公开(公告)号：US20180188205A1

公开(公告)日：2018-07-05

申请号：US15690624

申请日：2017-08-30

Applicant: Northwestern University

Inventor： Matthew Grayson ,  Jiajun Luo

IPC: G01N27/72 ,  G01R19/08 ,  G01R15/20 ,  H05K1/11

CPC classification number: G01N27/72 ,  G01R15/202 ,  G01R19/08 ,  G01R31/2648 ,  H05K1/11 ,  H05K2201/032

Abstract: Systems and methods can provide a fast and accurate way to measure conductivity and Hall effect, such that transient conductivities, transient carrier densities or transient mobilities can be measured on millisecond time scales, for example. The systems and methods can also reduce the minimum magnetic field needed to extract carrier density or mobility of a given sample, and reduce the minimum mobility that can be measured with a given magnetic field.

公开(公告)号：US09988730B2

公开(公告)日：2018-06-05

申请号：US15127433

申请日：2015-03-12

Applicant: Atotech Deutschland GmbH

Inventor： Tadahiro Nishigawa ,  Jun Higuchi ,  Hitoshi Ishikawa

IPC: C25D5/34 ,  C25D3/38 ,  H05K3/46 ,  H05K3/42 ,  H05K1/02

CPC classification number: C25D5/34 ,  C25D3/38 ,  C25D5/56 ,  H05K1/0296 ,  H05K3/424 ,  H05K3/427 ,  H05K3/467 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to a process (1) comprising treatment with an alkali metal hydroxide solution, a process (2) comprising treatment with an alkaline aqueous solution containing an aliphatic amine, a process (3) comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, a process (4) comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and a process (5) comprising copper electroplating, which are implemented sequentially.

公开(公告)号：US09826635B2

公开(公告)日：2017-11-21

申请号：US14556407

申请日：2014-12-01

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Tomota Nagaura ,  Kazuhiko Sakaguchi

IPC: B32B15/00 ,  H05K1/09 ,  B32B15/01 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D5/14 ,  C25D7/06 ,  C25D9/08 ,  C23C28/02 ,  C23C18/31 ,  C25D3/38 ,  C25D3/58 ,  C25D3/14 ,  C25D3/16 ,  C25D3/56 ,  C25D11/38 ,  C23C18/16 ,  H05K3/02

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.

公开(公告)号：US09699928B2

公开(公告)日：2017-07-04

申请号：US14370516

申请日：2013-01-04

Applicant: Access Business Group International LLC

Inventor： Joseph C. Van Den Brink ,  Sean T. Eurich ,  Neil W. Kuyvenhoven ,  Kaitlyn J. Turner ,  Benjamin C. Moes ,  Hai D. Nguyen

IPC: H05K1/00 ,  H05K7/02 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K13/00 ,  H01F27/28 ,  H05K3/36 ,  H01F38/14

CPC classification number: H05K7/02 ,  H01F27/2804 ,  H01F38/14 ,  H05K1/028 ,  H05K1/092 ,  H05K1/111 ,  H05K1/165 ,  H05K3/361 ,  H05K13/00 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/1028 ,  H05K2201/10386 ,  H05K2201/10401 ,  Y10T29/49117

Abstract: An item of print media (30) including an inductive secondary (50) for providing power to a load (32). The inductive secondary is responsive to an electromagnetic flux to generate a time-varying current or voltage therein. The current or voltage induced in the inductive secondary directly or indirectly powers the load to thereby enhance the functionality and/or the appeal of the item of print media without significantly adding to its cost. The load can provide a visual and/or auditory output, and can include an electroluminescent display, an e-ink display, a piezo speaker coil, an electrostatic speaker, an OLED, an LED or an LCD display. Embodiments of the invention can be utilized in connection with a wide variety of print media, including for example books, booklets, pamphlets, labels, magazines, manuals, brochures, maps, charts, posters, journals, newspapers or loose leaf pages.

公开(公告)号：US20170135220A1

公开(公告)日：2017-05-11

申请号：US15330844

申请日：2016-11-07

Applicant: THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO

Inventor： Perumal Varun Chadalavada ,  Daniel Wigdor

IPC: H05K3/02 ,  H05K1/09

CPC classification number: H05K3/027 ,  H05K1/0386 ,  H05K1/092 ,  H05K3/04 ,  H05K3/048 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/032 ,  H05K2201/0335 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0264 ,  H05K2203/0525 ,  H05K2203/0551 ,  H05K2203/068

Abstract: Film for use in preparing a printed circuit board (PCB) along with methods for making a PCB and producing a printable film are described herein. The film includes a first layer formed of a radiation-transparent material, a second layer formed of a curable adhesive material, a third layer formed of an electrically conductive material, and optionally, a fourth layer formed of an adhesive and a fifth layer formed of a removable material. Through the adhesive layers, the layers are bonded together to produce the printable film. To produce a PCB, the first layer is covered in ink distributed in a pattern representing the PCB, and the ink-covered film is exposed to radiation until the non-ink-covered portions of the second layer have cured. Then, the fifth layer is removed tearing away the electrically conductive material associated with the non-ink-covered portions of the second layer producing the PCB.

