公开(公告)号：JP5266235B2

公开(公告)日：2013-08-21

申请号：JP2009533505

申请日：2007-10-17

Applicant: フライズ・メタルズ・インコーポレイテッドFry’S Metals, Inc

Inventor： マルジ，マイケル・ティー ,  ケップ，ポール ,  デ・モンチ，ミヒル・アー ,  フィンク，マルティナス・エヌ ,  ルイス，ブライアン

IPC: B23K1/00 ,  B23K1/005 ,  B23K35/26 ,  B23K101/40 ,  B23K101/42 ,  C22C11/06 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C28/00 ,  H01L31/042

CPC classification number: H05K3/3484 ,  B23K35/262 ,  B23K35/264 ,  B23K35/302 ,  H01L23/3736 ,  H01L24/83 ,  H01L31/02008 ,  H01L31/048 ,  H01L2224/8181 ,  H01L2224/81825 ,  H01L2224/83224 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/13055 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02E10/50 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.

Abstract translation: 本文公开的某些实例涉及被设计用于诸如印刷电路板和太阳能电池的电气设备的互连中的材料。 在某些实例中，可以使用两步焊料来减少用于电气设备生产中的材料的应力。

公开(公告)号：JP4938980B2

公开(公告)日：2012-05-23

申请号：JP2004537867

申请日：2003-09-12

Applicant: インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： インテランテ、マリオ ,  サブリンスキ、ウィリアム、エドワード ,  ファーコック、ムクタ、ジー

IPC: B23K1/00 ,  B23K35/26 ,  B23K35/14 ,  B23K101/40 ,  B23K101/42 ,  C22C13/00 ,  H05K3/34

CPC classification number: B23K1/0016 ,  B23K35/262 ,  B23K2201/36 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613

公开(公告)号：JP4659262B2

公开(公告)日：2011-03-30

申请号：JP2001134532

申请日：2001-05-01

Applicant: 富士通セミコンダクター株式会社

Inventor： 和之 今村 ,  修 山口 ,  康則 藤本 ,  俊也 赤松

IPC: H01L21/60 ,  H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01R4/04 ,  H01R43/02 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01R4/04 ,  H01R43/0256 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the mounting substrate, the flux paste includes a base flux and metal grains having diameters smaller than the diameters of projection electrodes and having a thickness so as to form a space between the flux paste and the electronic part when the electronic part is mounted on the mounting substrate and the flux paste is arranged on the mounting substrate. A resin is sealed in the space formed between the electronic part and the mounting substrate after the projection electrodes are joined to the connection terminals.

公开(公告)号：JP4200325B2

公开(公告)日：2008-12-24

申请号：JP2004320232

申请日：2004-11-04

Applicant: パナソニック株式会社

Inventor： 憲 前田 ,  忠彦 境

IPC: H05K3/34 ,  B23K1/00 ,  B23K35/22

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

公开(公告)号：JP2008193036A

公开(公告)日：2008-08-21

申请号：JP2007047953

申请日：2007-01-31

Applicant: Tamura Kaken Co Ltd ,  タムラ化研株式会社

Inventor： SAWA KAZUNORI ,  AKAIKE SHINICHI

IPC: H01L23/12

CPC classification number: C22C12/00 ,  C08G59/4207 ,  C08G59/681 ,  C09J163/00 ,  H01L23/49866 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10992 ,  H05K2203/041 ,  H01L2224/0401

