有排出喷嘴，其布置成将焊接喷嘴从一个喷射棒引导到来自另一个喷射棒的喷嘴 在喷射棒之间形成的间隙。 喷射棒之间的间隙和焊接喷嘴的速度足以从熔化的焊料施加到板上去除通过其中的板的剩余通量。 包括导油器，其引导油直接在喷射棒间隙的上游和下游形成窗帘，以形成间隙中的空气流动的障碍。 下喷嘴条上游和下游的油槽限制了油帘的垂直范围。 优选地，使用一对花式进料辊和出料辊来移动板通过整平机。

    Hole generation and lead forming for integrated circuit lead frames using laser machining
    154.
    发明授权
    Hole generation and lead forming for integrated circuit lead frames using laser machining 失效
    使用激光加工的集成电路引线框孔产生和引线成型

    公开(公告)号：US5767480A

    公开(公告)日：1998-06-16

    申请号：US508513

    申请日：1995-07-28

    Applicant: Noah L. Anglin ,  Nick Bacile ,  Vladimir Perelman

    Inventor： Noah L. Anglin ,  Nick Bacile ,  Vladimir Perelman

    IPC: B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  H01L21/48 ,  H01L23/495 ,  B23K26/00

    CPC classification number: B23K26/361 ,  B23K26/362 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/4821 ,  H01L23/49541 ,  B23K2201/42 ,  B23K2203/05 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  H01L2924/0002 ,  Y10T29/49121

    Abstract: Lead frames for integrated circuit packaging are partly fabricated using laser machining to form the very small diameter (0.005 to 0.010 diameter) holes in the lead frames which are later used for epoxy adhesive penetration. A high power Nd:YAG laser provides a laser beam which is moved and focused by a control unit onto the surface of a continuous stock strip in order is to drill the epoxy holes at the desired locations. A similar apparatus, but using a copper vapor laser, can trim very fine pitch (0.005 inch) leads for the lead frames. The remaining parts of the lead frames, which involve larger sized elements, are formed conventionally by using stamping or etching. By controlling the laser operating parameters in terms of laser power, pulse duration and pulse frequency and by control of the location of the laser beam by deflecting galvanometers, very precise cutting and drilling can be accomplished, with accuracy down to 0.00005 inch or less. Tooling costs are thereby reduced and in addition new types of lead frames with very closely spaced lead tips can be fabricated that cannot be fabricated using conventional processes.

    Abstract translation: 用于集成电路封装的引线框架部分地使用激光加工制造，以在引线框架中形成非常小的直径（0.005至0.010直径）的孔，后来用于环氧树脂粘合剂渗透。 高功率Nd：YAG激光器提供激光束，其由控制单元移动和聚焦到连续坯料的表面上，以便在期望的位置钻出环氧树脂孔。 类似的设备，但使用铜蒸气激光器，可以修剪引线框架的非常细的间距（0.005英寸）引线。 引导框架的其余部分涉及更大尺寸的元件，通常通过使用冲压或蚀刻来形成。 通过根据激光功率，脉冲持续时间和脉冲频率控制激光器的工作参数，并通过偏转电流计控制激光束的位置，可以精确地进行精确的切割和钻孔，精度低至0.00005英寸或更小。 从而减少了模具成本，此外，可以制造不能使用常规工艺制造的具有非常紧密间隔的引线头的新型引线框架。

    Plate assembly and soldering device for changing screens of circuit boards using soldering and method of application thereof
    157.
    发明授权
    Plate assembly and soldering device for changing screens of circuit boards using soldering and method of application thereof 失效

