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    Micro-actuator and locking switch
    153.
    发明授权
    Micro-actuator and locking switch 有权
    微执行器和锁定开关

    公开(公告)号：US08120133B2

    公开(公告)日：2012-02-21

    申请号：US11519142

    申请日：2006-09-11

    Applicant: Flavio Pardo

    Inventor： Flavio Pardo

    IPC: H01L29/12

    CPC classification number: H01H61/04 ,  B81B3/0024 ,  B81B2201/018 ,  H01H2001/0047 ,  H01H2061/006 ,  H01H2061/008

    Abstract: A micro-electromechanical actuator employs metal for the hot arm and silicon for at least the flexible portion of the cold arm. The cold arm made of silicon is coupled to a metal wire that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches.

    Abstract translation: 微机电致动器至少将冷臂的柔性部分用于热臂和硅的金属。 由硅制成的冷臂联接到与其一起移动的金属线，并且当至少两个这样的致动器形成开关时，用于承载要切换的信号。 第一芯片上的这种开关的阵列可以与倒装芯片接合到第一芯片的第二芯片协同地布置，第二芯片具有将电控制电流路由到各种热臂以加热它们的电线， 信号由各种开关切换。

    Micromachine and Method for Manufacturing the Same
    154.
    发明申请
    Micromachine and Method for Manufacturing the Same 有权
    微机械及其制造方法

    公开(公告)号：US20110281389A1

    公开(公告)日：2011-11-17

    申请号：US13189734

    申请日：2011-07-25

    Applicant: Mayumi Mikami ,  Konami Izumi

    Inventor： Mayumi Mikami ,  Konami Izumi

    IPC: H01L21/00

    CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00166 ,  H01H1/58 ,  H01H2001/0052 ,  H01H2001/0057 ,  Y10T29/49155

    Abstract: A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a different wiring (upper connection wiring) over the sacrificial layer, so that thinning, disconnection, and the like of the wiring formed over the sacrificial layer at a step portion generated due to the thickness of the sacrificial layer can be prevented. The wiring over the sacrificial layer is formed of the same conductive film as an upper driving electrode which is a movable electrode and is thus thin. However, the different wiring is formed over a structural layer, which is formed by a CVD method and has a rounded step, and has a thickness of 200 nm to 1 μm, whereby thinning, disconnection, and the like of the wiring can be further prevented.

    Abstract translation: 在形成有表面微机械加工技术的微型机械（MEMS机构）中，提供了防止配线断线和断线的结构。 在牺牲层之上的布线（上辅助布线）在牺牲层上电连接到不同的布线（上连接布线），从而在生成的台阶部分上形成在牺牲层上的布线的变薄，断开等 由于可以防止牺牲层的厚度。 牺牲层上的布线由与作为可动电极的上驱动电极相同的导电膜形成，因此薄。 然而，不同的布线形成在通过CVD法形成并具有圆形台阶的结构层上，并且具有200nm至1μm的厚度，从而可以进一步布线的变薄，断开等 防止了

    Latching zip-mode actuated mono wafer MEMS switch method
    155.
    发明授权
    Latching zip-mode actuated mono wafer MEMS switch method 有权
    闭锁拉链模式致动单晶片MEMS开关方法

    公开(公告)号：US07977137B1

    公开(公告)日：2011-07-12

    申请号：US12152130

    申请日：2008-05-08

    Applicant: John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser ,  Donald E. Strawser, legal representative

    Inventor： John L. Ebel ,  Rebecca Cortez ,  Kevin D. Leedy ,  Richard E. Strawser

    IPC: H01L21/00

    CPC classification number: H01H59/0009 ,  B81B7/0064 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2207/096 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01H2059/0045

    Abstract: A process for making a latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers and liquid removal of these layers in order to also provide needed permanent physical protection for an ultra fragile switch moving arm member. Latched operation of the achieved MEMS switch without use of conventional holding electrodes or magnetic fields is also achieved. Fabrication of a single MEMS switch is disclosed however large or small arrays may be achieved. A liquid removal based fabrication process is disclosed.

