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    電子機器
    181.
    发明申请
    電子機器 审中-公开
    电子设备

    公开(公告)号：WO2004075613A1

    公开(公告)日：2004-09-02

    申请号：PCT/JP2003/002030

    申请日：2003-02-24

    Applicant: 富士通株式会社 ,  美喜 渉

    Inventor： 美喜 渉

    IPC: H05K7/00

    CPC classification number: G06F1/1616 ,  G06F1/1683 ,  H01R35/02 ,  H04M1/0214 ,  H05K1/028 ,  H05K2201/09063 ,  H05K2201/10356

    Abstract: ２つの基板を接続するための、折り畳まれたフレキシブルプリント回路と、当該フレキシブルプリント回路に挟まれ、長手方向に移動可能に前記フレキシブルプリント回路に取り付けられたケーブルとを有することを特徴とする電子機器を提供する。

    Abstract translation: 电子设备，其特征在于包括用于将两个基板彼此连接的折叠的柔性印刷电路和由柔性印刷电路保持的电缆并且沿纵向方向可移动地安装在柔性印刷电路上。

    METHOD FOR VERTICAL CONNECTION OF CONDUCTORS IN A DEVICE IN THE MICROWAVE RANGE
    183.
    发明申请
    METHOD FOR VERTICAL CONNECTION OF CONDUCTORS IN A DEVICE IN THE MICROWAVE RANGE 审中-公开
    导线器在微波范围内垂直连接的方法

    公开(公告)号：WO00013254A1

    公开(公告)日：2000-03-09

    申请号：PCT/SE1999/001466

    申请日：1999-08-26

    IPC: H01P1/04 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H01P3/08

    CPC classification number: H05K1/0222 ,  H01P1/047 ,  H05K1/115 ,  H05K1/183 ,  H05K3/4046 ,  H05K2201/09809 ,  H05K2201/10356

    Abstract: Method for connection of conductors (120, 110) which extend parallel to one another in a device (100, 600) in the microwave range. Each conductor comprises a conductive layer (160; 170), a layer (150; 195, 198) of a dielectric material and a groud plane (140; 180, 190). The ground planes of the two conductors are separated in the device by a core (130) made of a dielectric material. The various layers are arranged on one another in the desired order, and a cavity (310) is arranged in the device, extending from that layer (170) in the first conductor which is to be connected to the second conductor, at right angles to the main direction of this layer, up to and including the layer (150) on which the conductive layer of the second conductor is to lie. A component (400) comprising a stripline conductor is arranged in the cavity, the component being arranged so that electrical contact is brought about between the conductor (470) of the component and that layer (170) in the first conductor which is to be connected to the second conductor. Subsequently, the conductive layer (160) of the second conductor and its remaining ground plane and dielectric layer are arranged on the device so that electrical contact is brought about between the conductor (470) of the component and the conductive layer (160) of the second conductor.

    Abstract translation: 用于连接在微波范围内的装置（100,600）中彼此平行延伸的导体（120,110）的方法。 每个导体包括导电层（160; 170），电介质材料的层（150; 195,198）和凹槽平面（140; 180,190）。 两个导体的接地平面通过由介电材料制成的芯（130）在器件中分离。 各层以所需的顺序彼此排列，并且在该装置中布置空腔（310），该第一导体中的第一导体中的该层（170）从与第二导体连接的第一导体（170）成直角 该层的主要方向，直到并包括第二导体的导电层所在的层（150）。 包括带状线导体的部件（400）布置在空腔中，该部件被布置成使得电接触被带到部件的导体（470）和要连接的第一导体中的该层（170）之间 到第二个导体。 随后，第二导体的导电层（160）及其剩余的接地平面和电介质层被布置在器件上，使得在部件的导体（470）与导电层（160）之间形成电接触， 第二导体。

    PROCESS AND ARRANGEMENT FOR ESTABLISHING AN ELECTRIC CONNECTION
    184.
    发明申请
    PROCESS AND ARRANGEMENT FOR ESTABLISHING AN ELECTRIC CONNECTION 审中-公开
    方法和安排产生电连接