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor package substrate for mounting conductive balls, and the like, a method of manufacturing the same, and a conductive joint material for the semiconductor package substrate, whereby conductive balls or conductive pins can be joined to the conductive lands or through holes of the semiconductor package substrate at low temperatures, and the conductivity of the circuit connection of solder joints and the bonding strength of an adhesive can be improved, at the same time. SOLUTION: The semiconductor package substrate for mounting conductive balls and the like has conductive balls or conductive pins mounted on the conductive lands or the through holes of the semiconductor package substrate, wherein the conductive balls or conductive pins are conductively jointed to the conductive lands or through holes, by reflow of at least a low-melting lead-free SnBi solder material and a conductive joint material containing a thermosetting adhesive resin that has flux action. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种用于安装导电球的半导体封装基板等，其制造方法以及用于半导体封装基板的导电接头材料，由此导电球或导电引脚可以接合 在低温下通向半导体封装基板的导电焊盘或通孔，同时可以提高焊点的电路连接的导电性和粘接剂的粘接强度。 解决方案：用于安装导电球等的半导体封装基板具有安装在导电焊盘或半导体封装基板的通孔上的导电球或导电引脚，其中导电球或导电引脚导电地连接到导电 通过回流至少一种低熔点无铅SnBi焊料材料和含有具有助焊剂作用的热固性粘合剂树脂的导电接头材料。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP3918779B2

公开(公告)日：2007-05-23

申请号：JP2003169077

申请日：2003-06-13

Applicant: 松下電器産業株式会社

Inventor： 修 ▲藏▼元 ,  茂 岩崎 ,  稔 日比野 ,  至徳 河村 ,  賢司 浅井 ,  博 甲斐 ,  博史 赤松

IPC: B23K1/00 ,  H05K3/34 ,  B23K1/008 ,  B23K1/19 ,  B23K3/06 ,  B23K35/22 ,  B23K35/26 ,  B23K101/42 ,  C22C13/00

CPC classification number: H05K3/3415 ,  B23K3/0638 ,  B23K2201/42 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0545 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T428/12493

公开(公告)号：JP2007036059A

公开(公告)日：2007-02-08

申请号：JP2005219548

申请日：2005-07-28

Applicant: Sharp Corp ,  シャープ株式会社

Inventor： KINOSHITA KAZUO

IPC: H05K3/34 ,  H01L21/60 ,  H05K1/18

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3463 ,  H05K3/368 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: PROBLEM TO BE SOLVED: To achieve a solder joint mounting structure in which a heavy component is solder joined to a substrate by self-alignment.
SOLUTION: In a camera module structure, a substrate electrode 2 formed on a printed board 1 and a mounting electrode 4 formed in a camera module 3 mounted on the printed board 1 are joined through a solder joint 5 while being self-aligned. The solder joint 5 is constituted of a first solder portion 6 and a second solder portion 7 having different characteristics.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了实现其中重组分通过自对准将焊料接合到衬底的焊料接合安装结构。 解决方案：在相机模块结构中，形成在印刷板1上的基板电极2和形成在安装在印刷板1上的相机模块3中的安装电极4通过焊接接头5接合，同时自对准 。 焊点5由具有不同特性的第一焊料部分6和第二焊料部分7构成。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006134982A

公开(公告)日：2006-05-25

申请号：JP2004320232

申请日：2004-11-04

Applicant: Matsushita Electric Ind Co Ltd ,  松下電器産業株式会社

Inventor： MAEDA KEN ,  SAKAI TADAHIKO

IPC: H05K3/34 ,  B23K1/00 ,  B23K35/22 ,  B23K101/42

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a paste for solder jointing and a solder jointing method capable of cooping with the solder junction and insulation.
SOLUTION: In the flux including metal powder used by interposition between a bump and a circuit electrode at the time of mounting electronic components by solder junction, a metal powder 8 mixed for improving solder wettability is constituted such that the surface of a core metal 8a formed with metal, such as tin and zinc. It is covered with a surface metal 8b formed with the precious metals, such as gold and silver. In the reflow process of solder junction, a surface metal 8bga is diffused into a core metal 8a by heating, and is taken in in the state of dissolution. At the time of the end of reflow, the core metal 8a is formed in an oxidized state on the surface of metal powder 8 so that it may be covered with oxide film 8c stabilized electrically. Consequently, the metal powder 8 does not remain as a residual substance after reflowing in the state of being easy to cause migration so as to cope with the solder junction and insulation.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供用于焊接接合的焊膏和能够与焊接接合部和绝缘体配合的焊接接合方法。 解决方案：在通过焊接接合安装电子部件时，通过包括在凸块和电路电极之间插入的金属粉末的焊剂，构成为了提高焊料润湿性而混合的金属粉末8，使得芯的表面 由金属形成的金属8a，例如锡和锌。 它被形成有贵金属（例如金和银）的表面金属8b覆盖。 在焊接接头的回流工艺中，表面金属8bga通过加热而扩散到芯金属8a中，并以溶解状态进入。 在回流结束时，芯金属8a在金属粉末8的表面上以氧化状态形成，使得其可以被电气稳定的氧化物膜8c覆盖。 因此，在容易发生迁移的状态下，金属粉末8在回流之后不会残留在残留物中，从而可以应对焊点和绝缘。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005057285A

