Ultraviolet-based detection and sterilization
    171.
    发明授权
    Ultraviolet-based detection and sterilization 有权
    紫外线检测和灭菌

    公开(公告)号:US09572903B2

    公开(公告)日:2017-02-21

    申请号:US14883804

    申请日:2015-10-15

    Abstract: A system capable of detecting and/or sterilizing surface(s) of an object using ultraviolet radiation is provided. The system can include a disinfection chamber and/or handheld ultraviolet unit, which includes ultraviolet sources for inducing fluorescence in a contaminant and/or sterilizing a surface of an object. The object can comprise a protective suit, which is worn by a user and also can include ultraviolet sources for disinfecting air prior to the air entering the protective suit. The system can be implemented as a multi-tiered system for protecting the user and others from exposure to the contaminant and sterilizing the protective suit after exposure to an environment including the contaminant.

    Abstract translation: 提供一种能够使用紫外线辐射来检测和/或消毒物体表面的系统。 该系统可以包括消毒室和/或手持式紫外线单元,其包括用于在污染物中诱导荧光和/或消毒物体表面的紫外线源。 该物体可以包括用户佩戴的防护服,并且还可以包括用于在空气进入防护服之前对空气进行消毒的紫外线源。 该系统可以实现为多层系统,用于在暴露于包括污染物的环境之后,保护使用者和其他人免受暴露于污染物和对防护服进行消毒。

    Multi-Layered Contact to Semiconductor Structure
    172.
    发明申请
    Multi-Layered Contact to Semiconductor Structure 有权
    多层次接触半导体结构

    公开(公告)号:US20170005246A1

    公开(公告)日:2017-01-05

    申请号:US15198569

    申请日:2016-06-30

    Abstract: A multi-layered contact to a semiconductor structure and a method of making is described. In one embodiment, the contact includes a discontinuous Chromium layer formed over the semiconductor structure. A discontinuous Titanium layer is formed directly on the Chromium layer, wherein portions of the Titanium layer extend into at least some of the discontinuous sections of the Chromium layer. A discontinuous Aluminum layer is formed directly on the Chromium layer, wherein portions of the Aluminum layer extend into at least some of the discontinuous sections of the Titanium layer and the Chromium layer.

    Abstract translation: 描述了与半导体结构的多层接触和制造方法。 在一个实施例中,触点包括形成在半导体结构上的不连续的铬层。 直接在铬层上形成不连续的钛层,其中钛层的部分延伸到铬层的至少一些不连续部分。 直接在铬层上形成不连续的铝层,其中铝层的部分延伸到钛层和铬层的至少一些不连续部分。

    Susceptor Heating For Epitaxial Growth Process
    174.
    发明申请
    Susceptor Heating For Epitaxial Growth Process 审中-公开
    受体加热用于外延生长过程

    公开(公告)号:US20160355947A1

    公开(公告)日:2016-12-08

    申请号:US15173660

    申请日:2016-06-05

    CPC classification number: C30B25/16 C23C16/4586 C23C16/46 C23C16/52 C30B25/10

    Abstract: An approach for heating a susceptor during an epitaxial growth process of semiconductor layers in an epitaxial growth chamber is described. A main heating unit heats a region of the susceptor supporting a wafer. An auxiliary heating unit supports the main heating unit in heating the susceptor when the temperature distribution over the surface of the wafer fails to satisfy a target temperature distribution. The control unit monitors the temperature distribution over the surface of the wafer while the susceptor is heated by both the main heating unit and the auxiliary heating unit and adjusts at least one of a multitude of operating parameters for the auxiliary heating unit in response to determining that the temperature distribution over the surface of the wafer while the susceptor is heated by the main heating unit and the auxiliary heating unit is failing to satisfy the target temperature distribution.

    Abstract translation: 描述了在外延生长室中的半导体层的外延生长过程期间加热基座的方法。 主加热单元加热支撑晶片的基座的区域。 当晶片表面上的温度分布不能满足目标温度分布时,辅助加热单元支撑主加热单元加热基座。 所述控制单元监测所述晶片表面上的温度分布,同时所述基座被所述主加热单元和所述辅助加热单元加热,并响应于确定所述辅助加热单元的多个操作参数中的至少一个而调整 当基座被主加热单元和辅助加热单元加热时,晶片表面上的温度分布不能满足目标温度分布。

    Semiconductor Material Doping
    179.
    发明申请
    Semiconductor Material Doping 有权
    半导体材料掺杂

    公开(公告)号:US20160260867A1

    公开(公告)日:2016-09-08

    申请号:US15069272

    申请日:2016-03-14

    Abstract: A solution for designing and/or fabricating a structure including a quantum well and an adjacent barrier is provided. A target band discontinuity between the quantum well and the adjacent barrier is selected to coincide with an activation energy of a dopant for the quantum well and/or barrier. For example, a target valence band discontinuity can be selected such that a dopant energy level of a dopant in the adjacent barrier coincides with a valence energy band edge for the quantum well and/or a ground state energy for free carriers in a valence energy band for the quantum well. Additionally, a target doping level for the quantum well and/or adjacent barrier can be selected to facilitate a real space transfer of holes across the barrier. The quantum well and the adjacent barrier can be formed such that the actual band discontinuity and/or actual doping level(s) correspond to the relevant target(s).

    Abstract translation: 提供了一种用于设计和/或制造包括量子阱和相邻屏障的结构的解决方案。 选择量子阱和相邻屏障之间的目标频带不连续性以与量子阱和/或屏障的掺杂剂的活化能一致。 例如,可以选择目标价带不连续性,使得相邻势垒中的掺杂剂的掺杂剂能级与量子阱的价态能带边缘和/或价态能带中的自由载流子的基态能量一致 量子阱。 另外,可以选择量子阱和/或相邻势垒的目标掺杂水平以促进穿过势垒的空穴的实际空间传递。 可以形成量子阱和相邻势垒,使得实际的带不连续性和/或实际掺杂水平对应于相关目标。

    Semiconductor structure with stress-reducing buffer structure
    180.
    发明授权
    Semiconductor structure with stress-reducing buffer structure 有权
    具有减压缓冲结构的半导体结构

    公开(公告)号:US09412902B2

    公开(公告)日:2016-08-09

    申请号:US14628281

    申请日:2015-02-22

    Abstract: A semiconductor structure comprising a buffer structure and a set of semiconductor layers formed adjacent to a first side of the buffer structure is provided. The buffer structure can have an effective lattice constant and a thickness such that an overall stress in the set of semiconductor layers at room temperature is compressive and is in a range between approximately 0.1 GPa and 2.0 GPa. The buffer structure can be grown using a set of growth parameters selected to achieve the target effective lattice constant a, control stresses present during growth of the buffer structure, and/or control stresses present after the semiconductor structure has cooled.

    Abstract translation: 提供一种半导体结构,包括缓冲结构和与缓冲结构的第一侧相邻形成的一组半导体层。 缓冲结构可以具有有效的晶格常数和厚度,使得该组半导体层在室温下的总应力是压缩的,并且在约0.1GPa和2.0GPa之间的范围内。 可以使用选择的一组生长参数来生长缓冲结构,以实现目标有效晶格常数a,缓冲结构生长期间存在的控制应力和/或半导体结构冷却后存在的控制应力。

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