Abstract:
A method for electrically connecting conductive thread (40) at any number of termination locations of a textile material (5) with an termination element preferably formed in a circuit board with the following steps being provided: placing the circuit board in a respectively formed recess of a support plate of a tool with the termination locations (122) of the circuit board (12) facing upwardly; arranging the material (5) on the circuit board (12) such that in the area of the termination locations of the circuit board (12) a termination location of the material (5) which is to be connected is being placed. Fixedly mounting, preferably by clamping the material adjacent to and on a side of the termination locations of the circuit board, preferably stretching the material (5) in longitudinal direction wherein the direction of the extension of the conductive threads. Fixedly clamping the material in an area opposite to the first clamping area and adjacent to the desired termination location. Soldering the blank conductive threads (40) to the termination locations of the circuit board (12).
Abstract:
The invention relates to a specific printed circuit (7) comprising independent etched blocks (4) or segments in series of four such that, on a series circuit comprising five LEDs, the four blocks serve as the positioning and connection points for the welding of the pins of the LEDs, said pins being welded in an anode-to-cathode series, or the reverse depending on the direction of the current, i.e. eight electrodes in isolated blocks, such as to ensure that the connection is powered and the LEDs are fixed correctly in series of five. According to the invention, the square or rectangular blocks have a large surface (2) such that the successive holes do not tear the film of epoxy copper. In addition, said blocks are disposed along a path and a successive diagram (21) defines the symbol or pattern to be represented by the LEDs (12) which are disposed and aligned on the other decorated face of the epoxy. The incoming or outgoing bases, which supply the positive (20) or negative (3) power, or the opposite depending on the direction of the LEDs, can comprise the outgoing or incoming base that is common to other series, by means of suitable etching. The negative is always at the centre of the pattern. The circuit is divided into three connection zones, A, B, C, and is powered by external contact springs. The invention is intended for the series powering of a longilineal distribution of five LEDs in series, or a multiple thereof.
Abstract:
The present invention provides a wet-spun non-woven fabric composed of inorganic fibers containing bundled inorganic fibers and a binder component for binding the fibers, wherein the average number of the fibers in each bundle is 1.5 to 20 and the average Z/X value represented by the following formula in the cross section of the non-woven fabric is 0.9 or below: (number of adjacent fibers in the thickness direction in each bundle)/(number of adjacent fibers in the plane direction in each bundle)=Z/X, and a method for producing a wet-spun non-woven fabric, which comprises the steps of dispersing inorganic fibers in an aqueous medium in the presence of an anionic dispersion stabilizer, adding a cationic compound to the obtained fiber dispersion to bundle the fibers and thereby preparing a fiber dispersion containing the resultant fiber bundles, making a sheet from the obtained fiber dispersion containing the fiber bundles by wet method and applying a binder to the obtained sheet. The non-woven fabric is a non-woven inorganic fiber fabric having a high density.
Abstract:
A heat-resistant fiber paper-like sheet comprises 40 to 97% by mass of heat-resistant organic synthetic polymers staple fibers, 3 to 60% by mass of heat resistant organic synthetic polymer fibrid and or an organic resin binder, in a portion of the staple fibers, each staple fiber having two flat end faces having an inclining angle of 10 degrees or more from a plane crossing the fiber axis at a right angles, and is useful as a base material for laminate materials for electrical circuit boards.
Abstract:
A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.
Abstract:
Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.
Abstract:
A process for manufacturing an inorganic material-based article comprising the steps of (1) forming a sol solution mainly composed of an inorganic component, (2) producing inorganic material-based gel fine fibers by extruding the resulting sol solution from a nozzle, and at the same time, applying an electrical field to the extruded sol solution to thin the extruded sol solution, and then, collecting inorganic material-based gel fine fibers on a support, (3) drying the collected inorganic material-based gel fine fibers to produce inorganic material-based article containing inorganic material-based dried gel fine fibers, and then, (4) sintering the inorganic material-based article containing inorganic material-based dried gel fine fibers to produce inorganic material-based article containing inorganic material-based sintered fine fibers.
Abstract:
A heat-resistant fiber paper-like sheet comprises 40 to 97% by mass of heat-resistant organic synthetic polymers staple fibers, 3 to 60% by mass of heat resistant organic synthetic polymer fibrid and or an organic resin binder, in a portion of the staple fibers, each staple fiber having two flat end faces having an inclining angle of 10 degrees or more from a plane crossing the fiber axis at a right angles, and is useful as a base material for laminate materials for electrical circuit boards.
Abstract:
Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.
Abstract:
A process for manufacturing an inorganic material-based article comprising the steps of (1) forming a sol solution mainly composed of an inorganic component, (2) producing inorganic material-based gel fine fibers by extruding the resulting sol solution from a nozzle, and at the same time, applying an electrical field to the extruded sol solution to thin the extruded sol solution, and then, collecting inorganic material-based gel fine fibers on a support, (3) drying the collected inorganic material-based gel fine fibers to produce inorganic material-based article containing inorganic material-based dried gel fine fibers, and then, (4) sintering the inorganic material-based article containing inorganic material-based dried gel fine fibers to produce inorganic material-based article containing inorganic material-based sintered fine fibers is disclosed.