Abstract:
An inkjet printhead with a nozzle plate that has an exterior surface with formations for reducing its co-efficient of static friction. By reducing the co-efficient of static friction, there is less likelihood that paper dust or other contaminants will clog the nozzles in the nozzle plate. Static friction, or “stiction” as it has become known, allows dust particles to “stick” to nozzle plates and thereby clog nozzles. By patterning the exterior of the nozzle plate with raised formations, dust particles can only contact the outer extremities of each formation. This reduces friction between the particles and the nozzle plate so that any particles that contact the plate are less likely to attach, and if they do attach, they are more likely to be removed by printhead maintenance cleaning cycles.
Abstract:
A method of forming a low-stiction nozzle plate for an inkjet printhead, said nozzle plate having a plurality of nozzle apertures defined therein, each nozzle aperture having a respective nozzle rim, said method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of inkjet nozzle assemblies sealed with roof material; (b) etching partially into said roof material to define simultaneously said nozzle rims and a plurality of stiction-reducing formations; and (c) etching through said roof material to define said nozzle apertures, thereby forming said nozzle plate.
Abstract:
A thermal bend actuator (6) is provided with a group of upper arms (23, 25, 26) and a group of lower arms (27, 28) which are non planar, so increasing the stiffness of the arms. The arms (23, 25, 26,27,28) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material
Abstract:
The described embodiments relate to slotted substrates and methods of forming same. One exemplary method forms a first slot portion into a first surface of a substrate, the first slot portion defining a footprint at the first surface. The method also forms a second slot portion through the first slot portion; and, forms a third slot portion through a second surface of the substrate sufficiently to intercept the second slot portion to form a fluid-handling slot through the substrate.
Abstract:
A method of manufacturing a fluid injection device. The method of the present invention applies a compensated geometric shape of the unetched isolating portions to increase the additional compensated portion for etching, or the ion implanting process to reduce the etching rate of the unetched isolating portions. Thus, crosstalk or overshoot in the isolating portions of the fluid injection device can be reduced, and the fluid injection device can be precisely manufactured in a small size.
Abstract:
A thermal bend actuator (6) is provided with upper arms (23, 25, 26) and lower arms (27, 28) which are non planar, so increasing the stiffness of the arms. The arms (23, 25, 26, 27, 28) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material.
Abstract:
Method of forming a complex, minute three-dimensional structure, known as micromachining, which includes forming a plurality of thin films at least one of which is provided as a temporary layer composed of a lower layer made of an organic material and an upper layer made of an amphoteric metal material which is formed on the lower layer; and selectively removing the temporary layer to provide a three-dimensional structure. The temporary layer may comprise a composite sacrificial layer of photoresist and aluminum.
Abstract:
Three dimensional silicon structures are fabricated from (100) silicon wafers by a single side, multiple step ODE etching process. All etching masks are formed one on top of the other prior to the initiation of etching, with the coarsest mask formed last and used first. Once the coarse anisotropic etching is completed, the coarse mask is removed and the finer anisotropic etching is done. The preferred embodiment is described using a thermal ink jet channel plate as the three dimensional structure, where coarse etching step provides the reservoir and the fine etching step provides the ink channels.
Abstract:
Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
Abstract:
A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.