公开(公告)号：US09572252B2

公开(公告)日：2017-02-14

申请号：US14444135

申请日：2014-07-28

Applicant: TOPPAN PRINTING CO., LTD. ,  NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY

Inventor： Tetsuyuki Tsuchida ,  Toshikazu Okubo ,  Ikuo Shohji ,  Takahiro Kano

IPC: B05D5/12 ,  B28B19/00 ,  C23C18/00 ,  H01C17/06 ,  H05K3/00 ,  H05K1/09 ,  C23C18/36 ,  C23C18/44 ,  C23C18/16 ,  H05K3/24 ,  C23C18/50

CPC classification number: H05K1/09 ,  C23C18/1651 ,  C23C18/36 ,  C23C18/44 ,  C23C18/50 ,  H05K3/243 ,  H05K3/244 ,  H05K2201/032 ,  H05K2201/0776 ,  H05K2203/072

Abstract: A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.

Abstract translation: 布线基板包括包含Cu或Cu合金的电极和形成在电极上的化学镀镍层和形成在化学镀镍层上的化学镀金层的镀膜。 化学镀镍层通过Ni，P，Bi和S的共沉淀形成，无电镀镍层的P含量为5质量％以上且小于10质量％，含量 的Bi为1质量ppm〜1000质量ppm，S为1质量ppm〜2000质量ppm，S含量与Bi（S / Bi）含量的质量比为更多 比1.0。

公开(公告)号：US09502151B2

公开(公告)日：2016-11-22

申请号：US14606777

申请日：2015-01-27

Applicant: BYD COMPANY LIMITED

Inventor： Haibin Li ,  Wen Hu ,  Hongye Lin

IPC: H01B1/22 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H05K3/18 ,  C09D11/037 ,  C09D11/104 ,  C09D11/54 ,  C09D133/00 ,  C09D163/00 ,  C09D167/00 ,  C09D11/52

CPC classification number: H01B1/22 ,  C09D11/037 ,  C09D11/104 ,  C09D11/52 ,  C09D133/00 ,  C09D163/00 ,  C09D167/00 ,  H05K1/0298 ,  H05K1/092 ,  H05K3/12 ,  H05K3/185 ,  H05K2201/032 ,  H05K2203/0709 ,  H05K2203/107

Abstract: An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which the metal element of the modified metal compound is at least one selected from the group consisting of Zn, Cr, Co, Cu, Mn, Mo, and Ni.

Abstract translation: 提供油墨组合物和电路板及其制造方法。 油墨组合物包括：丙烯酸树脂; 环氧树脂; 聚酯树脂; 固化剂; 以及包含改性金属化合物的活性粉末，其中所述改性金属化合物的金属元素为选自Zn，Cr，Co，Cu，Mn，Mo和Ni中的至少一种。

公开(公告)号：US20160318134A1

公开(公告)日：2016-11-03

申请号：US15109352

申请日：2014-12-31

Applicant: ALPHA METALS, INC.

Inventor： Morgana de Avila Ribas ,  Rahul Raut ,  Traian Cornel CUCU ,  Shu Tai Yong ,  Siuli Sarkar ,  Ramakrishna Hosur Katagiriyappa

IPC: B23K35/362 ,  B23K35/26 ,  H05K9/00 ,  H05K1/11 ,  H05K1/09 ,  B23K35/02 ,  B23K35/36

CPC classification number: B23K35/362 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H05K1/09 ,  H05K1/111 ,  H05K9/0024 ,  H05K2201/032

Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Abstract translation: 无松动的热固性助焊剂配方，用于增强焊点的机械可靠性。 根据一个或多个方面，本文所示和描述的焊膏赋予与液滴冲击，热循环，热冲击，剪切强度，弯曲强度性能和/或其它热性中的至少一种相关的改进或增强的焊点性能 机械性能属性。

公开(公告)号：US20160165729A1

公开(公告)日：2016-06-09

申请号：US15046594

申请日：2016-02-18

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Saket CHADDA ,  Ramakanth ALAPATI ,  Adam BEECE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L25/0652 ,  H01L23/14 ,  H01L23/142 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L27/016 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06589 ,  H05K1/032 ,  H05K1/053 ,  H05K1/115 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K3/4053 ,  H05K3/445 ,  H05K3/4644 ,  H05K2201/032 ,  H01L2924/014

Abstract: A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.

