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    Wiring substrate
    161.
    发明专利
    Wiring substrate 审中-公开
    接线基板

    公开(公告)号：JP2009152284A

    公开(公告)日：2009-07-09

    申请号：JP2007327137

    申请日：2007-12-19

    Applicant: Nec Electronics Corp ,  Necエレクトロニクス株式会社

    Inventor： FUKUOKA ATSUHISA

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K1/0272 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H05K1/0203 ,  H05K1/0207 ,  H05K2201/064 ,  H05K2201/09309 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring substrate for efficiently dissipating heat generated from electronic components via a heat pipe. SOLUTION: The wiring substrate is a substrate 20 having the built-in heat pipe 34. The substrate 20 also has a packaging area 40 where an IC chip 21 is mounted on a packaging surface 20a. The substrate 20 has the heat pipe 34 formed so that its distance from the packaging area 40 with respect to the packaging surface 20a becomes shorter than its distance from an outside area 41 provided outside the packaging area 40. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种用于通过热管有效地散发从电子部件产生的热的布线基板。 解决方案：布线基板是具有内置热管34的基板20.基板20还具有封装区域40，IC芯片21安装在封装表面20a上。 衬底20具有形成为使得其相对于包装表面20a与包装区域40相距的距离短于其与设置在包装区域40外部的外部区域41的距离的热管34.版权所有（C） 2009年，JPO＆INPIT

    Electronic device
    162.
    发明专利
    Electronic device 有权
    电子设备

    公开(公告)号：JP2008210854A

    公开(公告)日：2008-09-11

    申请号：JP2007043853

    申请日：2007-02-23

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： MATSUI SUKEMASA

    IPC: H05K3/46 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K3/4691 ,  H05K2201/064 ,  H05K2201/09063

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic device in which a high heat generation component consuming high power and having a high operation guarantee temperature can be connected with a low heat generation component consuming low power and having a low operation guarantee temperature such that high speed communication is ensured while achieving miniaturization. SOLUTION: A rigid flexible substrate 13 is constituted by connecting first through fourth rigid substrate portions 13a-13d by a flexible substrate portion 13e. A CPU 14 is mounted on the first rigid substrate portion 13a, and a high speed memory 15 is mounted on the second rigid substrate portion 13b. Even if the CPU 14 operates to generate heat, the thin flexible substrate portion 13e suppresses conduction of heat from the CPU 14 to the second rigid substrate portion 13b. Since the CPU 14 and the high speed memory 15 are connected by the wiring pattern of the flexible substrate portion 13e, high speed communication is ensured. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种电子装置，其中消耗高功率且具有高操作保证温度的高发热部件可以连接消耗低功率的低发热部件并具有低操作保证温度，例如 在实现小型化的同时确保高速通信。 解决方案：刚性柔性基板13通过柔性基板部分13e连接第一至第四刚性基板部分13a-13d而构成。 CPU14安装在第一刚性基板部分13a上，高速存储器15安装在第二刚性基板部分13b上。 即使CPU14工作来产生热量，薄的柔性基板部分13e抑制从CPU14到第二刚性基板部分13b的热传导。 由于CPU 14和高速存储器15通过柔性基板部分13e的布线图形连接，因此确保了高速通信。 版权所有（C）2008，JPO＆INPIT

    Electronic component mounting board and ink jet head
    164.
    发明专利
    Electronic component mounting board and ink jet head 有权
    电子元件安装板和喷墨头

    公开(公告)号：JP2006041249A

    公开(公告)日：2006-02-09

    申请号：JP2004220202

    申请日：2004-07-28

    Applicant: Brother Ind Ltd ,  ブラザー工業株式会社

    Inventor： SUGAWARA HIROTO

    IPC: H05K7/20 ,  B05C5/00 ,  H05K1/02

    CPC classification number: H01L23/3736 ,  B41J2/14233 ,  B41J2002/14491 ,  B41J2202/08 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/16 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/053 ,  H05K3/305 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10674

