公开(公告)号：US20090057897A1

公开(公告)日：2009-03-05

申请号：US11897971

申请日：2007-08-30

Applicant: Viraj Patwardhan ,  Hau Nguyen

Inventor： Viraj Patwardhan ,  Hau Nguyen

IPC: H01L23/488 ,  B23K31/02 ,  H01L21/60

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/13575 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y02P70/613

Abstract: A Micro SMDxt package is provided that configured for mounting to a circuit board. The SMDxt package includes a silicon-based IC having an array of contact pads on one side of thereof, and a die electrically attached to the silicon-based IC. A plurality of solder balls is included, each of which has a polymeric core surrounded by a metallic shell that in turn is surrounded by a layer of solder material. Further, each solder ball is positioned in contact with a corresponding contact pad of the package. An intertwined intermetallic fusion layer is formed through the fusion between material components of the contact pads and the solder material, via heat treatment. The intermetallic fusion extends between and from an outer surface of the metallic shell of each solder to an outer surface of a corresponding contact pad to form a high strength intermetallic solder joint therebetween.

公开(公告)号：US20090053859A1

公开(公告)日：2009-02-26

申请号：US12220960

申请日：2008-07-30

Applicant: Qianfei Xu ,  Rong-Chang Liang ,  Shih-Wei Ho ,  Eric H. Liu

Inventor： Qianfei Xu ,  Rong-Chang Liang ,  Shih-Wei Ho ,  Eric H. Liu

IPC: H01L21/00

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01B1/24 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01R13/2414 ,  H05K2201/0221 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y10T428/24612 ,  Y10T428/2462 ,  H01L2924/00

Abstract: The present invention discloses structures and manufacturing processes of an ACF of improved resolution and reliability of electrical connection using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes the steps of (i) fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or (ii) selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.

Abstract translation: 本发明公开了具有预定配置，形状和尺寸的非随机阵列的微腔的具有改进的电连接分辨率和可靠性的ACF的结构和制造过程。 制造方法包括以下步骤：（i）将导电颗粒流体填充到包含预定阵列的微腔的基底或载体网上，或（ii）阵列的选择性金属化，然后用填充材料填充阵列，并且第二选择性 填充微腔阵列上的金属化。 然后将由此制备的填充的导电微腔阵列用粘合剂膜覆盖或层压。

公开(公告)号：US07291393B2

公开(公告)日：2007-11-06

申请号：US10489406

申请日：2002-09-17

Applicant: Takeshi Wakiya ,  Yoshikazu Yoneda ,  Masako Ueba

Inventor： Takeshi Wakiya ,  Yoshikazu Yoneda ,  Masako Ueba

IPC: B32B5/16 ,  B05D7/00

CPC classification number: H05K3/323 ,  B22F1/0062 ,  B22F2998/00 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/025

Abstract: An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure.A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.

Abstract translation: 本发明的目的是提供具有优异连接可靠性的涂覆导电颗粒，这种涂覆导电颗粒的制造方法，各向异性导电材料和导电连接结构。 包括具有由导电金属制成的表面的颗粒和绝缘颗粒的涂覆的导电颗粒，以将具有由导电金属制成的表面的颗粒的表面涂覆在其上，其中绝缘颗粒化学键合到具有由 导电金属经由具有与导电金属的接合特性的官能团（A），从而形成单个涂层。

公开(公告)号：US07263769B2

公开(公告)日：2007-09-04

申请号：US11252540

申请日：2005-10-19

Applicant: Shinji Morimoto ,  Kouji Nakashima ,  Toyokazu Yoshino ,  Katsuya Okamoto

Inventor： Shinji Morimoto ,  Kouji Nakashima ,  Toyokazu Yoshino ,  Katsuya Okamoto

IPC: H01R3/10

CPC classification number: H05K3/4635 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10416 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165

Abstract: A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

Abstract translation: 一种多层柔性印刷电路板，包括绝缘层，形成在绝缘层的前表面和后表面上的电路层和经由绝缘层连接在电路层之间的孔，其中设置有导电构件，其具有 至少在其表面上形成有金属层，该金属层压配合到孔中以导电电路层。

公开(公告)号：US07234364B2

公开(公告)日：2007-06-26

申请号：US11159261

申请日：2005-06-23

Applicant: Tameharu Ohta

Inventor： Tameharu Ohta

IPC: G01L3/00

CPC classification number: G01C19/5719 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0314 ,  H05K2201/10727 ,  H05K2201/10977 ,  H01L2924/00014

Abstract: An angular rate sensor includes: a circuit board; a package including an angular rate sensor chip and a connection terminal; and a conductive member. The angular rate sensor chip is accommodated in the package. The package is disposed on the circuit board through the conductive member. The package further includes a first electrode disposed on a bottom of the package, the first electrode connecting to the connection terminal. The circuit board includes a second electrode disposed on a top of the circuit board. The angular rate sensor chip in the package is electrically connected to the circuit board through the connection terminal, the first and the second electrodes and the conductive member. The circuit board and the package are electrically and elastically connected by the conductive member.

