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公开(公告)号：JPWO2004056162A1
公开(公告)日：2006-04-20
申请号：JP2004560580
申请日：2002-12-18
Applicant: 箕輪興亜株式会社
IPC: H01L23/12 , H01C1/142 , H01C1/16 , H01C17/00 , H01C17/28 , H01G4/252 , H01L21/48 , H01L21/60 , H01L23/31 , H05K3/06 , H05K3/24
CPC classification number: H01C17/003 , H01C1/16 , H01C17/28 , H01L21/4853 , H01L23/3128 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/19041 , H05K3/06 , H05K3/243 , H05K2203/0542 , H01L2924/00014 , H01L2924/00
Abstract: 実装面(1)に複数の端子(3)が点在し、当該端子(3)上に導体が形成されたフリップチップ実装用電子部品の製造法において、バンプ(7)間距離を小さくし得るフリップチップ実装を実現する。そのためには、前記実装面(1)を所定厚みの導体で被覆する工程と、前記端子(3)部と対応位置となる導体表面をマスクする工程と、当該マスク(6)部以外の導体を除去処理する工程とを有し、これら工程をこの順に実施する。バンプは銅からなることが好ましい。
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公开(公告)号：JP2006066865A
公开(公告)日：2006-03-09
申请号：JP2005028829
申请日：2005-02-04
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： NAKAMORI TAKEFUMI
IPC: H01L21/60
CPC classification number: H01L2224/11 , H01L2924/19043
Abstract: PROBLEM TO BE SOLVED: To obtain an electronic component having a conductive projection 9 with a structure capable of withstanding an external force after mounting as a terminal. SOLUTION: In an electronic component having a plurality of circuit elements formed on the surface of a rectangular substrate 1 and an external terminal of the circuit element comprising a conductive projection 9, the circuit element is coated with an overcoat film 7, while leaving a part of an electrode 2 constituting the circuit element as lands 4a and 4b. A dimension in the long-edge direction of the substrate 1 of the lands 4a and 4b is larger than a dimension in the short-edge direction of the substrate 1. The conductive projection 9 is fixed to the lands 4a and 4b by a fixing member in an amount roughly proportional to area values of the lands 4a and 4b. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：获得具有能够承受作为端子的安装后的外力的结构的导电突起9的电子部件。 解决方案：在具有形成在矩形基板1的表面上的多个电路元件和包括导电突起9的电路元件的外部端子的电子元件中，电路元件涂覆有外涂膜7，同时 将构成电路元件的电极2的一部分留作为焊盘4a和4b。 焊盘4a，4b的基板1的长边方向的尺寸大于基板1的短边方向的尺寸。导电突起9通过固定部件固定在焊盘4a，4b上 其量大致与焊盘4a和4b的面积值成比例。 版权所有（C）2006，JPO＆NCIPI
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13.发明专利Tray for burning glass-containing article to be burned and method of manufacturing glass-containing ceramic resistor 审中-公开用于烧制玻璃的陶瓷托盘及其制造含玻璃陶瓷电阻的方法
公开(公告)号：JP2005335993A
公开(公告)日：2005-12-08
申请号：JP2004155484
申请日：2004-05-26
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： HOKIBARA SHIGERU
Abstract: PROBLEM TO BE SOLVED: To provide a tray 1 for burning a glass 6-containing article to be burned, which can be sufficiently suppressed against destruction. SOLUTION: The tray 1 has cuts 4 extending inward from the outer end of it, and is made of a material able to absorb a liquid-state glass 6. It is preferable that the material able to absorb the liquid-state glass 6 is a porous ceramic, the tray is a bottomed container having sidewalls 3, and the surface (bottom surface 2) of the tray 1 in contact with an article to be burned 5 has unevenness such as a corrugation. The tray 1 can be used for manufacturing a glass-containing ceramic resistor, for instance. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种用于燃烧待燃烧的含玻璃6的物品的托盘1，其可以被充分地抑制破坏。 解决方案：托盘1具有从其外端向内延伸的切口4，并且由能够吸收液态玻璃6的材料制成。优选的是能够吸收液态玻璃的材料 图6是多孔陶瓷，托盘是具有侧壁3的有底容器，并且托盘1的与要燃烧的物品5接触的表面（底面2）具有凹凸等皱纹。 例如，托盘1可用于制造含玻璃陶瓷电阻器。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005249799A
公开(公告)日：2005-09-15
申请号：JP2005074879
申请日：2005-03-16
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： OBA ETSUO , INUKAI ATSUOMI , KARASAWA FUMIAKI , YAJIMA HIROSHI
