公开(公告)号：EP2704537A4

公开(公告)日：2014-10-08

申请号：EP12777596

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H01L23/12 ,  H05K3/00

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.

公开(公告)号：EP2766955A2

公开(公告)日：2014-08-20

申请号：EP12840476.1

申请日：2012-10-04

Applicant: FCI

Inventor： ELLISON, Jason J.

IPC: H01R12/71 ,  H01R13/648

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R13/6471 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0245 ,  H05K2201/09154 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/09781

Abstract: An electrical connector includes a printed circuit board that includes a body that carries a plurality of ground conductors that define respective ground contact pads, and a plurality of signal conductors that define respective signal contact pads. The contact pads are configured to mate with electrical contacts of a complementary electrical connector. The printed circuit board includes a ground coupling assembly that electrically connects at least a pair of the ground conductors.

公开(公告)号：EP2664223A1

公开(公告)日：2013-11-20

申请号：EP12700454.7

申请日：2012-01-03

Applicant: Robert Bosch GmbH

Inventor： RUEDINGER, Stefan ,  HEINRICH, Thomas ,  VOGELGESANG, Michael ,  FLEIG, Michael

IPC: H05K1/11 ,  H01R12/72

CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K2201/09154

Abstract: The invention relates to a direct electric contacting arrangement (1) having the following: a printed circuit board (2) with at least one land (3) and with a ramp (5) that is arranged in front of the land (3) in the direction of the printed circuit board edge (4), the printed circuit board (2) surface that adjoins the printed circuit board edge (4) being damage-prone up to a specified distance (s) from the edge; and a contact carrier (10) with at least one electric spring contact (11) that has a curved contact dome (12). In order to make direct electric contact, the contact carrier (10) and the printed circuit board (2) are movable on top of the other in parallel, in particular insertable into each other, until the curved contact dome (12) of the spring contact (11) rests on the land (3) after sliding up the ramp (5). According to the invention, the ramp (5) projection (h) that projects beyond the land (3) is selected such that immediately after sliding up the ramp (5), the contact dome (12) of the spring contact (10) contacts the land (3) at a distance (A) that is greater than the damage-prone distance (s) from the edge.

公开(公告)号：EP2571068A1

公开(公告)日：2013-03-20

申请号：EP11780357.7

申请日：2011-04-27

Applicant: Panasonic Corporation

Inventor： HORIUCHI, Makoto ,  TAGAMI, Naoki ,  MORI, Toshio ,  UEMOTO, Takaari ,  MIKI, Masahiro ,  OKANO, Kazuyuki ,  AKAI, Minako ,  GOTO, Yurika

IPC: H01L33/60 ,  F21S2/00 ,  G02B5/08 ,  F21Y101/02

CPC classification number: H01L25/0753 ,  F21K9/23 ,  F21V3/00 ,  F21V7/22 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/017 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/263 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate (101) according to the present invention includes a substrate (108) and a reflective film (106) that is formed on a front surface of the substrate (108) and has a front surface on which LED chips (102) are to be mounted, and the reflective film (106) is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips (102).

Abstract translation: 本发明的目的在于提供一种能够充分提高LED灯的发光效率的安装基板，制造方法，发光模块以及照明装置。 根据本发明的安装基板（101）包括基板（108）和形成在基板（108）的前表面上并且具有LED芯片（102）在其上的前表面的反射膜（106） 并且反射膜（106）由金属氧化物微粒和玻璃料制成，并且反射来自LED芯片（102）的光。

公开(公告)号：EP2519085A1

公开(公告)日：2012-10-31

申请号：EP10839578.1

申请日：2010-12-24

Applicant: Kyocera Corporation

Inventor： IMAMURA,Kazuhito ,  MORIYAMA,Yousuke

IPC: H05K1/02 ,  H01L23/12

CPC classification number: H05K3/0052 ,  H01L21/481 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/96 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/0008 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09918 ,  H05K2203/1572 ,  H01L2924/00

Abstract: [Problem] Provided are a many-up wiring substrate that makes it possible to manufacture a wiring substrate where electronic components can be precisely mounted on the wiring substrate, a wiring substrate obtained therefrom, and an electronic device that can be precisely mounted on an external electric circuit board.
[Solution] In a many-up wiring substrate including a base substrate (1) having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions (1a), the plurality of wiring substrate regions (1a) being arranged in a matrix, when seen in a transparent plan view, dividing grooves (2) of one main surface and dividing grooves (3) of an opposite main surface are formed to be deviated in one direction of a transverse direction or longitudinal direction, and a distance (L1) between bottoms of the dividing grooves (2) of one main surface and bottoms of the dividing grooves (3) of the opposite main surface is smaller than a distance (L2) between the bottoms of the dividing grooves (2) of the one main surface and the opposite main surface and a distance (L3) between the bottoms of the dividing grooves (3) of the opposite main surface and the one main surface. Even if a burr is formed on a side, a wiring substrate (1e) can be obtained that can reduce protrusion of the burr to the outside further than the portion that is the bottom of the dividing groove (2) of one main surface.