Abstract translation: 角速率传感器包括：电路板; 包括角速率传感器芯片和连接端子的封装; 和导电构件。 角速率传感器芯片容纳在包装中。 封装通过导电部件设置在电路板上。 该封装还包括设置在封装的底部的第一电极，第一电极连接到连接端子。 电路板包括设置在电路板顶部的第二电极。 封装中的角速度传感器芯片通过连接端子，第一和第二电极和导电部件电连接到电路板。 电路板和封装通过导电构件电气弹性连接。

公开(公告)号：US20060280912A1

公开(公告)日：2006-12-14

申请号：US11418414

申请日：2006-05-03

Applicant: Rong-Chang Liang ,  Shih-Wei Ho ,  Eric Liu

Inventor： Rong-Chang Liang ,  Shih-Wei Ho ,  Eric Liu

IPC: B32B3/00

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01B1/24 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01R13/2414 ,  H05K2201/0221 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y10T428/24612 ,  Y10T428/2462 ,  H01L2924/00

Abstract: The present invention discloses structures and manufacturing processes of an ACF of improved resolution and reliability of electrical connection using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes the steps of (i) fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or (ii) selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.

Abstract translation: 本发明公开了具有预定配置，形状和尺寸的非随机阵列的微腔的具有改进的电连接分辨率和可靠性的ACF的结构和制造工艺。 制造方法包括以下步骤：（i）将导电颗粒流体填充到包含预定阵列的微腔的基底或载体网上，或（ii）阵列的选择性金属化，然后用填充材料填充阵列，并且第二选择性 填充微腔阵列上的金属化。 然后将由此制备的填充的导电微腔阵列用粘合剂膜覆盖或层压。

公开(公告)号：US06947258B1

公开(公告)日：2005-09-20

申请号：US10176016

申请日：2002-06-19

Applicant: Weijin Li

Inventor： Weijin Li

IPC: G11B17/32 ,  H01B1/22 ,  H05K3/32

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233

Abstract: An electrically conductive adhesive includes a resin component, a photoinitiator, and metal-coated polymer beads. The beads have an average diameter and a very narrow size distribution around the average diameter. The adhesive is applied between a read/write head and a suspension to attach the two, and the adhesive is cured by exposure to an illumination and/or heat. A pad spacer is included between the read/write head and the suspension to define a spacing and parallelism therebetween. The beads in the adhesive can form one or more layers between the read/write head and the suspension or can be disordered. The metal coating of the beads provide electrical conductivity between the read/write head and the suspension.

Abstract translation: 导电粘合剂包括树脂组分，光引发剂和金属涂覆的聚合物珠粒。 珠具有围绕平均直径的平均直径和非常窄的尺寸分布。 将粘合剂施加在读/写头和悬架之间以附接两者，并且粘合剂通过暴露于照明和/或热而固化。 读/写头和悬架之间包括衬垫间隔件，以限定它们之间的间隔和平行度。 粘合剂中的珠粒可以在读/写头和悬浮液之间形成一个或多个层，或者可以是无序的。 珠的金属涂层在读/写头和悬架之间提供导电性。

公开(公告)号：US20050195527A1

公开(公告)日：2005-09-08

申请号：US10788438

申请日：2004-03-01

Applicant: Satoshi Yamaguchi

Inventor： Satoshi Yamaguchi

IPC: B23K1/00 ,  B23K1/005 ,  B23K3/06 ,  B23K35/14 ,  B23K101/36 ,  G11B5/127 ,  G11B5/48 ,  G11B5/60 ,  G11B15/64 ,  G11B17/32 ,  G11B21/20 ,  G11B21/21 ,  H01L21/60 ,  H04R31/00 ,  H05K3/34

CPC classification number: G11B5/4853 ,  G11B5/4826 ,  H01L2224/742 ,  H05K3/3442 ,  H05K2201/0221 ,  H05K2201/10234 ,  Y02P70/613 ,  Y10T29/49021

Abstract: A magnetic head slider or a precise positioning actuator is electrically and mechanically connected to a suspension, by performing molten-solder connections using solder balls with cores that will not melt even at a solder-melting temperature.

Abstract translation: 磁头滑动器或精确的定位致动器通过使用具有不会在焊料熔化温度下熔化的芯的焊球执行熔融焊接连接来电连接和机械地连接到悬架。

公开(公告)号：US20050104213A1

公开(公告)日：2005-05-19

申请号：US10958980

申请日：2004-10-05

Applicant: Akiyoshi Aoyagi

Inventor： Akiyoshi Aoyagi

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H05K3/34

CPC classification number: H01L21/563 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electric connection terminal includes a brazing material, a plurality of particles dispersed in the brazing material and made of a resin, and a conductor film that coats a surface of each of the particles.

Abstract translation: 电连接端子包括钎焊材料，分散在钎焊材料中并由树脂制成的多个颗粒，以及涂覆每个颗粒的表面的导体膜。

公开(公告)号：US5965064A

公开(公告)日：1999-10-12

申请号：US176167

申请日：1998-10-21

Applicant: Yukio Yamada ,  Masao Saito ,  Junji Shinozaki ,  Motohide Takeichi

Inventor： Yukio Yamada ,  Masao Saito ,  Junji Shinozaki ,  Motohide Takeichi

IPC: C09J9/02 ,  H01B1/22 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  H01B1/02 ,  B32B5/00

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R12/52 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  Y10T428/2998

Abstract: An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals of, for example, an IC chip and of a circuit pattern, at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals or the circuit lines are disposed at close intervals, which adhesive comprises an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.

Abstract translation: 用于在例如IC芯片和电路图案的端子之间建立电连接的各向异性导电粘合剂以低成本建立电连接并且在连接时的绝缘性方面具有高可靠性而不遭受痛苦 即使当端子或电路线以紧密的间隔设置时，即使在电路中的电路线之间短路并且不引起电路上的任何障碍，该粘合剂包括分散在基体中的电绝缘粘合基质和导电颗粒，其中 导电颗粒包含至少两种不同平均粒度的导电颗粒产品，并且其中两种颗粒产品的每个颗粒都涂覆有不溶于绝缘粘合剂基质的电绝缘树脂。