Abstract: PROBLEM TO BE SOLVED: To suppress a variation in each resistor 2 in a stress sensor in which a post 6 is stuck or unified on the surface of an insulation substrate 3; and the direction and the magnitude of the stress can be obtained from a resistance value change of a resistance element 8, due to a stimulation to a plurality of the resistance elements 8 resulting from the stress applied to the post 6. SOLUTION: The resistance element 8 consists of the resistor 2 formed by a screen printing between electrodes for the resistance elements used as a counterpart arranged on the surface of the insulation substrate 3. The electrode for the resistance element is connected by a conductor 9 into a substrate terminal 5 allotted to the end of the insulation substrate 3. The electrode for the resistance element, the conductor 9 and a printing accuracy adjusting material 7 have a predetermined height from the surface of the insulation substrate 3. For all of the plurality of resistance elements 8, the conductor, the printing accuracy adjusting material 7 and the electrode for the resistance element are arranged around over three directions of the single resistor 2, and the resister 2 is a resistor made of a carbon resin system. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：为了抑制在绝缘基板3的表面上将柱6粘合或一体化的应力传感器中的每个电阻器2的变化， 并且由于施加到柱6上的应力引起的多个电阻元件8的刺激，可以从电阻元件8的电阻值变化获得应力的方向和大小。解决方案： 电阻元件8由电阻器2构成，电阻器2通过丝网印刷形成用于电阻元件的电极，该电阻元件用作布置在绝缘基板3的表面上的对应物。用于电阻元件的电极通过导体9连接到基板端子 分配给绝缘基板3的端部。用于电阻元件的电极，导体9和印刷精度调节材料7具有距离绝缘基板3的表面的预定高度。对于所有多个电阻元件8 导体，印刷精度调节材料7和电阻元件用电极配置在单个抗蚀剂的三个方向的周围 或2，电阻器2是由碳树脂系统制成的电阻器。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JPWO2003087750A1
公开(公告)日：2005-08-18
申请号：JP2003584647
申请日：2003-03-25
Applicant: 箕輪興亜株式会社
CPC classification number: G06F3/0338 , F16B11/006 , G01L5/161 , G01L5/223
Abstract: 接着剤(1)にて基板(3)と固着されるポスト(2)への応力付与により、当該基板(3)に配された歪ゲージ(4)が刺激され、当該歪ゲージ(4)特性値変化から当該応力に関する情報を得る応力センサにおいて、ポスト(2)と基板(3)等の固定部材とを固着させる接着剤(1)の存在に起因する応力センサ感度ばらつきを低減する。そのためには、ポスト(2)周囲の接着剤(1)の余剰分を所定領域内に留める手段を設ける。当該手段は、例えばポスト(2)周囲の基板(3)面上に連続した又は断続的な凸部(堰き止め部材(5))を形成すること、若しくはポスト(2)周囲の基板(3)面に余剰接着剤(1)を溜める凹部を形成すること等である。
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Patent Agency Ranking
公开(公告)号：JPWO2003081611A1
公开(公告)日：2005-07-28
申请号：JP2003507856
申请日：2002-03-25
Applicant: 箕輪興亜株式会社
CPC classification number: H01G2/065 , H01C1/01 , H05K3/3442 , H05K2201/09181 , H05K2201/09781 , H05K2201/10045 , Y02P70/613
Abstract: 3以上の奇数個の端子を有するネットワーク回路が絶縁基板面に形成されてなる面実装型チップネットワーク部品において、ツームストン現象を抑制する。そのためには、ネットワーク回路が絶縁基板(2)面に偶数個形成され、且つ端子(1)が絶縁基板(2)の向かい合う辺縁にそれぞれ同数配置する。またネットワーク回路が絶縁基板(2)面に偶数個形成され、且つ端子(1)が、絶縁基板(2)の面の中心を対称の中心とした点対称位置の絶縁基板(2)の辺縁にそれぞれ配置する。
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17.发明专利Manufacturing method of resistance element, and stress sensor using same for operating electronic appliance 审中-公开电阻元件的制造方法和使用电子仪器的应力传感器
公开(公告)号：JP2004363528A
公开(公告)日：2004-12-24
申请号：JP2003182390
申请日：2003-06-26
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： INUKAI ATSUOMI , TAKAYAMA TOSHIJI
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a resistance element wherein the generation of its crack can be prevented. SOLUTION: The manufacturing method is performed through a resistance-value adjusting process wherein a desired resistance value is obtained by heating a resistor 1 while scanning the surface of the resistor 1 without forming any groove in the resistor 1. An example of the foregoing heating means is a laser projection. Also, the manufacturing method is performed through the resistance-value adjusting process wherein the desired resistance value is obtained by so adjusting a laser irradiating and heating region 4 as to include in it the whole of the region of the resistor 1 or the most thereof, and by adjusting a laser irradiating time/a laser power value. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供可以防止产生裂纹的电阻元件的制造方法。 解决方案：通过电阻值调整处理进行制造方法，其中通过在扫描电阻器1的表面的同时加热电阻器1而不在电阻器1中形成任何凹槽来获得期望的电阻值。 上述加热装置是激光投影。 此外，通过电阻值调整处理进行制造方法，其中通过调节激光照射和加热区域4获得期望的电阻值，使其包括电阻器1的整个区域或其中最大的区域， 并且通过调整激光照射时间/激光功率值。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JPWO2005091313A1
