Abstract:
An ultraviolet reactive ink is applied to a translucent substrate in the desired circuit image and partially cured to a tacky state with ultraviolet radiation. A resist material is then applied to the substrate in the negative circuit image and metallic particles are deposited on the ink by vacuum deposition. The ink is then further cured to a hardened state with ultraviolet radiation applied from both above and beneath the substrate to counteract the tendency of the metal to reflect radiation applied only from above the substrate. Finally, the resist material is removed from the substrate leaving the fully formed circuit board comprising the substrate, the fully cured ink circuit image bonded thereto, and a metallic conductive layer on the ink.
Abstract:
An implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion. In one example, the lead body may comprise a heat-formed bias portion. In another example, an outer insulator is fused to the lead body. In such an example, a lead body fusable plug may be disposed distal to at least one conductor. In another example, the lead comprises an inner boot and an outer boot fused to one another. In another example, the lead includes an atraumatic tip fused to the lead distal end portion. In another example, the lead body is reducable in size using heat shrink tubing. In yet another example, two or more lead sections may be interconnected using an outer insulator fused to the respective lead bodies. In a further example, a stiffener member is fused to the lead body adjacent a lead component.
Abstract:
A polymer lead-frame is made from a flexible substrate with flexible conductive traces. The generally square lead-frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.
Abstract:
A method for fabricating a shielded plastic enclosure for housing electronic equipment involves applying to at least one interior surface of the enclosure a layer of shielding composition which is a suspension of silver-coated magnetite particles in a U.V. curable resin. The thickness of this layer of shielding material is such that it effectively shields against electromagnetic interference, radio frequency interference and electrostatic discharge. Thereafter the shielding material is cured by exposure to a U.V. source.
Abstract:
An apparatus for applying preselected dye images to members incident to processes of the type utilizing sheets bearing dyes in the mirror images of the preselected images, wherein the sheets are overlayed on the members and maintained in pressurized engagement therewith while the sheets and the members are heated. The apparatus comprises a bed for receiving a member thereon with a dye bearing sheet on the member and a resiliently flexible membrane which is positionable over the sheet on the member. A vacuum assembly of the apparatus is operable to evacuate the area between the membrane and the bed in order to draw the membrane into pressurized engagement with the sheet on the member. Radiant heating elements of the apparatus are operable to heat the membrane after the vacuum assembly has been actuated, whereby the dye on the sheet is applied to the member to produce the preselected image thereon.
Abstract:
An ultraviolet reactive ink is applied to a translucent substrate in the desired circuit image and partially cured to a tacky state with ultraviolet radiation. A resist material is then applied to the substrate in the negative circuit image and metallic particles are deposited on the ink by vacuum deposition. The ink is then further cured to a hardened state with ultraviolet radiation applied from both above and beneath the substrate to counteract the tendency of the metal to reflect radiation applied only from above the substrate. Finally, the resist material is removed from the substrate leaving the fully formed circuit board comprising the substrate, the fully cured ink circuit image bonded thereto, and a metallic conductive layer on the ink.
Abstract:
A method and apparatus for effecting sublimation printing of a substrate wherein a matrix comprising the design to be printed is electrostatically charged in a given polarity and then a fine disperse dye powder, oppositely charged, is brought into contact with said matrix wherein the charged matrix attracts the oppositely charged dye particles to effect coating of the matrix with the dye, after which the coated matrix is moved into registry with the substrate to be printed, and specifically in overlying relation with respect to a surface of the substrate that has been coated with a dye receptive coating, after which the matrix is brought into pressurized contact with the coated surface of the substrate to cause sublimation of the dye pattern into said coated substrate surface.
Abstract:
The present invention relates to a telecommunications termination panel with a housing including a front opening and a rear opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. A cable path is defined along a bottom of the housing along the first side between the cable entry of the tray and the rear opening. A movable plate is positioned adjacent the first side and is movable between a first position defining an upper limit of the cable path when the tray is closed and a second position allowing access to the cable path when the tray is open. The movement of the plate between the first and second positions is actuated by the movement of the tray between the closed and open positions. The present invention further relates to a telecommunications termination panel with a housing including a front opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. The tray is pivotable between an open position and a closed position. The tray includes a cover which can be moved between an operational position and an access position when the tray is in the open position. With the cover in the operational position, the tray is prevented from moving from the open position to the closed position.
Abstract:
An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.
Abstract:
The present invention relates to a telecommunications termination panel with a housing including a front opening and a rear opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. A cable path is defined along a bottom of the housing along the first side between the cable entry of the tray and the rear opening. A movable plate is positioned adjacent the first side and is movable between a first position defining an upper limit of the cable path when the tray is closed and a second position allowing access to the cable path when the tray is open. The movement of the plate between the first and second positions is actuated by the movement of the tray between the closed and open positions. The present invention further relates to a telecommunications termination panel with a housing including a front opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. The tray is pivotable between an open position and a closed position. The tray includes a cover which can be moved between an operational position and an access position when the tray is in the open position. With the cover in the operational position, the tray is prevented from moving from the open position to the closed position.