-
公开(公告)号：CN106413240A
公开(公告)日：2017-02-15
申请号：CN201610619791.5
申请日：2016-07-29
Applicant: 日东电工株式会社
IPC: H05K1/02
CPC classification number: H05K1/0219 , H05K2201/0335
Abstract: 本发明提供一种布线电路基板及其制造方法。在基底绝缘层上形成有导体图案。导体图案包括两个端子部和一个布线部。布线部形成为将两个端子部连接起来并且自各端子部延伸。以覆盖导体图案的端子部和布线部并且从端子部的表面上向布线部的表面上连续地延伸的方式形成有金属覆盖层。金属覆盖层由具有比镍的磁性低的磁性的金属形成，例如由金形成。以将形成于导体图案的金属覆盖层中的覆盖布线部的部分覆盖并且不将金属覆盖层中的覆盖端子部的部分覆盖的方式在基底绝缘层上形成覆盖绝缘层。
-
公开(公告)号：CN106376169A
公开(公告)日：2017-02-01
申请号：CN201510441939.6
申请日：2015-07-24
Applicant: 宏启胜精密电子(秦皇岛)有限公司 , 富葵精密组件(深圳)有限公司臻鼎科技股份有限公司
CPC classification number: H05K1/0228 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/028 , H05K1/0393 , H05K3/10 , H05K3/243 , H05K3/28 , H05K3/281 , H05K2201/0355 , H05K2201/0715 , H05K1/09 , H05K1/0218 , H05K3/18 , H05K2201/0335 , H05K2201/09218
Abstract: 本发明提供一种柔性电路板，可应用于高频信号传输，包括：一绝缘层，具有一第一表面与一与所述第一表面相对的第二表面；一线性信号线，形成于该绝缘层的该第一表面，该线性信号线的远离该绝缘层的表面形成一金属镀层，该金属镀层的厚度小于该线性信号线的厚度；多条接地线路，也形成于该绝缘层的该第一表面，且平行配置于该线性信号线的两侧；一线路图形，形成于该绝缘层的该第二表面；以及一电磁屏蔽层，覆盖于该线性信号线与该多条接地线路之上；其中，该金属镀层的电导率大于该线性信号线的电导率。本发明还包括上述柔性电路板的制作方法。
-
公开(公告)号：CN103715190A
公开(公告)日：2014-04-09
申请号：CN201310451485.1
申请日：2013-09-27
Applicant: LG伊诺特有限公司
Inventor： 三瓶友広
IPC: H01L25/075 , H01L33/62
CPC classification number: H01L24/04 , H01L23/3735 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/45 , H01L33/382 , H01L33/50 , H01L33/62 , H01L33/647 , H01L2224/04042 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/181 , H05K1/0274 , H05K1/0306 , H05K1/09 , H05K3/284 , H05K2201/0335 , H05K2201/09909 , H05K2201/10106 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/05599
Abstract: 一种发光器件，在用于照明或显示的背光单元中使用，该发光器件被设置为包括：衬底，包括第一电极和第二电极；LED芯片，布置在第一电极上；以及坝体，布置在衬底上，其中坝体被布置为与LED芯片间隔开，其中衬底包括直接铜接合（DCB）衬底，该DCB衬底包含第一铜层和第二铜层的，以及其中第一电极和第二电极分别包括填充其表面的孔隙的金属膜。在本申请提供的发光器件中，金属膜被布置成填充已位于第一电极图案的表面中以及第二电极图案的表面中的孔隙，因此，可以提高第一电极图案与LED芯片之间的安装力，并且提高第二电极图案与接合线之间的接合力。
-
公开(公告)号：CN103715190B
公开(公告)日：2018-03-09
申请号：CN201310451485.1
申请日：2013-09-27
Applicant: LG伊诺特有限公司
Inventor： 三瓶友広
IPC: H01L25/075 , H01L33/62
CPC classification number: H01L24/04 , H01L23/3735 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/45 , H01L33/382 , H01L33/50 , H01L33/62 , H01L33/647 , H01L2224/04042 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/181 , H05K1/0274 , H05K1/0306 , H05K1/09 , H05K3/284 , H05K2201/0335 , H05K2201/09909 , H05K2201/10106 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/05599
Abstract: 一种发光器件，在用于照明或显示的背光单元中使用，该发光器件被设置为包括：衬底，包括第一电极和第二电极；LED芯片，布置在第一电极上；以及坝体，布置在衬底上，其中坝体被布置为与LED芯片间隔开，其中衬底包括直接铜接合（DCB）衬底，该DCB衬底包含第一铜层和第二铜层的，以及其中第一电极和第二电极分别包括填充其表面的孔隙的金属膜。在本申请提供的发光器件中，金属膜被布置成填充已位于第一电极图案的表面中以及第二电极图案的表面中的孔隙，因此，可以提高第一电极图案与LED芯片之间的安装力，并且提高第二电极图案与接合线之间的接合力。
-
公开(公告)号：US12028976B2
公开(公告)日：2024-07-02
申请号：US17764402
申请日：2020-04-23
Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
