METHOD FOR ELIMINATING THE TEMPERATURE SENSITIVITY OF AN OPTICAL FIBER AND A TEMPERATURE INSENSITIVE OPTICAL FIBER
    171.
    发明申请
    METHOD FOR ELIMINATING THE TEMPERATURE SENSITIVITY OF AN OPTICAL FIBER AND A TEMPERATURE INSENSITIVE OPTICAL FIBER 审中-公开
    消除光纤温度敏感性和温度敏感光纤的方法

    公开(公告)号:WO1991005279A1

    公开(公告)日:1991-04-18

    申请号:PCT/US1990005619

    申请日:1990-10-03

    CPC classification number: G02B6/02

    Abstract: An optical fiber is constructed by selecting a first material for a core of the optical fiber. The first material has a known coefficient of thermal expansion, α1, and a known temperature dependent rate of change, dn/dT, of an index of refraction, n. A second material (cladding) has a predetermined coefficient of thermal expansion, α2, and a radius, R2, about the axis of the fiber. The radius, R2, of the cladding is determined such that an effective coefficient of thermal expansion for the fiber is substantially equal to the negative of the product of the reciprocal of the index of refraction of the first material and the temperature dependent rate of change of the index of refraction of the first material, i.e. α = (-1/n)dn/dT.

    GRAPHITE COMPOSITE STRUCTURES EXHIBITING ELECTRICAL CONDUCTIVITY
    172.
    发明申请
    GRAPHITE COMPOSITE STRUCTURES EXHIBITING ELECTRICAL CONDUCTIVITY 审中-公开
    石墨复合结构展现电导率

    公开(公告)号:WO1991003847A1

    公开(公告)日:1991-03-21

    申请号:PCT/US1990004862

    申请日:1990-08-27

    CPC classification number: H01P11/005 H01Q9/16 H01Q9/22

    Abstract: Continuous, elongated nickel plated graphite fibers (14) are bound with an epoxy and are formed into a structural shape (11). An area (13) of the epoxy is removed by bead blasting to expose a layer of the plated graphite fibers (14), which are aligned in the desired direction of radio frequency current propagation. The bead balsted area (13) is then silver plated to obtain good contact to the plated graphite fibers (14) and resultant high conductivity from the structural shape (11).

    Abstract translation: 连续细长的镀镍石墨纤维(14)与环氧树脂结合并形成结构形状(11)。 通过珠粒喷射除去环氧树脂的区域(13),以暴露在期望的射频电流传播方向上排列的电镀石墨纤维层(14)。 珠镀区域(13)然后镀银以获得与镀覆的石墨纤维(14)的良好接触,并从结构形状(11)获得高导电率。

    SELF-ALIGNED GATE PROCESS FOR FABRICATING FIELD EMITTER ARRAYS
    174.
    发明申请
    SELF-ALIGNED GATE PROCESS FOR FABRICATING FIELD EMITTER ARRAYS 审中-公开
    用于制造场致发射阵列的自对准栅极过程

    公开(公告)号:WO1991003066A1

    公开(公告)日:1991-03-07

    申请号:PCT/US1990002184

    申请日:1990-04-23

    CPC classification number: H01J9/025

    Abstract: Conical field emitter elements (12) are formed on a surface of a substrate (11) after which a layer of metal (20) is deposited on top of the substrate surface (11) and over the field emitter elements (12). A layer of oxide (13) is then deposited over the metal layer (20). Another layer of metal (14) is deposited over the layer of oxide (13) to form a gate metal layer (14). A layer of photoresist (15) is then deposited over the gate metal layer (14). The layer of photoresist (15) is then plasma etched in an oxygen atmosphere to cause portions of the photoresist (15) above respective field emitter elements (12) to be removed and provide self-aligned holes in the photoresist (15) over each of the field emitter elements (12). The size of the holes may be controlled by appropriately controlling process parameter, including plasma etching time and power and/or initial photoresist thickness. The exposed gate metal layer (14) is etched using the layer of photoresist (15) as a mask. The photoresist layer (15) is removed, and the layer of oxide (13) is etched to expose the field emitter elements (12). Another oxide layer (17) and an anode metal layer (18) also may be formed over the gate metal layer (14) to produce a self-aligned triode structure.