Abstract translation: [问题]提供了一种多层布线基板，其可以制造布线基板，其中电子部件可精确地安装在布线基板上，由其获得的布线基板和可精确地安装在外部的电子设备 电路板。 [解决方案]在多个布线基板区域（1a）的沿着多个布线基板区域（1a）的边界的多个布线基板中，包括具有形成为其主表面的一部分的分隔槽的基底基板（1） 排列成矩阵状，当从透明平面图看时，一个主表面的分隔槽（2）和相对主表面的分隔槽（3）形成为在横向或纵向的一个方向上偏离， 并且相对主表面的一个主表面的分隔槽（2）的底部和分隔槽（3）的底部之间的距离（L1）小于分隔槽（2）的底部之间的距离（L2） ）和相对的主表面之间的距离（L3）和相对主表面的分隔槽（3）的底部与一个主表面之间的距离（L3）。 即使在一侧形成有毛刺，也可以获得能够减少毛刺向外侧比一个主面的分隔槽（2）的底部的突出部更多的布线基板（1e）。

公开(公告)号：EP1460887B1

公开(公告)日：2010-07-14

申请号：EP04075869.0

申请日：2004-03-17

Applicant: The Boeing Company

Inventor： Anderson, David M. ,  Gladish, David R. ,  Johnson, Robert T. ,  Thomas, Terry L. ,  Senibi, Simon D. ,  Malkin, Matthew C.

IPC: H05K1/11 ,  H05K1/18 ,  H01R9/00

CPC classification number: H05K1/118 ,  H01R12/523 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/0195 ,  H05K2201/09154 ,  H05K2201/10189 ,  H05K2201/2009

公开(公告)号：EP1460887A2

公开(公告)日：2004-09-22

申请号：EP04075869.0

申请日：2004-03-17

Applicant: The Boeing Company

Inventor： Anderson, David M. ,  Gladish, David R. ,  Johnson, Robert T. ,  Thomas, Terry L. ,  Senibi, Simon D. ,  Malkin, Matthew C.

IPC: H05K1/11 ,  H01R12/08

CPC classification number: H05K1/118 ,  H01R12/523 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/0195 ,  H05K2201/09154 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A connector pad (12) is provided having a base (22), a top (24) opposite the base, and tapered sidewalls (26) therebetween. The tapering minimizes stress concentrations when the connector (36) is bonded into, or on the surface of a structure. The connector pad consists of a plurality of structural load carrying plies (28) suitable for sandwiching a flat structurally integrated wiring array (20) therebetween. A plurality of plated through holes (32) formed in the connector pad (12) enable access to the wiring array therein.

Abstract translation: 连接器焊盘（12）设置有基部（22），与基部相对的顶部（24）和在其间的锥形侧壁（26）。 当连接器（36）结合到结构中或结构的表面上时，渐缩使应力集中最小化。 连接器衬垫由多个结构承载层（28）组成，适合于将平坦的结构上集成的布线阵列（20）夹在其间。 形成在连接器焊盘（12）中的多个电镀通孔（32）能够访问其中的布线阵列。

公开(公告)号：EP1106040B1

公开(公告)日：2002-03-27

申请号：EP99934550.7

申请日：1999-07-01

Applicant: Siemens S.A.

Inventor： BOONE, Luc ,  DE STEUR, Hubert ,  HEERMAN, Marcel ,  VAN PUYMBROECK, Jozef

IPC: H05K3/40 ,  H01L21/48 ,  H01L23/13

CPC classification number: H01L21/4846 ,  B29L2031/3493 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K3/027 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09154 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (O) and the bottom part (U) of the substrate (S1).

Abstract translation: 本发明涉及一种用于制造具有顶部和具有检查交叉连接的衬底和互连的底部部分之间的交叉连接的导电互连。 基板（S1）给出在至少一个前表面和/或在一个凹部的至少一个内壁的区域的区域的倾斜，屋顶形或凸形轮廓（K1）。 金属化的衬底（S1）后，印刷电路板的导体形交叉连接（Q）在上述轮廓（K1）的同时在顶部部分印刷电路板的导体（L）的激光结构化的区域中产生的（0 ）和底部部分（基板U）（S1）。

公开(公告)号：EP1106040A1

公开(公告)日：2001-06-13

申请号：EP99934550.7

申请日：1999-07-01

Applicant: Siemens S.A.

Inventor： BOONE, Luc ,  DE STEUR, Hubert ,  HEERMAN, Marcel ,  VAN PUYMBROECK, Jozef

IPC: H05K3/40 ,  H01L21/48 ,  H01L23/13

CPC classification number: H01L21/4846 ,  B29L2031/3493 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K3/027 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09154 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (O) and the bottom part (U) of the substrate (S1).

公开(公告)号：EP0485790B1

公开(公告)日：1995-08-30

申请号：EP91118290.5

申请日：1991-10-26

Applicant: Löhr & Herrmann GmbH

Inventor： Löhr, Hans-Günter, Dr.-Ing. ,  Herrmann, Gunter, Dr.-Ing. ,  Mozzi, Josef

IPC: H05K3/00 ,  B23D45/10 ,  B27B33/20

CPC classification number: B23D45/105 ,  B27B33/20 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228