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公开(公告)号：US20060118641A1
公开(公告)日：2006-06-08
申请号：US11176326
申请日：2005-07-08
Applicant: Yi-sung Hwang , Sung-dae Cho
Inventor： Yi-sung Hwang , Sung-dae Cho
IPC: G06K19/06
CPC classification number: H05K1/117 , G06K19/07732 , G06K19/07743 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2924/181 , H01L2924/19107 , H05K1/141 , H05K2201/043 , H05K2201/09845 , H05K2201/10977 , H05K2203/049 , H01L2924/00014 , H01L2924/00012
Abstract: A semiconductor device and method of fabricating the same. The semiconductor device includes at least one first contact pin on a first substrate and at least one second contact pin on a second substrate. The at least one first and second contact pins may be included in first and second contact pin arrays. The first and second contact pins of the first and second contact pin arrays may be aligned.
Abstract translation: 一种半导体器件及其制造方法。 半导体器件包括在第一衬底上的至少一个第一接触引脚和在第二衬底上的至少一个第二接触引脚。 所述至少一个第一和第二接触销可以包括在第一和第二接触针阵列中。 第一和第二接触针阵列的第一和第二接触引脚可以对准。
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152.发明申请公开(公告)号：US20050184381A1
公开(公告)日：2005-08-25
申请号：US11060550
申请日：2005-02-18
Applicant: Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
Inventor： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC: H01R13/24 , H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/34 , H05K3/36 , H05K3/40 , H01R27/02 , H01L23/48 , H01R12/00 , H01R25/00 , H01R31/00 , H01R33/88 , H01R33/90 , H01R33/92 , H01R33/94
CPC classification number: H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
Abstract: A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.
Abstract translation: 提供了可以在没有通孔形成步骤的情况下制造的连接构件。 连接构件100包括绝缘基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面。
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公开(公告)号：US20040264140A1
公开(公告)日：2004-12-30
申请号：US10487895
申请日：2004-02-26
Inventor： Olaf Lucke , Bernd Thyzel
IPC: H05K007/20
CPC classification number: H01L23/3735 , H01L25/072 , H01L2224/291 , H01L2224/32225 , H05K1/0271 , H05K1/0306 , H05K3/0061 , H05K2201/043 , H05K2203/1572 , H01L2924/014
Abstract: The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face condutor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part (9) of a housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.
Abstract translation: 本发明涉及一种电力电子部件，其包括平面陶瓷基板（2），其平面陶瓷基板（2）的一个面上安置导轨（6）以厚膜技术施加，用于电连接电路的电力部件（7） 也设置在陶瓷基板（2）上。 具有其另一面的陶瓷基板（2）钎焊到用作散热器的金属支撑元件（1）上。 支撑元件（1）与以热传导方式容纳支撑元件（1）的壳体的导热壳体部分（9）连接。 在背离陶瓷基板（2）的支撑元件（1）的表面上，与陶瓷基板（2）大致相反，第二陶瓷基板（4）钎焊到承载电路的陶瓷基板（2）上， 具有大致相同的尺寸。
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公开(公告)号：US20030070837A1
公开(公告)日：2003-04-17
申请号：US10263185
申请日：2002-10-03
Inventor： Mitsutoshi Okami
IPC: H05K001/16
CPC classification number: H05K3/445 , H05K1/0219 , H05K1/144 , H05K3/0061 , H05K3/3447 , H05K3/368 , H05K3/4046 , H05K2201/043 , H05K2201/09809 , H05K2201/10287 , H05K2201/10303 , H05K2201/10371
Abstract: A transmitter includes an RF board having a circuit for processing high frequency signals, an IF board having a circuit for processing intermediate frequency signals, a shield plate formed of a conductive material arranged between the boards for shielding electromagnetic waves generated from the circuits, a board-to-board connecting wire inserted to a through hole based by a gap sufficient to avoid electric influence from an inner wall surface of the through hole provided in the shield plate, to be connected to through hole lands provided on the RF board and a IF board, respectively, and connectors formed of an insulating material and attached near opposite ends of the board-to-board connecting wire and sandwiching the shield plate, for fixing the board-to-board connecting wire to the shield plate. This provides a wiring connection structure that facilitates connection between circuit boards with each other and stably realizes normal signal transmission.