Abstract translation: 公开了一种用于具有集成无源电路元件的薄柔性基板的方法，以及所得到的器件。 实施例可以包括在衬底的第一或第二表面上集成一个或多个无源电路部件，以及将一个或多个无源电路部件与一个或多个内插器的第二表面上的一个或多个集成电路（IC）管芯互连 在第一和第二表面之间的金属填充的通孔，第一和第二表面是基板的相对表面。

公开(公告)号：US20160021763A1

公开(公告)日：2016-01-21

申请号：US14771182

申请日：2014-02-27

Applicant: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Johannes Stahr ,  Mikael Tuominen

IPC: H05K3/46 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/4611 ,  H05K1/185 ,  H05K1/188 ,  H05K3/30 ,  H05K3/323 ,  H05K3/46 ,  H05K2201/032 ,  H05K2203/063 ,  H05K2203/068

Abstract: In a semi-finished product for the production of a printed circuit board, the semi-finished product comprising a plurality of having multiple insulating layers of a prepreg material and conductive layers (2, 2′) of a conductive material and further comprising having at least one electronic component embedded in at least one insulating layer the at least one electronic component is attached to a corresponding conductive layer by the aid of an Anisotropic Conductive Film and the Anisotropic Conductive Film as well as the prepreg material are in an unprocessed state. The method for producing a printed circuit board comprises the following steps: Providing at least one conductive layer (2), Applying an Anisotropic Conductive Film on the conductive layer, Affixing at least one electronic component on the Anisotropic Conductive Film, Embedding the electronic component in at least one insulating layer of prepreg material to obtain a semi-finished product, Laminating the semi-finished product to process the prepreg material and the Anisotropic Conductive Film.

Abstract translation: 在用于生产印刷电路板的半成品中，半成品包括多个具有预浸料材料的多个绝缘层和导电材料的导电层（2,2'）的多个，并且还包括： 至少一个电子部件嵌入到至少一个绝缘层中，所述至少一个电子部件借助于各向异性导电膜和各向异性导电膜以及预浸料材料被附着到相应的导电层上，处于未处理状态。 制造印刷电路板的方法包括以下步骤：提供至少一个导电层（2），在导电层上施加各向异性导电膜，在各向异性导电膜上粘贴至少一个电子元件，将电子元件嵌入 至少一层预浸料材料的绝缘层，以获得半成品，对半成品进行层压以加工预浸料材料和各向异性导电膜。

公开(公告)号：US20150366057A1

公开(公告)日：2015-12-17

申请号：US14836052

申请日：2015-08-26

Applicant: Eastman Kodak Company

Inventor： Yongcai Wang ,  John Andrew Lebens ,  Mitchell Lawrence Wright ,  Julie A. Cummings

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K1/09 ,  G03F7/0002 ,  G03F7/0035 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0313 ,  H05K3/0023 ,  H05K3/04 ,  H05K3/22 ,  H05K2201/0108 ,  H05K2201/032

Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity

Abstract translation: 导电性物品和器件具有通过在变形温度低于150℃的透明柔性基底上固化光固化层形成的导电微线。光固化层在温度微通道形成时的粘度<5,000帕斯卡 - 秒 微通道的平均宽度小于或等于4μm，平均深度和平均宽度比大于或等于1.光固化层暴露于固化紫外线辐射以形成光固化微观图案 并且在光固化微通道中形成包含金属纳米颗粒的导电组合物。 导电组合物以光固化微通道的图案固化，以在透明柔性基底上的光固化微通道的图案中提供导电微线图案。 至少50％的导电微细线中的每一个具有小于0.025欧姆/平方的薄层电阻。

公开(公告)号：US20150314370A1

公开(公告)日：2015-11-05

申请号：US14650161

申请日：2013-10-02

Applicant: SUMITOMO METAL MINING CO., LTD

Inventor： Yuji KAWAKAMI ,  Akihiro MURAKAMI ,  Toshiaki TERAO ,  Isao KANEKO

IPC: B22F1/00 ,  H05K1/09 ,  C22C5/06 ,  H01B1/02 ,  H01B5/00

CPC classification number: B22F1/0003 ,  B22F1/0011 ,  B22F1/0096 ,  B22F9/24 ,  B22F2998/10 ,  C22C5/06 ,  H01B1/02 ,  H01B1/22 ,  H01B5/00 ,  H05K1/09 ,  H05K1/092 ,  H05K2201/02 ,  H05K2201/032 ,  B22F1/0085 ,  B22F9/04

Abstract: The present invention provides a silver powder that has an appropriate viscosity range at the time of paste production, can be easily kneaded, and prevents flake occurrence. The silver powder has a dibutyl phthalate absorption amount, measured by a method of JIS-K6217-4, of 7.0 to 9.5 ml/100 g, and has an oil absorption profile at the time of measurement of the absorption amount, having two peaks, or one peak having a half width of not more than 1.5 ml/100 g.