    公开(公告)号：WO98038699A1

    公开(公告)日：1998-09-03

    申请号：PCT/EP1998/001000

    申请日：1998-02-20

    IPC: H01R4/02 ,  H01R12/52 ,  H01R12/59 ,  H01R12/62 ,  H01R43/02 ,  H05K3/34 ,  H01R9/07

    CPC classification number: H01R12/62 ,  H01R4/029 ,  H01R12/52 ,  H01R12/598 ,  H05K3/3405 ,  H05K2201/10356

    Abstract: A process and arrangement are disclosed for establishing an electric connection with printed connection circuits (47) arranged in a grid at a predetermined distance from each other on a printed-circuit board (43) by means of a connecting device designed as at least one flat electric cable (49) with conductors (51) mutually insulated by an insulating material and arranged in a grid (51) at a distance from each other which corresponds substantially to the distance between the printed connection circuits (47). At least part of the conductors (51) is exposed by removing the insulating material in a region of the cable to be connected to the printed-circuit board (43) and the exposed regions of the conductors (51) are placed on and welded to the printed connection circuits (47) without intercalating any other connecting element.

    Abstract translation: 用于制备以预定的印刷电路板（43）位于连接导体轨迹（47）的网格间距与连接装置中的至少一个带状电缆（49），由绝缘彼此（51）绝缘材料的手段的电缆导体形式的电连接，其中，电缆导体的方法和连接器组件（ 51）具有节距，其与连接导体轨迹的间距（47），所述电缆导体（51一个的至少一部分）（与电路基板43基本上重合）连接电缆区域是通过去除所述绝缘材料和（在电缆的导体的暴露部分暴露 放置51），而不在连接导体轨迹（47）的任何进一步的连接器元件的插入并焊接到它们。

    ASSEMBLY OF SHIELDED CONNECTORS AND A BOARD HAVING PLATED HOLES
    185.
    发明申请
    ASSEMBLY OF SHIELDED CONNECTORS AND A BOARD HAVING PLATED HOLES 审中-公开
    屏蔽连接器组件和带盖板的板

    公开(公告)号：WO1997009753A1

    公开(公告)日：1997-03-13

    申请号：PCT/NL1995000303

    申请日：1995-09-06

    Applicant: CONNECTOR SYSTEMS TECHNOLOGY N.V. ,  PAAGMAN, Bernardus

    Inventor： CONNECTOR SYSTEMS TECHNOLOGY N.V.

    IPC: H01R23/68

    CPC classification number: H01R9/0515 ,  H01R12/523 ,  H01R13/658 ,  H05K1/0219 ,  H05K1/112 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2201/10356

    Abstract: Assembly provided with at least one shielded connector (2, 12, 17, 50) and a board (1), each shielded connector being connected to a predetermined side of said board (1) and being provided with at least one signal contact member (3) fitted in a hole (7) of the board (1), the connector having a shielded housing (61) to shield each signal contact member (3), wherein the board (1), except in areas where connectors (2, 12, 17, 50) are fitted to the board (1), is provided with a first continuous electrically conductive layer (9) on one side and a second continuous electrically conductive layer (10) on the opposite side, each of the shielded connector housings being electrically connected to one of said layers (9, 10), in order to prevent electromagnetic radiation generated by any of said signal contact members (3) from propagating to the outside world.

    Abstract translation: 装配有至少一个屏蔽连接器（2,12,17,50）和一个板（1），每个屏蔽连接器连接到所述板（1）的预定侧，并且设置有至少一个信号接触构件 3）安装在板（1）的孔（7）中，连接器具有用于屏蔽每个信号接触构件（3）的屏蔽壳体（61），其中板（1）除了连接器（2， 12，17，50）装配到板（1）上，在一侧设置有第一连续导电层（9），在相对侧设置有第二连续导电层（10），每个屏蔽连接器 壳体电连接到所述层之一（9,10），以便防止任何所述信号接触构件（3）产生的电磁辐射传播到外界。

    MODULAR CONNECTOR PLUG FOR HIGH SPEED DATA TRANSMISSION NETWORKS
    189.
    发明申请
    MODULAR CONNECTOR PLUG FOR HIGH SPEED DATA TRANSMISSION NETWORKS 审中-公开
    用于高速数据传输网络的模块化连接器插头

    公开(公告)号：WO2017015459A1

    公开(公告)日：2017-01-26

    申请号：PCT/US2016/043334

    申请日：2016-07-21

    Applicant: BEL FUSE (MACAO COMMERCIAL OFFSHORE) LIMITED ,  MAROWSKY, Richard, D. ,  GUTTER, David, H.