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component mounting board and the like, capable of more efficiently radiating the heat generated from electronic components. SOLUTION: The electronic component mounting board 1 has plates 2, 3 made of a metal; an insulating material layer 4 which is formed on the surface of the plate 2 with a ceramic material and is provided on the surface with an exothermic electronic component 5; and a flow path 10 formed in the plates 2, 3. Therefore, heat generated in the electronic component 5 is transmitted to a fluid W in the flow path 10 via the insulating material layer 4 and the plates 2, 3 and is radiated efficiently to the outside. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种能够更有效地辐射由电子部件产生的热量的电子部件安装基板等。 电子部件安装基板1具有由金属制成的板2,3; 绝缘材料层4，其在陶瓷材料的板2的表面上形成，并且在表面上设置放热电子部件5; 以及形成在板2,3中的流路10.因此，电子部件5中产生的热量经由绝缘材料层4和板2,3传输到流路10中的流体W，并且被有效地辐射到 外。 版权所有（C）2006，JPO＆NCIPI

    Printed circuit board unit, fan unit, and electronic apparatus
    166.
    发明专利
    Printed circuit board unit, fan unit, and electronic apparatus 有权
    印刷电路板单元，风扇单元和电子设备

    公开(公告)号：JP2005268327A

    公开(公告)日：2005-09-29

    申请号：JP2004075026

    申请日：2004-03-16

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： ONISHI MASUO ,  SUZUKI MASUMI ,  AOKI MICHIMASA

    IPC: G06F1/20 ,  H05K1/02 ,  H05K7/20

    CPC classification number: G06F1/203 ,  G06F2200/201 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/09072

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of enhancing the cooling efficiency of a fan while ensuring a sufficient space on a printed circuit board. SOLUTION: A first reference plane 43 is orthogonal to an induction wall 42 while being spread from a rotating center shaft 35 toward the induction wall 42. Second to fourth reference planes 42, 43, 44 are located on the downstream side of the first reference plane 43 along the rotating direction of a fan 36. The second reference plane 44 is orthogonal to the first reference plane 43. The third reference plane 45 is orthogonal to the second reference plane 44. The fourth reference plane 46 is orthogonal to the third reference plane 45. A suction opening 47 is formed on a printed circuit board 19, while the suction opening 47 are spread from the first reference plane 43 up to the fourth reference plane 46 through the second and third reference planes 42, 43. A sufficient space is ensured on the printed circuit board 19 between the fourth reference plane 46 and the first reference plane 43. Thus, the cooling efficiency of the fan can be enhanced more than ever at the same time. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种能够在确保印刷电路板上的足够空间的同时提高风扇的冷却效率的电子设备。 解决方案：第一参考平面43与感应壁42正交，同时从旋转的中心轴35向感应壁42展开。第二至第四参考平面42,43,44位于 第一参考平面44与第一参考平面43正交。第三参考平面45与第二参考平面44正交。第四参考平面46与第一参考平面43正交 吸入口47形成在印刷电路板19上，而吸入口47通过第二和第三参考平面42,43从第一参考平面43延伸到第四参考平面46.A 在第四参考平面46和第一参考平面43之间的印刷电路板19上确保了足够的空间。因此，可以同时提高风扇的冷却效率。 版权所有（C）2005，JPO＆NCIPI

    Stacking system
    168.
    发明授权
    Stacking system 有权

    公开(公告)号：US12022605B2

    公开(公告)日：2024-06-25

    申请号：US17856808

    申请日：2022-07-01

    Applicant: Delta Electronics, Inc.

    Inventor： Yahong Xiong ,  Xiaodong Chen ,  Wei Liu ,  Litao Qian ,  Shengli Lu

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K1/0203 ,  H05K7/20254 ,  H05K7/2039 ,  H05K2201/064 ,  H05K2201/066

    Abstract: A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.

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