Abstract translation: 发射机包括具有用于处理高频信号的电路的RF板，具有用于处理中频信号的电路的IF板，由布置在板之间的导电材料形成的屏蔽板，用于屏蔽从电路产生的电磁波;板 基板连接线以足够的间隙插入到通孔中，该间隙足以避免来自设在屏蔽板上的通孔的内壁表面的电力影响，以连接到设置在RF板上的通孔焊盘和IF 以及由绝缘材料形成并且连接在板对板连接线的相对端并夹持屏蔽板的连接器，用于将板对板连接线固定到屏蔽板。 这提供了一种有助于电路板彼此连接并且稳定地实现正常信号传输的布线连接结构。
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155.发明授权
公开(公告)号：US3395318A
公开(公告)日：1968-07-30
申请号：US61572967
申请日：1967-02-13
Applicant: GEN PRECISION INC
Inventor： LOTHAR LAERMER , PRETTY ARTHUR J , PHILIP GRAY
CPC classification number: H01L23/60 , H01L23/3735 , H01L23/642 , H01L2924/0002 , H05K1/0203 , H05K1/0218 , H05K1/0237 , H05K1/0289 , H05K1/0298 , H05K1/144 , H05K3/0061 , H05K3/386 , H05K2201/043 , H05K2201/096 , H05K2201/10553 , H05K2201/10689 , H01L2924/00
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Patent Agency Ranking
公开(公告)号：JP4947976B2
公开(公告)日：2012-06-06
申请号：JP2005513978
申请日：2004-09-10
Applicant: ユニチカ株式会社
CPC classification number: H05K1/036 , H05K1/0346 , H05K1/0393 , H05K2201/0195 , H05K2201/043 , Y10T428/24917 , Y10T428/31511 , Y10T428/31515 , Y10T428/31681 , Y10T428/31721
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公开(公告)号：JPWO2007105469A1
公开(公告)日：2009-07-30
申请号：JP2008505035
申请日：2007-02-26
Applicant: パナソニック株式会社
Inventor： 正三 越智 , 正三 越智 , 内田 修 , 内田 修 , 茂昭 酒谷 , 茂昭 酒谷 , 大輔 櫻井 , 大輔 櫻井 , 将人 森 , 将人 森 , 博 櫻井 , 博 櫻井 , 西川 英信 , 英信 西川
IPC: G06K19/077 , G06K19/07 , H01Q7/06 , H05K1/14 , H05K3/36
CPC classification number: H01Q1/22 , G06K19/07732 , G06K19/07749 , H01Q7/06 , H05K1/0218 , H05K1/144 , H05K1/148 , H05K1/16 , H05K2201/043 , H05K2201/086 , Y10T29/4913
Abstract: カード型情報装置(1)は、電子部品を一方の面に実装した配線パターンとアンテナ接続電極を有する配線基板(10)と、アンテナ端子電極(13)を有するアンテナパターン(14)が一方の面に形成されたアンテナ基板(15)と、配線基板(10)とアンテナ基板(15)を対向させて配置し、その間に設けられた磁性体(16)と、アンテナ接続電極とアンテナ端子電極(13)を接続するフレキシブル配線基板(17)と、配線基板(10)、アンテナ基板(15)、磁性体(16)およびフレキシブル配線基板(17)を内蔵する筐体(19)と、を備え、配線基板(10)とアンテナ基板(15)が同じ絶縁性母基板で構成される。
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公开(公告)号：JP2008112967A
公开(公告)日：2008-05-15
申请号：JP2007194058
申请日：2007-07-26
Applicant: Agie Sa , Charmilles Technologies Sa , アギー エスアー , シャルミーユ テクノロジーズ エスアー
Inventor： BUEHLER ERNST , D AMARIO RINO , KNAAK RETO
CPC classification number: H01L23/3735 , B23H1/02 , B23H11/00 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H05K1/0206 , H05K1/0272 , H05K1/144 , H05K3/0061 , H05K2201/0187 , H05K2201/043 , H05K2201/10166 , Y10T29/49139 , Y10T428/24008 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a circuit board unit for removing the heat dissipated from SMDs in power electronic applications, and to provide a method for production thereof. SOLUTION: The circuit board unit comprises a circuit board topmost laminate 8 with conductive tracks 10 on the upper side for mounting surface-mountable devices SMDs 12, 14. The circuit board topmost laminate 8 features a thickness dimensioned such that the anticipated heat dissipated by the SMDs 12 is transported from the upper side to the underside of the circuit board topmost laminate 8 to good effect. The circuit board unit further comprises an electrically insulating laminate 9 arranged under the circuit board topmost laminate 8, inserts 15 made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate 9 at sides below SMDs 12 with high heat dissipation, and a cooling plate 16 arranged below the electrically insulating laminate 9 and the inserts 15. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种用于去除在电力电子应用中从SMD消散的热量的电路板单元，并提供其生产方法。 解决方案：电路板单元包括电路板最上层叠体8，其上侧具有导电轨道10，用于安装表面可安装装置SMD 12,14。电路板最顶层压板8的厚度尺寸设计成使预期热量 通过SMD 12耗散的电极从最上层叠体8的上侧输送到下侧，具有良好的效果。 电路板单元还包括布置在电路板最顶层叠体8下方的电绝缘层压体9，具有良好导热性的材料制成的插入物15和嵌入电绝缘层压体9中的绝缘层压体9的低绝缘层12的散热高度， 以及布置在电绝缘层压板9和插入件15下方的冷却板16。版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP3846437B2
公开(公告)日：2006-11-15
申请号：JP2003071201
申请日：2003-03-17
Applicant: 株式会社日立製作所
IPC: B60R16/02 , H01L25/18 , F02D41/00 , H01L23/29 , H01L23/31 , H01L23/473 , H01L23/495 , H01L25/04 , H05K1/02 , H05K1/14 , H05K3/00
CPC classification number: H05K1/144 , H01L23/3107 , H01L23/473 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H05K1/0203 , H05K3/0061 , H05K5/0082 , H05K2201/043 , H05K2201/10924 , H05K2203/049 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
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公开(公告)号：JP3826007B2
公开(公告)日：2006-09-27
申请号：JP2001313678
申请日：2001-10-11
Applicant: シャープ株式会社
Inventor： 光敏 岡見
CPC classification number: H05K3/445 , H05K1/0219 , H05K1/144 , H05K3/0061 , H05K3/3447 , H05K3/368 , H05K3/4046 , H05K2201/043 , H05K2201/09809 , H05K2201/10287 , H05K2201/10303 , H05K2201/10371
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