公开(公告)号：US07758916B2

公开(公告)日：2010-07-20

申请号：US11598062

申请日：2006-11-13

Applicant: Richard K. Schmid ,  Jacobus C. Doesburg

Inventor： Richard K. Schmid ,  Jacobus C. Doesburg

IPC: B05D1/12

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

Abstract translation: 本发明提供了一种粉末混合物或复合粉末，其被馈送到动力喷射装置中，朝向衬底或部件加速，以形成具有优于现有焊料的热和电特性的复合焊料。 以这种方式构建焊料层的其他优点包括低氧化物含量以改善随后的可焊性，优异的沉积厚度控制，优异的沉积化学控制以及最终的制造速度。

公开(公告)号：US20100104839A1

公开(公告)日：2010-04-29

申请号：US12594569

申请日：2008-04-04

Applicant: Michael Dunleavy ,  Sajad Haq ,  Joseph Maurice Davies ,  Jason Karl Rew

Inventor： Michael Dunleavy ,  Sajad Haq ,  Joseph Maurice Davies ,  Jason Karl Rew

IPC: B32B7/02 ,  B32B5/00 ,  B29C39/02 ,  B29C65/70

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: A bulk dielectric material can include a solid composite material having a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material can have, at a frequency of greater than 1 MHz, (i) a permittivity with a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and can have a minimum dimension greater than 2 mm.

Abstract translation: 体电介质材料可以包括具有固体基质材料和分布在基质材料内的多个填料元素的固体复合材料。 大体积电介质材料可以具有大于1MHz的频率，（i）具有大于10的实际部分幅度的电容率和小于3的虚数部分，以及（ii）电击穿强度大于 5 kV / mm，最小尺寸可以大于2 mm。

公开(公告)号：US20080261049A1

公开(公告)日：2008-10-23

申请号：US11573133

申请日：2005-07-29

Applicant: Hiroki Hayashi ,  Ayako Taira ,  Satoshi Ebana

Inventor： Hiroki Hayashi ,  Ayako Taira ,  Satoshi Ebana

IPC: B32B15/092 ,  H01B1/22

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0272 ,  Y10T428/31529

Abstract: The conductive paste of the invention comprises a conductive powder and a binder component, wherein the conductive powder is composed of metal powder which is copper powder or copper alloy powder partially covered on the surface with silver, and is either a mixture of roughly spherical metal powder and flat metal powder, or roughly spherical or flat metal powder alone, and wherein the binder component contains a mixture of an epoxy resin and an imidazole compound with a hydroxyl group or a mixture of an epoxy resin and an imidazole compound with a carboxyl group.

Abstract translation: 本发明的导电膏包括导电粉末和粘合剂组分，其中导电粉末由金属粉末组成，铜粉末或铜合金粉末部分地被银表面覆盖，并且是大致球形的金属粉末 和扁平金属粉末，或单独的大致球形或扁平金属粉末，并且其中粘合剂组分含有环氧树脂和具有羟基的咪唑化合物或环氧树脂和具有羧基的咪唑化合物的混合物的混合物。

公开(公告)号：US20080110531A1

公开(公告)日：2008-05-15

申请号：US11598062

申请日：2006-11-13

Applicant: Richard K. Schmid ,  Jacobus C. Doesburg

Inventor： Richard K. Schmid ,  Jacobus C. Doesburg

IPC: B23K35/14 ,  B23K35/22

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

Abstract translation: 本发明提供了一种粉末混合物或复合粉末，其被馈送到动力喷射装置中，朝向衬底或部件加速，以形成具有优于现有焊料的热和电特性的复合焊料。 以这种方式构建焊料层的其他优点包括低氧化物含量以改善随后的可焊性，优异的沉积厚度控制，优异的沉积化学控制以及最终的制造速度。

公开(公告)号：US07357883B2

公开(公告)日：2008-04-15

申请号：US11500307

申请日：2006-08-08

Applicant: Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

Inventor： Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

IPC: H01B1/00 ,  H01B1/12

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0272 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/29 ,  Y10T428/2933

Abstract: A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

Abstract translation: 通过将多种导电填料混合到热固性树脂中形成导电粘合剂。 导电填料包括由铜基金属制成的芯材，由银制成的涂膜和多个由银制成的颗粒。 涂覆膜设置在芯材上以覆盖芯材，并且将颗粒设置在涂膜的表面上。 因此，防止芯材的表面露出。 导电粘合剂可以适合用于粘接两个部件。

公开(公告)号：US20070290175A1

公开(公告)日：2007-12-20

申请号：US11443262

申请日：2006-05-31

Applicant: Hyungrak Kim

Inventor： Hyungrak Kim

IPC: B32B15/02 ,  H01B1/12

CPC classification number: B22F1/0018 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/1241 ,  H05K2201/0218 ,  Y10S977/777 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: Metallic nanoparticles and processes for forming metallic nanoparticles. In one aspect, the invention is to a process for forming nanoparticles comprising the step of heating a solution comprising a first metal precursor and a nucleating agent (e.g., nucleate nanoparticles or a nucleate precursor) in the presence of a base under conditions effective to form the nanoparticles. The first metal precursor preferably comprises a cationic metal species having a low reduction potential. The invention is also to a nanoparticle or plurality of nanoparticles, each nanoparticle comprising a core having a largest dimension less than about 10 nm; and a metal layer substantially surrounding the core and having a largest dimension less than about 200 nm.

