Abstract:
An optical fiber is constructed by selecting a first material for a core of the optical fiber. The first material has a known coefficient of thermal expansion, α1, and a known temperature dependent rate of change, dn/dT, of an index of refraction, n. A second material (cladding) has a predetermined coefficient of thermal expansion, α2, and a radius, R2, about the axis of the fiber. The radius, R2, of the cladding is determined such that an effective coefficient of thermal expansion for the fiber is substantially equal to the negative of the product of the reciprocal of the index of refraction of the first material and the temperature dependent rate of change of the index of refraction of the first material, i.e. α = (-1/n)dn/dT.
Abstract:
Continuous, elongated nickel plated graphite fibers (14) are bound with an epoxy and are formed into a structural shape (11). An area (13) of the epoxy is removed by bead blasting to expose a layer of the plated graphite fibers (14), which are aligned in the desired direction of radio frequency current propagation. The bead balsted area (13) is then silver plated to obtain good contact to the plated graphite fibers (14) and resultant high conductivity from the structural shape (11).
Abstract:
An adhesive mixture (18) reworkably adheres electronic integrated circuit dies (14, 16) to hybrid microcircuit substrates (12), and includes a thermosetting epoxy resin. A thermoplastic resin additive allows the mixture to retain the high adhesive strength of the epoxy resin up to approximately 150 °C, or the upper limit of the operating and testing temperature range of the dies, and then soften sufficiently to enable defective dies to be removed at a temperature of preferably between 150 °C and 200 °C without damage to the substrate or adjacent dies.
Abstract:
Conical field emitter elements (12) are formed on a surface of a substrate (11) after which a layer of metal (20) is deposited on top of the substrate surface (11) and over the field emitter elements (12). A layer of oxide (13) is then deposited over the metal layer (20). Another layer of metal (14) is deposited over the layer of oxide (13) to form a gate metal layer (14). A layer of photoresist (15) is then deposited over the gate metal layer (14). The layer of photoresist (15) is then plasma etched in an oxygen atmosphere to cause portions of the photoresist (15) above respective field emitter elements (12) to be removed and provide self-aligned holes in the photoresist (15) over each of the field emitter elements (12). The size of the holes may be controlled by appropriately controlling process parameter, including plasma etching time and power and/or initial photoresist thickness. The exposed gate metal layer (14) is etched using the layer of photoresist (15) as a mask. The photoresist layer (15) is removed, and the layer of oxide (13) is etched to expose the field emitter elements (12). Another oxide layer (17) and an anode metal layer (18) also may be formed over the gate metal layer (14) to produce a self-aligned triode structure.
Abstract:
A field effect transistor FMCW radar transceiver for short-range target detection, employs a varactor-tuned, gallium arsenide field effect transistor, voltage-controlled oscillator in the dual role of the transmitter signal source and the local oscillator. The radar transceiver is capable of operating at low IF frequencies for short range, which can be less than 30 feet, target detection.
Abstract:
A method and composition for protecting and enhancing the solderability of a metallic surface. A mixture which includes a chosen protective material and a dicarboxylic acid fluxing agent is applied to the metallic surface to form a protective film or coating which also enhances the solderability of the metallic surface. The mixture is applied to the metallic surface as a solution having a solvent carrier which evaporates to leave the film. The film is heat activated at soldering temperatures to release the fluxing agent.
Abstract:
The invention is a compliant material that is used as a baselayer for underlying layers of an optical fiber wound onto a bobbin. In one embodiment the baselayer is selected for compatibility with an optical fiber coating. In another embodiment, the compliant material (10) comprises a coating disposed on the bobbin. In another embodiment, the base layer comprises a silicon material. The use of a compliant material as a baselayer eliminates the need to fabricate and stock expensive baselayer wire material (15). Use of the compliant material is also believed to reduce the stresses in the first wound fiber layer. In addition, it is easier to match the thermal properties of the optical fiber with the thermal properties of the compliant material (20) over a wide temperature range than it is to match the thermal properties of the optical fiber to the baselayer wire. Thus, over an anticipated operating temperature range, the difference in thermal expansion characteristics between the base layer and (25) the wound fiber are reduced, thereby minimizing the risk that the fiber pack will slip off the bobbin during long storage or payout.
Abstract:
A filament winding apparatus (10) has a bobbin slidably, nut non-rotatably, received on a tube mounted to a base. A cylindrical case (14) has an internal circumferential groove (20) with gear teeth (21, 22) which mesh with an orbiting cylindrical bail (38). A base mounted sun gear (36) located within the case (14) meshes with bail gear teeth (42) driving it along both a circular path and about itself as an axis. A filament (46) to be wound passes through an eyelet (24) axially mounted to the case (14), through the bail (38) and secured to the bobbin. Rotation of the sun gear (36) winds the filament onto the bobbin while not subjecting the filament to sharp bending stresses, and during which frictional engagement is distributed over extended eyelet (24), bail (38) and filament (46) surfaces.
Abstract:
A programmable counter or frequency divider includes the combination of a fixed modulus prescaler (110) and a programmable divider (120, 130, 140, 150, 160) in which the prescaler provides more than a single clock phase to the programmable divider and the programmable divider utilizes the multiple clock phases to allow operation in a true fractional-integer mode. The overall combination of the prescaler and programmable divider functions as a programmable divider for which the minimum increment in the overall divider modulus is less than the prescaler modulus, but the maximum clock frequency usable is the maximum clock frequency of the prescaler.
Abstract:
An array of processing element nodes are provided on a semiconductor wafer. A mixed redundancy approach is preferably employed wherein two spare core logic circuit modules (52, 58) are available for use at each node. Each spare core logic module can be connected to one of four different nodes. A H-net 94 interconnects adjacent nodes in such manner that faults in the circuit modules can be easily tested and repaired.