    FIBER OPTIC CANNISTER WITH COMPLIANT BASELAYER
    177.
    发明申请
    FIBER OPTIC CANNISTER WITH COMPLIANT BASELAYER 审中-公开
    具有兼容性基座的光纤陀螺

    公开(公告)号:WO1990010244A1

    公开(公告)日:1990-09-07

    申请号:PCT/US1990000164

    申请日:1990-01-16

    CPC classification number: B65H55/00 G02B6/4457

    Abstract: The invention is a compliant material that is used as a baselayer for underlying layers of an optical fiber wound onto a bobbin. In one embodiment the baselayer is selected for compatibility with an optical fiber coating. In another embodiment, the compliant material (10) comprises a coating disposed on the bobbin. In another embodiment, the base layer comprises a silicon material. The use of a compliant material as a baselayer eliminates the need to fabricate and stock expensive baselayer wire material (15). Use of the compliant material is also believed to reduce the stresses in the first wound fiber layer. In addition, it is easier to match the thermal properties of the optical fiber with the thermal properties of the compliant material (20) over a wide temperature range than it is to match the thermal properties of the optical fiber to the baselayer wire. Thus, over an anticipated operating temperature range, the difference in thermal expansion characteristics between the base layer and (25) the wound fiber are reduced, thereby minimizing the risk that the fiber pack will slip off the bobbin during long storage or payout.

    Abstract translation: 本发明是柔性材料,其用作缠绕在筒管上的光纤的下层的底层。 在一个实施方案中,选择基底层以与光纤涂层相容。 在另一个实施例中,顺应性材料(10)包括设置在线轴上的涂层。 在另一实施例中,基层包括硅材料。 使用柔性材料作为基层,消除了制造和储存昂贵的基底线材料(15)的需要。 还认为使用顺应性材料可以减少第一缠绕纤维层中的应力。 另外,在宽的温度范围内,使光纤的热性能与柔性材料(20)的热性质相比,比将光纤与基底线的热性能相匹配更容易。 因此,在预期的工作温度范围内,基底层和(25)卷绕的纤维之间的热膨胀特性的差异减小,从而最小化在长时间存储或支付期间纤维束将脱离线轴的风险降至最低。

    FILAMENT WINDING APPARATUS
    178.
    发明申请
    FILAMENT WINDING APPARATUS 审中-公开
    FILAMENT WINDING装置

    公开(公告)号:WO1990009947A1

    公开(公告)日:1990-09-07

    申请号:PCT/US1990000329

    申请日:1990-01-23

    CPC classification number: B65H54/10

    Abstract: A filament winding apparatus (10) has a bobbin slidably, nut non-rotatably, received on a tube mounted to a base. A cylindrical case (14) has an internal circumferential groove (20) with gear teeth (21, 22) which mesh with an orbiting cylindrical bail (38). A base mounted sun gear (36) located within the case (14) meshes with bail gear teeth (42) driving it along both a circular path and about itself as an axis. A filament (46) to be wound passes through an eyelet (24) axially mounted to the case (14), through the bail (38) and secured to the bobbin. Rotation of the sun gear (36) winds the filament onto the bobbin while not subjecting the filament to sharp bending stresses, and during which frictional engagement is distributed over extended eyelet (24), bail (38) and filament (46) surfaces.

    HIGH SPEED PROGRAMMABLE DIVIDER
    179.
    发明申请
    HIGH SPEED PROGRAMMABLE DIVIDER 审中-公开
    高速可编程分频器

    公开(公告)号:WO1990007232A1

    公开(公告)日:1990-06-28

    申请号:PCT/US1989005003

    申请日:1989-11-14

    CPC classification number: H03K23/665 H03K21/10 H03K23/667 H03K23/68

    Abstract: A programmable counter or frequency divider includes the combination of a fixed modulus prescaler (110) and a programmable divider (120, 130, 140, 150, 160) in which the prescaler provides more than a single clock phase to the programmable divider and the programmable divider utilizes the multiple clock phases to allow operation in a true fractional-integer mode. The overall combination of the prescaler and programmable divider functions as a programmable divider for which the minimum increment in the overall divider modulus is less than the prescaler modulus, but the maximum clock frequency usable is the maximum clock frequency of the prescaler.

    REDUNDANCY AND TESTING TECHNIQUES FOR IC WAFERS
    180.
    发明申请
    REDUNDANCY AND TESTING TECHNIQUES FOR IC WAFERS 审中-公开
    IC WAFERS的冗余和测试技术

    公开(公告)号:WO1990007153A1

    公开(公告)日:1990-06-28

    申请号:PCT/US1989005330

    申请日:1989-11-27

    CPC classification number: G11C29/006 G01R31/318505 G01R31/318511

    Abstract: An array of processing element nodes are provided on a semiconductor wafer. A mixed redundancy approach is preferably employed wherein two spare core logic circuit modules (52, 58) are available for use at each node. Each spare core logic module can be connected to one of four different nodes. A H-net 94 interconnects adjacent nodes in such manner that faults in the circuit modules can be easily tested and repaired.

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