Abstract translation: 本发明提供了一种在糊剂生产时具有适当粘度范围的银粉，可容易地捏合，并防止发生片状物。 该银粉末通过JIS-K6217-4的方法测定的邻苯二甲酸二丁酯吸收量为7.0〜9.5ml / 100g，并且在测定吸收量时具有两个峰， 或半峰宽度不大于1.5ml / 100g的一个峰。

公开(公告)号：US20150230334A1

公开(公告)日：2015-08-13

申请号：US14428839

申请日：2013-09-16

Applicant: CURAMIK ELECTRONICS GMBH

Inventor： Karsten Schmidt ,  Andreas Meyer ,  Alexander Legath ,  Martina Schmirler

IPC: H05K1/03 ,  C04B35/119 ,  C04B37/02 ,  H05K1/09

CPC classification number: H05K1/0306 ,  C04B35/111 ,  C04B35/119 ,  C04B37/021 ,  C04B37/023 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5248 ,  C04B2235/5436 ,  C04B2235/786 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/343 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H05K1/09 ,  H05K2201/0175 ,  H05K2201/032 ,  H05K2201/062 ,  Y10T156/10 ,  Y10T428/26 ,  Y10T428/266

Abstract: The invention relates to a metal-ceramic substrate and to a method for the production thereof, the substrate including at least one ceramic layer having first and second surface sides, at least one of the surface sides of which is provided with a metallisation, wherein the ceramic material forming the ceramic layer contains aluminium oxide, zirconium dioxide and yttrium oxide. The ceramic layer contains aluminium oxide, zirconium dioxide and yttrium oxide in the following proportions, in each case in relation to the total weight thereof: zirconium dioxide between 2 and 15 percent by weight; yttrium oxide between 0.01 and 1 percent by weight; and aluminium oxide between 84 and 97 percent by weight, wherein the average grain size of the aluminium oxide used is between 2 and 8 micrometres and the ratio of the length of the grain boundaries of the aluminium oxide grains to the total length of all the grain boundaries is greater than 0.6

Abstract translation: 本发明涉及一种金属陶瓷衬底及其制造方法，该衬底包括具有第一和第二表面侧的至少一个陶瓷层，其表面侧中的至少一个具有金属化，其中， 形成陶瓷层的陶瓷材料含有氧化铝，二氧化锆和氧化钇。 陶瓷层包含以下比例的氧化铝，二氧化锆和氧化钇，在每种情况下都相对于其总重量：二氧化锆占2重量％至15重量％; 0.01〜1重量％的氧化钇; 和氧化铝在84和97重量％之间，其中使用的氧化铝的平均粒径为2至8微米，并且氧化铝颗粒的晶界长度与所有颗粒的总长度之比 边界大于0.6

公开(公告)号：US20150086806A1

公开(公告)日：2015-03-26

申请号：US14556407

申请日：2014-12-01

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Tomota Nagaura ,  Kazuhiko Sakaguchi

IPC: H05K1/09 ,  C25D3/38 ,  C23C18/31 ,  C25D5/14 ,  C25D3/04 ,  C25D3/58 ,  C25D7/06

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.

Abstract translation: 本发明提供一种载体附着铜箔，其中在层压到绝缘基板之前，超薄铜箔不从载体剥离，而是可以在与绝缘基板层合之后从载体上剥离。 一种载体附着铜箔，包括铜箔载体，层压在所述铜箔载体上的中间层和层压在所述中间层上的超薄铜层，其中所述中间箔配置有与所述中间层的界面接触的Ni层 铜箔载体和与超薄铜层的界面接触的Cr层，所述Ni层含有1000-40,000μg/ dm 2的Ni，所述Cr层含有10-100μg/ dm 2的Cr。

公开(公告)号：US20150044492A1

公开(公告)日：2015-02-12

申请号：US14381367

申请日：2013-02-27

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Kazuhiro Yoshikawa

IPC: H05K1/09 ,  H05K3/38 ,  H05K3/00

CPC classification number: H05K1/09 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/12 ,  B32B7/06 ,  B32B15/04 ,  B32B15/20 ,  B32B2307/42 ,  B32B2307/538 ,  B32B2307/748 ,  C25D1/04 ,  C25D1/22 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D7/0614 ,  C25D9/08 ,  H05K3/007 ,  H05K3/025 ,  H05K3/385 ,  H05K2201/032 ,  H05K2201/0355 ,  H05K2203/0152 ,  H05K2203/107 ,  Y10T428/12049

Abstract: An object of the present invention is to improve the laser drilling performance of a copper clad laminate whose black-oxide treated surface is used as a laser drilled surface. To achieve the object, a copper foil provided with a carrier foil comprising a layer structure of the carrier foil/the releasing layer/the bulk copper layer characterized in that metal element-containing particles are disposed between the releasing layer and the bulk copper layer is employed. If the present copper foil provided with a carrier foil is used, a black-oxide treated layer having a color tone excellent in the laser drilling performance can be formed on the surface of the bulk copper layer in the copper clad laminate manufactured.

Abstract translation: 本发明的目的是提高将黑色氧化物处理表面用作激光钻孔表面的覆铜层压板的激光钻孔性能。 为了实现该目的，提供了一种具有载体箔的载体箔的铜箔，该载体箔包含载体箔/释放层/本体铜层的层结构，其特征在于，在剥离层和体铜层之间设置含金属元素的颗粒 雇用。 如果使用具有载体箔的本铜箔，则可以在制造的覆铜层压板的本体铜层的表面上形成具有激光钻孔性能优异的色调的黑色氧化物处理层。