Inventor： Jian-Yi Hao , Yan-Lu Li
CPC classification number: H05K1/14 , H01R12/58 , H05K3/36 , H05K3/42 , H05K2201/0335
Abstract: The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.
-
Patent Agency Ranking
公开(公告)号：US20190017188A1
公开(公告)日：2019-01-17
申请号：US16126470
申请日：2018-09-10
Applicant: KCF Technologies Co., Ltd.
Inventor： Seung Min KIM , Jeong Gil LEE
CPC classification number: C25D3/38 , C25D1/04 , C25D5/16 , C25D5/48 , C25D7/0614 , H05K1/0393 , H05K3/025 , H05K3/282 , H05K3/423 , H05K2201/0335 , H05K2203/0723
Abstract: Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm2, a mean width of roughness profile elements (Rsm) of 18 to 148 μm and a texture coefficient bias [TCB(220)] of 0.52 or less.
-
7.发明授权公开(公告)号：US09622352B2
公开(公告)日：2017-04-11
申请号：US14429741
申请日：2012-09-26
Applicant: MEIKO ELECTRONICS CO., LTD.
Inventor： Ryoichi Shimizu , Mitsuo Iwamoto , Mitsuaki Toda
CPC classification number: H05K1/188 , H01L21/568 , H01L21/6835 , H01L23/544 , H01L24/19 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2221/68359 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/2741 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32245 , H01L2224/82039 , H01L2224/82132 , H01L2224/83005 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2924/14 , H05K1/0269 , H05K1/0284 , H05K1/09 , H05K1/115 , H05K3/305 , H05K3/4007 , H05K2201/0335 , H05K2201/09154 , H05K2201/0939 , H05K2201/09472 , H05K2201/09918 , H05K2203/0353 , H05K2203/0361 , H05K2203/063 , Y02P70/613 , Y10T29/49131
Abstract: In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.
-
公开(公告)号：EP2713411B1
公开(公告)日：2018-10-31
申请号：EP13185895.3
申请日：2013-09-25
Applicant: LG Innotek Co., Ltd.
Inventor： TOMOHIRO, Sampei
IPC: H01L33/62 , H01L33/64 , H01L23/373 , H01L33/50
CPC classification number: H01L24/04 , H01L23/3735 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/45 , H01L33/382 , H01L33/50 , H01L33/62 , H01L33/647 , H01L2224/04042 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/181 , H05K1/0274 , H05K1/0306 , H05K1/09 , H05K3/284 , H05K2201/0335 , H05K2201/09909 , H05K2201/10106 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/05599
Abstract: A luminescence device used in a backlight unit for lighting or displaying may be provided that includes: a substrate 11 including a first electrode 12 and a second electrode 13; an LED chip disposed on the first electrode 12; and a dam 18 disposed on the substrate 11, wherein the dam 18 is disposed spaced from the LED chip 14 , wherein the substrate 11 comprises a direct copper bonding (DCB) substrate 11 including a first copper layer 2, a second copper layer 3 and a substrate body 1, and wherein the first electrode 12 and the second electrode 13 include respectively a metal film 35 which fills a void 31 of the surfaces thereof.