    公开(公告)号：US5641112A

    公开(公告)日：1997-06-24

    申请号：US497625

    申请日：1995-06-30

    Applicant: Vahid Moradi ,  Farid Moradi

    Inventor： Vahid Moradi ,  Farid Moradi

    IPC: B23K3/08 ,  H05K3/34 ,  B23K3/00

    CPC classification number: B23K3/08 ,  B23K2201/42 ,  H05K3/34

    Abstract: This invention provides a plate assembly to be used with a soldering device for changing screens of circuit boards by soldering. The plate assembly comprises a horizontal bottom plate having a number of cylindrical passages extending therethrough; a number of narrow horizontal top plates having a number of cylindrical passages extending therethrough; a number of pads with a number of cylindrical passages extending therethrough, with each of said number of pads being placed horizontally in between the horizontal bottom plate and one of the number of narrow horizontal top plates such that each of the number of cylindrical passages through the number of narrow horizontal top plates is aligned with one of the number of cylindrical passages in the number of pads and with one of the number of cylindrical passages in the horizontal bottom plate and with one of a number of screws passing through each of the number of aligned cylindrical passages of the number of narrow horizontal top plates, of the number of pads, and of the horizontal bottom plate; a number of fixture pins being erected tightly and vertically in one of the number of cylindrical passages through the horizontal bottom plate while protruding over and above the horizontal bottom plate; and a number of guiding pins erected vertically and tightly in one of the number of cylindrical passages through the horizontal bottom plate while protruding over and above the horizontal bottom plate. The soldering device comprises: a three-dimensional, polygonal heat head having a bottom surface which comes into contact with the screen, a top surface which runs parallel to the bottom surface and which is wider than the bottom surface, said top surface being connected to a shank, a number of cylindrical passages extending from the bottom surface to the top surface through the heat head, a first side wall, a second side wall, a first end wall and a second end wall, said first side wall and said second side wall joining the bottom surface to the top surface of the heat head; and a heating handle which secures said shank of the heat head.

    Automatic reflow soldering system
    159.
    发明授权
    Automatic reflow soldering system 失效
    自动回流焊接系统

    公开(公告)号：US5573174A

    公开(公告)日：1996-11-12

    申请号：US290074

    申请日：1994-08-15

    Applicant: Robert Pekol

    Inventor： Robert Pekol

    IPC: B23K1/008 ,  H05K3/34 ,  B23K1/012

    CPC classification number: H05K3/3494 ,  B23K1/008 ,  B23K2201/42 ,  H05K2203/086 ,  H05K2203/087

    Abstract: A reflow soldering system includes a reflow station with one or more soldering containers. Each container includes a base and a cover reciprocable to either open or close the container. When open, the container receives a printed circuit board/electrical circuit component assembly for reflow soldering, or permits the exit of such assembly after soldering. When closed, the container provides a fluid-tight seal between the chamber inside and the immediate outside environment. Container opening and closure are synchronized with an input conveyor providing assemblies to the container and an output conveyor removing the soldered assemblies, both of which are operated by a control system at a controlled rate of speed. When the container is closed, its internal environment is precisely controlled through heating elements in the container and several conduits for supplying air (heated if desired), for supplying an inert gas, and for drawing a vacuum. Further embodiment soldering systems employ pluralities of the containers and guides for selectively diverting different assemblies to different containers for enhanced flexibility and throughput.

    Abstract translation: 回流焊接系统包括具有一个或多个焊接容器的回流站。 每个容器包括一个底座和一个往复运动以打开或关闭容器的盖子。 打开时，容器接收用于回流焊接的印刷电路板/电路元件组件，或者允许在焊接之后退出该组件。 当关闭时，容器在室内和直接外部环境之间提供流体密封。 容器打开和关闭与输送输送机同步，该输送输送机提供组件到容器，以及输出输送机，其移除焊接组件，两者都以控制速度以控制系统操作。 当容器关闭时，其内部环境通过容器中的加热元件和用于供应空气（如果需要加热），用于供应惰性气体和用于抽真空的若干导管精确地控制。 进一步的实施例焊接系统采用多个容器和引导件，用于选择性地将不同的组件转向不同的容器，以增强柔性和生产量。

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