公开(公告)日：2008-02-07
申请号：JP2006511132
申请日：2005-01-21
Applicant: 箕輪興亜株式会社
CPC classification number: H01C1/16 , H01C1/144 , H01C13/02 , H01G4/40 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/351 , H05K1/111 , H05K3/3436 , H05K2201/094 , H05K2201/10045 , H05K2201/10234 , Y02P70/613 , H01L2924/00
Abstract: 基板(1)の一方の面に複数の回路素子及び導電性突起(9)からなる当該回路素子の外部端子を有する電子部品において、実装後に外力に耐え得る構造とする。そこで単体の回路素子は、対となる電極(2)と、当該電極(2)に接触する抵抗体(3)又は誘電体を構成要素とし、当該電極(2)の一部をランド(4)として露出させつつ前記回路素子がオーバーコート(7)により被覆され、前記導電性突起(9)は固着部材を含み、当該固着部材により前記ランド(4)に固着され、前記ランド(4)のうち少なくとも3つのランド(4b)が他のランド(4a)よりも面積が大きく、前記面積の大きいランド(4b)にのみ導電性突起(9)が固着された場合に当該導電性突起(9)と平地とが接触した状態で電子部品が自立可能であり、全ての導電性突起(9)が実質的に同一寸法の導電性ボール(10)とランド(4)全面との固着で形成されることとする。
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公开(公告)号：JP2006080146A
公开(公告)日：2006-03-23
申请号：JP2004259833
申请日：2004-09-07
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： TAKAYAMA TOSHIJI , TERAOKA HIDEYUKI
Abstract: PROBLEM TO BE SOLVED: To maintain highly the joint position accuracy of the piece 2 of a resistor and the piece 1 of an electrode at the time of manufacturing the resistor where a pair of electrode pieces 1 are constitutively jointed at the end opposite to the piece 2 of the resistor. SOLUTION: After jointing the single piece 1 of an electrode and the piece 2 of a resistor, the manufacturing method comprises a process for cutting or removing the portion of the piece 1 of the electrode opposite to the side of the piece 2 of the resistor other than the end opposite to the piece 2 of the resistor. It is preferred to have a gap between the side of the piece 2 of the resistor other than the end opposite to the piece 2 of the resistor and the opposite side of the piece 1 of the electrode. Further, it is preferred that formation of the gap may be realized in an electrode piece shape. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题为了在制造电阻器时电阻器的片2与电极片1的接合位置精度保持高度，其中一对电极片1在相对的端部组成接合 到电阻器的片2。 解决方案：在连接电极的单件1和电阻器件2之后，制造方法包括用于切割或去除电极件1的与片2侧相反的部分的方法 电阻器除了与电阻器件2相对的端部之外。 优选地，电阻器件2的与电阻器件2相对的端部之外的边缘和电极件1的相对侧之间具有间隙。 此外，优选地，可以以电极片形状实现间隙的形成。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP3691842B1
公开(公告)日：2005-09-07
申请号：JP2005074879
申请日：2005-03-16
Applicant: 箕輪興亜株式会社
Abstract: PROBLEM TO BE SOLVED: To suppress a variation in each resistor 2 in a stress sensor in which a post 6 is stuck or unified on the surface of an insulation substrate 3; and the direction and the magnitude of the stress can be obtained from a resistance value change of a resistance element 8, due to a stimulation to a plurality of the resistance elements 8 resulting from the stress applied to the post 6. SOLUTION: The resistance element 8 consists of the resistor 2 formed by a screen printing between electrodes for the resistance elements used as a counterpart arranged on the surface of the insulation substrate 3. The electrode for the resistance element is connected by a conductor 9 into a substrate terminal 5 allotted to the end of the insulation substrate 3. The electrode for the resistance element, the conductor 9 and a printing accuracy adjusting material 7 have a predetermined height from the surface of the insulation substrate 3. For all of the plurality of resistance elements 8, the conductor, the printing accuracy adjusting material 7 and the electrode for the resistance element are arranged around over three directions of the single resistor 2, and the resister 2 is a resistor made of a carbon resin system. COPYRIGHT: (C)2005,JPO&NCIPI
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