-
公开(公告)号：WO2014049721A1
公开(公告)日：2014-04-03
申请号：PCT/JP2012/074711
申请日：2012-09-26
Applicant: 株式会社メイコー
CPC classification number: H05K1/188 , H01L21/568 , H01L21/6835 , H01L23/544 , H01L24/19 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2221/68359 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/2741 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32245 , H01L2224/82039 , H01L2224/82132 , H01L2224/83005 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2924/14 , H05K1/0269 , H05K1/0284 , H05K1/09 , H05K1/115 , H05K3/305 , H05K3/4007 , H05K2201/0335 , H05K2201/09154 , H05K2201/0939 , H05K2201/09472 , H05K2201/09918 , H05K2203/0353 , H05K2203/0361 , H05K2203/063 , Y02P70/613 , Y10T29/49131
Abstract: 本発明は、銅層（４）に形成されたマーク（１２）を基準にして電子部品（１４）を位置決めする部品内蔵基板の製造方法におけるマーク形成工程において、センサーのサーチ範囲（７２）の中心であるサーチ中心（７４）からサーチ範囲（７２）の縁辺（７８）まで延びる仮想線をサーチ基準線（８０）とし、マーク（１２）の中心であるマーク中心（７６）をサーチ中心（７４）と合致させた状態で、マーク中心（７６）からサーチ基準線（８０）と同じ方向で、且つ、マーク（１２）の外形稜線（２５）まで延びる仮想線をマーク基準線（８２）としたとき、マーク基準線（８２）の長さがサーチ基準線（８０）の３０％以上の範囲となる位置にマーク（１２）の外形稜線（２５）が存在する形状にマーク（１２）を形成する。
Abstract translation: 根据本发明，在涉及基于形成在铜层（4）上的标记（12）定位电子部件（14）的部件嵌入式基板制造方法的标记形成工序中，标记（12）为 形成为具有存在于标记基准线（82）的长度为搜索基准线（80）的长度的至少30％的位置处的外脊线（25）。 搜索参考线（80）是从作为传感器的搜索区域（72）的中心的搜索中心（74）延伸到搜索区域（72）的边缘侧（78）的虚拟线， 并且标记参考线（82）是从作为标记（12）的中心的标记中心（76）延伸到与搜索参考方向相同方向的标记的外侧棱线（25）的虚拟线 当标记中心（76）与搜索中心（74）对准时，线（80）。
-
公开(公告)号：US20240179831A1
公开(公告)日：2024-05-30
申请号：US18515661
申请日：2023-11-21
Applicant: CANON KABUSHIKI KAISHA
Inventor： HIROYUKI YAMAGUCHI , MOMOKA UMEGAE
CPC classification number: H05K1/0262 , H05K1/112 , H04N25/709 , H05K2201/0335 , H05K2201/0776
Abstract: An electronic module includes a plurality of loads, a first wiring portion, a second wiring portion, a power source unit, and a feedback portion. The first wiring portion includes a plurality of first portions to which the plurality of loads are respectively connected, and a plurality of second portions each closest to a corresponding one of the plurality of first portions. The second wiring portion is connected to the plurality of second portions. The power source unit includes a feedback terminal, an output terminal, and a power source circuit. In the first wiring portion, a minimum path length from each of the plurality of second portions to the corresponding one of the plurality of first portions is smaller than 1/2 of a minimum path length from a part of the first wiring portion connected to the output terminal to the corresponding one of the plurality of first portions.
-
-
-
-
-
-
-
-
-
Search Results
32
records
(took 0.022 seconds)