    Abstract translation: 公开了一种用于制造特别适用于微波射频信号的电容耦合信号切换的闭锁拉链模式致动单晶片MEMS开关的方法。 用于开关的单个晶片制造工艺采用牺牲层和这些层的液体移除，以便为超脆弱的开关移动臂构件提供所需的永久物理保护。 还实现了不使用常规保持电极或磁场的实现的MEMS开关的锁定操作。 公开了单个MEMS开关的制造，但是可以实现大的或小的阵列。 公开了一种基于液体去除的制造方法。

    MEMS device using an actuator
    156.
    发明授权
    MEMS device using an actuator 有权
    使用致动器的MEMS器件

    公开(公告)号：US07940514B2

    公开(公告)日：2011-05-10

    申请号：US11746813

    申请日：2007-05-10

    Applicant: Tamio Ikehashi

    Inventor： Tamio Ikehashi

    IPC: H01G5/00 ,  H01G7/00

    CPC classification number: B81B3/0072 ,  B81B2201/018 ,  H01G5/16 ,  H01H59/0009

    Abstract: A micro-electro-mechanical system (MEMS) includes a first electrode interposed between a first fixed end and a second fixed end, the first electrode being movable by an actuator element. The MEMS also includes a substrate on which the first and second fixed ends are located. The MEMS further includes a second electrode formed on the substrate to face the first electrode. A shape from the first electrode to the first fixed end and a shape from the first electrode to the second fixed end are asymmetrical, the first electrode to be lowered to the second electrode.

    Abstract translation: 微电子机械系统（MEMS）包括插入在第一固定端和第二固定端之间的第一电极，第一电极可由致动器元件移动。 MEMS还包括其上定位有第一和第二固定端的衬底。 MEMS还包括形成在基板上以面对第一电极的第二电极。 从第一电极到第一固定端的形状和从第一电极到第二固定端的形状是不对称的，第一电极被降低到第二电极。

    MOVABLE DEVICE
    158.
    发明申请
    MOVABLE DEVICE 有权
    可移动设备

    公开(公告)号：US20090021884A1

    公开(公告)日：2009-01-22

    申请号：US12237681

    申请日：2008-09-25

    Applicant: Shunji Nakamura

    Inventor： Shunji Nakamura

    IPC: H02N2/04 ,  G02B26/08 ,  G01P15/00

    CPC classification number: B81B3/0059 ,  B81B2201/018 ,  B81B2201/047 ,  B81B2203/0109 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058

    Abstract: A movable device simultaneously enabling reduction of size down to the submicron level, higher speed operation, a streamlined production process, low costs, and greater reliability. A movable device provided with bottom electrodes and a basic conductive layer fixed to a substrate, an elastic shaft of a carbon nanotube with a bottom end fixed on the basic conductive layer and standing up, and a top structure including a top electrode spaced away from the bottom electrode and fixed to a top end of the elastic shaft, wherein when applying voltage between a bottom electrode and the top electrode, the top electrode displaces relatively to the bottom electrodes within an allowable range of elastic deformation of the elastic shaft.

    Abstract translation: 可移动装置同时能够将尺寸减小到亚微米级，更高的速度操作，简化的生产过程，低成本和更高的可靠性。 一种可移动装置，其具有底部电极和固定在基板上的基本导电层，碳纳米管的弹性轴，其底端固定在基本导电层上并竖立起来，顶部结构包括顶部电极， 底部电极并固定到弹性轴的顶端，其中当在底部电极和顶部电极之间施加电压时，顶部电极在弹性轴的弹性变形的允许范围内相对于底部电极移位。

    Micro-actuator and locking switch
    159.
    发明申请
    Micro-actuator and locking switch 有权
    微执行器和锁定开关

    公开(公告)号：US20080061387A1

    公开(公告)日：2008-03-13

    申请号：US11519142

    申请日：2006-09-11

    Applicant: Flavio Pardo

    Inventor： Flavio Pardo

    IPC: H01L29/82

    CPC classification number: H01H61/04 ,  B81B3/0024 ,  B81B2201/018 ,  H01H2001/0047 ,  H01H2061/006 ,  H01H2061/008

    Abstract: A micro-electromechanical actuator employs metal for the hot arm and silicon for at least the flexible portion of the cold arm. The cold arm made of silicon is coupled to a metal wire that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches.

    Abstract translation: 微机电致动器至少将冷臂的柔性部分用于热臂和硅的金属。 由硅制成的冷臂联接到与其一起移动的金属线，并且当至少两个这样的致动器形成开关时，用于承载要切换的信号。 第一芯片上的这种开关的阵列可以与倒装芯片接合到第一芯片的第二芯片协同地布置，第二芯片具有将电控制电流路由到各种热臂以加热它们的电线， 信号由各种开关切换。

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