Abstract translation: 金属纳米粒子和形成金属纳米粒子的方法。 一方面，本发明涉及一种形成纳米颗粒的方法，其包括在有效形成的条件下，在碱的存在下加热包含第一金属前体和成核剂（例如，成核的纳米颗粒或成核前体）的溶液的步骤 纳米颗粒。 第一金属前体优选包含具有低还原电位的阳离子金属物质。 本发明还涉及纳米颗粒或多个纳米颗粒，每个纳米颗粒包含具有小于约10nm的最大尺寸的芯; 以及基本上围绕所述芯并具有小于约200nm的最大尺寸的金属层。

公开(公告)号：US20070245852A1

公开(公告)日：2007-10-25

申请号：US11812005

申请日：2007-06-14

Applicant: Hidekiyo Takaoka ,  Kosuke Nakano

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano

IPC: C22C1/04

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. A second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed, and even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.

Abstract translation: 在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。 第一金属粉末包括用作贱金属的第一金属材料如Cu，Ag，Au或Pd。 具有比第一金属材料低的熔点的第二金属材料如Sn或In涂覆在第一金属材料的表面上。 第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。 第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。 因此，可以抑制在热处理后残留的未反应成分的可能性，并且即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。

公开(公告)号：US20070216012A1

公开(公告)日：2007-09-20

申请号：US11735627

申请日：2007-04-16

Applicant: HIROSHI HOZOJI ,  Toshiaki Morita ,  Hiroshi Sasaki

Inventor： HIROSHI HOZOJI ,  Toshiaki Morita ,  Hiroshi Sasaki

IPC: H01L23/52 ,  H01L29/06

CPC classification number: H05K3/328 ,  H01L23/24 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L25/072 ,  H01L25/16 ,  H01L2223/6644 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/11332 ,  H01L2224/11505 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27505 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/29344 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/183 ,  H05K3/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1131 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/2076 ,  H01L2224/83205 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.

Abstract translation: 电子部件安装方法，半导体模块和半导体器件，其可以减小安装面积和器件厚度。 在将形成在基板上的电极和形成在电子部件上的电极彼此接合的电子部件安装方法中，该方法包括通过由至少一种类型的聚集颗粒构成的金属层将两个电极接合的步骤 的金属。 然后，金属粒子的平均粒径为1〜50nm。 优选地，金属颗粒形成厚度为5至100μm的金属层。

公开(公告)号：US20070190349A1

公开(公告)日：2007-08-16

申请号：US10590861

申请日：2005-09-01

Applicant: Hiroya Ishida

Inventor： Hiroya Ishida

IPC: B05D7/00 ,  B22F1/02

CPC classification number: C23C18/1635 ,  C23C18/1651 ,  C23C18/1683 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  H01R13/03 ,  H05K3/323 ,  H05K2201/0218 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: It is the object of the present invention to provide a conductive particle which has excellent adhesion between a base particle and a conductive layer, a conductive layer being resistant to breaking, impact resistance being improved, and an anisotropic conductive material using the conductive particle. The prevent invention is a conductive particle, which comprises a base particle and a conductive layer formed on a surface of said base particle, said conductive layer having a non-crystal nickel plating layer in contact with the surface of said base particle and a crystal nickel plating layer, and a proportion of a nickel crystal grain aggregate oriented in a nickel (111) plane derived from an integrated intensity ratio in X-ray diffraction measurement being 80% or more.

Abstract translation: 本发明的目的是提供一种导电颗粒，其具有优异的基础颗粒和导电层之间的粘附性，耐断裂性，耐冲击性得到改善的导电层以及使用该导电颗粒的各向异性导电材料。 防止发明是一种导电颗粒，其包括基体颗粒和形成在所述基础颗粒的表面上的导电层，所述导电层具有与所述基础颗粒的表面接触的非结晶镍镀层和结晶镍 并且在X射线衍射测定中，从镍（111）面取向的镍晶粒聚集体的积分强度比的比例为80％以上。

公开(公告)号：US20070145585A1

公开(公告)日：2007-06-28

申请号：US11500018

申请日：2006-08-07

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC: H01L23/48

CPC classification number: H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Abstract translation: 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。