公开(公告)号：US09642247B2

公开(公告)日：2017-05-02

申请号：US14428839

申请日：2013-09-16

Applicant: CURAMIK ELECTRONICS GMBH

Inventor： Karsten Schmidt ,  Andreas Meyer ,  Alexander Legath ,  Martina Schmirler

IPC: C04B37/02 ,  C04B35/119 ,  H05K1/03 ,  H05K1/09 ,  C04B35/111

CPC classification number: H05K1/0306 ,  C04B35/111 ,  C04B35/119 ,  C04B37/021 ,  C04B37/023 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5248 ,  C04B2235/5436 ,  C04B2235/786 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/343 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H05K1/09 ,  H05K2201/0175 ,  H05K2201/032 ,  H05K2201/062 ,  Y10T156/10 ,  Y10T428/26 ,  Y10T428/266

Abstract: The invention relates to a metal-ceramic substrate and to a method for the production thereof, the substrate including at least one ceramic layer having first and second surface sides, at least one of the surface sides of which is provided with a metallization, wherein the ceramic material forming the ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide. The ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide in the following proportions, in each case in relation to the total weight thereof: zirconium dioxide between 2 and 15 percent by weight; yttrium oxide between 0.01 and 1 percent by weight; and aluminum oxide between 84 and 97 percent by weight, wherein the average grain size of the aluminum oxide used is between 2 and 8 micrometers and the ratio of the length of the grain boundaries of the aluminum oxide grains to the total length of all the grain boundaries is greater than 0.6.

公开(公告)号：US09642243B2

公开(公告)日：2017-05-02

申请号：US14240815

申请日：2012-09-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Muthu Sebastian ,  Dominic M. Travasso ,  Nancy S. Lennhoff ,  Steven T. Swartz

IPC: G03C5/58 ,  H05K1/02 ,  G06F3/044 ,  H05K3/06 ,  H05K1/09

CPC classification number: H05K1/0274 ,  G06F3/044 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0302 ,  H05K2201/032

Abstract: An article includes a multilayer structure, such as, e.g., a touch sensor, having two opposing sides and comprising a central polymeric UV transparent substrate, a transparent conductive layer on each of the two major opposing surfaces of the polymeric substrate, a metallic conductive layer on each transparent conductive layer, and a patterned photoimaging mask on each metallic conductive layer.

公开(公告)号：US20170098621A1

公开(公告)日：2017-04-06

申请号：US15379895

申请日：2016-12-15

Applicant: Tessera, Inc.

Inventor： Cyprian UZOH ,  Vage OGANESIAN ,  Ilyas MOHAMMED ,  Belgacem HABA ,  Piyush SAVALIA ,  Craig MITCHELL

IPC: H01L23/00 ,  H05K3/40 ,  H05K1/09

CPC classification number: H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

Abstract: An electrical connection structure includes a variable-composition nickel alloy layer with a minor constituent selected from a group consisting of boron, carbon, and tungsten, wherein at least over a portion of a conductive substrate, the concentration of the minor constituent varies throughout the variable-composition nickel alloy layer in a direction from the bottom surface of the variable-composition nickel alloy layer to the top surface of the variable-composition nickel alloy layer.

公开(公告)号：US09524813B2

公开(公告)日：2016-12-20

申请号：US14360904

申请日：2014-04-03

Applicant: Nuovo Film, Inc.

Inventor： Hakfei Poon

IPC: B32B3/00 ,  H01B13/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  G06F3/041 ,  H01B1/02 ,  H01B1/22 ,  H01L31/0224 ,  H01L31/18

CPC classification number: H01B13/30 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/032

Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region comprising a network of silver nanowires and means for protecting the nanowire from surface oxidation; and a second region, comprising a plurality of metal nanowires and means for protecting nanowire from surface oxidation, and metal oxide nanowires.

公开(公告)号：US09472772B2

公开(公告)日：2016-10-18

申请号：US14955782

申请日：2015-12-01

Applicant: AU Optronics Corporation

Inventor： Tsung-Ying Ke

IPC: H01L29/04 ,  H01L51/00 ,  H01L21/78 ,  H01L29/12 ,  H01L33/02 ,  H01L27/32 ,  H01L51/52 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H01L27/12

CPC classification number: H01L51/0097 ,  H01L21/78 ,  H01L21/7813 ,  H01L27/1266 ,  H01L27/3246 ,  H01L29/04 ,  H01L29/12 ,  H01L33/02 ,  H01L51/003 ,  H01L51/5237 ,  H01L51/5253 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/181 ,  H05K2201/032 ,  Y02E10/549 ,  Y02P70/521

Abstract: An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.