    Inventor： MAROWSKY, Richard, D. ,  GUTTER, David, H. ,  BELOPOLSKY, Yakov

    IPC: H01R13/6466 ,  H01R24/64 ,  H05K1/02 ,  H05K1/11 ,  H01R13/6463 ,  H01R24/28

    CPC classification number: H01R13/6466 ,  H01R13/6463 ,  H01R13/665 ,  H01R24/28 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/10295 ,  H05K2201/10356

    Abstract: A modular connector plug (100) includes controlled capacitances to compensate for near end cross talk at the connector interface created by interaction of signals having signal frequencies in a data transmission bandwidth. A PCB (102) is configured to receive cable pairs (114, 116, 118, 120), and a connector assembly (122) includes first and fourth plug contacts corresponding to the first cable pair and second and third plug contacts corresponding to the second cable pair. First ends of each contact are connected to the PCB, and second ends extend in parallel with each other and in transverse orientation with respect to the PCB length, collectively defining a contact interface proximate the contact end. An insulative material at least partially covers plug contacts, wherein respective compensating capacitances are defined proximate the contact interface by the insulative material as between at least the first and second contacts, and the third and fourth contacts.

    Abstract translation: 模块化连接器插头（100）包括受控电容以补偿由数据传输带宽中具有信号频率的信号的相互作用产生的连接器接口处的近端串扰。 PCB（102）被配置为接收电缆对（114,116,118,120），并且连接器组件（122）包括对应于第一电缆对的第一和第四插头触头以及对应于第二电缆对的第二和第三插头触头 电缆对。 每个触点的第一端连接到PCB，并且第二端彼此平行并相对于PCB长度横向定向延伸，共同限定接触端附近的接触界面。 绝缘材料至少部分地覆盖插头触点，其中相应的补偿电容通过绝缘材料在至少第一和第二触点之间以及第三和第四触点之间被界定在接触界面附近。

    プリント配線基板
    190.
    发明申请
    プリント配線基板 审中-公开
    印刷线路板

    公开(公告)号：WO2017006553A1

    公开(公告)日：2017-01-12

    申请号：PCT/JP2016/003169

    申请日：2016-07-04

    Applicant: 日本電気株式会社

    Inventor： 柏倉　和弘 ,  上村　文子

    IPC: H05K1/02 ,  H05K3/46 ,  H05K9/00

    CPC classification number: H05K1/0224 ,  H05K1/02 ,  H05K1/115 ,  H05K1/141 ,  H05K1/185 ,  H05K3/46 ,  H05K9/00 ,  H05K2201/09609 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10356

    Abstract: 本発明の目的は電気ケーブルからのＥＭＩ放射を抑制できるプリント基板を提供することである。そのために本発明のプリント基板は、電気ケーブルが接続される信号配線を備えたプリント基板であって、前記電気ケーブルが接続される信号配線の両側を上下にグランド層で挟み、前記上下のグランド層を複数のスルーホールで接続し、前記スルーホールは前記信号配線とその近傍に、抑制したい電磁波の最大周波数に対応する波長に応じた間隔を開けて設ける。

    Abstract translation: 本发明的目的是提供一种能够抑制来自电缆的EMI发射的印刷电路板。 为了实现上述目的，该印刷电路板设置有与电缆连接的信号布线，电缆连接的信号线由上下夹着地层，上下接地层为 通过多个通孔连接，并且通孔设置在信号布线及其附近，其间隔与对应于要被抑制的电磁波的最大频率相关联的波长。

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