公开(公告)日：2005-03-03

申请号：JP2004223374

申请日：2004-07-30

Applicant: Cts Corp ,  シーティーエス・コーポレーションCts Corporation

Inventor： BLOOM TERRY R

IPC: H01C13/02 ,  H01C1/144 ,  H01G4/232 ,  H01L21/48 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01C1/144 ,  H01G4/232 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16237 ,  H01L2924/01019 ,  H01L2924/19041 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a ball grid array package including a substrate having top and bottom surfaces. SOLUTION: The package is characterized in that circuits components are arranged on the bottom surface; the circuit components have a pair of end portions; a pair of conductors are arranged on the bottom surface; the conductors are connected to the end portions of the circuit components; conductive epoxy covers a part of the conductors and a part of the bottom surface; the conductive epoxy electrically contacts with the conductors; balls are connected to the conductive epoxy; the conductive epoxy contacts between the conductors and the balls; the balls are preferably made of copper, and later treated by corrosion-resistance coating; and other embodiment in which the balls are removed and the through holes of the substrate are filled with the conductive epoxy is shown. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种包括具有顶表面和底表面的基底的球栅阵列封装。 解决方案：封装的特征在于电路部件布置在底表面上; 电路部件具有一对端部; 一对导体布置在底面上; 导体连接到电路部件的端部; 导电环氧树脂覆盖导体的一部分和底表面的一部分; 导电环氧树脂与导体电接触; 球连接到导电环氧树脂; 导电环氧树脂在导体和球之间接触; 球优选由铜制成，然后用耐腐蚀涂层处理; 并且示出了其中移除滚珠并且衬底的通孔填充有导电环氧树脂的其它实施例。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004179615A

公开(公告)日：2004-06-24

申请号：JP2003178118

申请日：2003-06-23

Applicant: Alps Electric Co Ltd ,  アルプス電気株式会社

Inventor： KUBOKAWA TERUYOSHI ,  KOSAKA KUNIO ,  NOMURA TAKAFUMI

IPC: H05K1/18 ,  B23K1/00 ,  B23K35/26 ,  B23K101/36 ,  H05K1/09 ,  H05K3/34

CPC classification number: H05K3/3463 ,  B23K1/0016 ,  B23K35/262 ,  H05K3/3447 ,  H05K2201/10992 ,  H05K2203/047

Abstract: PROBLEM TO BE SOLVED: To provide a lead-free solder connection structure and a method for solder-connecting by which a non-heat resistance electronic part can be surely soldered at a low cost.
SOLUTION: A first solder part 14 made of tin-silver-copper based soldering material is respectively provided on a solder land 11 for surface mounting and a solder land 12 for lead terminal of a circuit board 10 wherein the lands 11 and 12 are formed on the same surface, and a terminal 21 of a chip-like electronic part 20 is mounted on the land 11 and it is heated to melt the first solder part 14 and connect it with the terminal 21. Next, a second solder part 15 made of tin-zinc based soldering material is provided on the first solder part 14 formed on the land 12, and a lead terminal 31 of a non-heat resistance electronic part 30 is inserted into a terminal hole 13 formed adjacent to the land 12, and then it is heated at lower temperature than the heating step to melt the second solder part 15 and connect it with the terminal 31.
COPYRIGHT: (C)2004,JPO