公开(公告)号：EP0129023A3

公开(公告)日：1986-12-17

申请号：EP84104630

申请日：1984-04-25

Applicant: David Durand and Raymond Iannetta

Inventor： Durand, David

IPC: B41F17/00

CPC classification number: B41F17/006

Abstract: U An apparatus for applying preselected dye images to i members incident to processes of the type utilizing sheets bearing dyes in the mirror images ofthe preselected images, wherein the sheets (108) are overlayed on the members (88) ; and maintained in pressurised engagement therewith while the sheets and the members are heated. The apparatus comprises a bed (14) for receiving a member thereon with a dye bearing sheet on the member and a resiliently flexible membrane (16) which is positionable over the sheet on the member. A vacuum assembly (18) of the apparatus is oper- ableto evacuate the area between the membrane (16) and the bed (14) in order to draw the membrane into pressurised engagement with the sheet on the member. Radiant heating elements (80) of the apparatus are operable to heat the membrane afterthe vacuum assembly has been actuated, whereby the dye on the sheet is applied to the member to produce the preselected image thereon.

公开(公告)号：US08055354B2

公开(公告)日：2011-11-08

申请号：US12467978

申请日：2009-05-18

Applicant: Paul E. Zarembo ,  Mohan Krishnan ,  David Durand

Inventor： Paul E. Zarembo ,  Mohan Krishnan ,  David Durand

IPC: A61N1/05

CPC classification number: A61N1/056 ,  H01R13/18 ,  H01R2201/12 ,  Y10T29/49117

Abstract: An implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion. The lead body includes one or more longitudinally extending lumens. A conductor is received in, and extends along, a lumen. In varying examples, the implantable lead further comprises a tubular electrode co-axial with, and overlying portions of, the lead body. In one example, a lumen wall is sized and shaped to urge an electrically conductive interposer coupled with the conductor toward an inner surface of the electrode. In another example, a ring member is disposed within a lumen and the conductor is drawn and coupled thereto. In yet another example, an electrically conductive connector couples a first and a second conductor via grooves or threads. In a further example, an axial support member couples a distal end electrode and the lead body. Methods associated with the foregoing are also discussed.

Abstract translation: 可植入引线包括从引线近端部分延伸到引线远端部分的引线体。 引线体包括一个或多个纵向延伸的腔。 导体被容纳在内腔中并沿着其延伸。 在可变示例中，可植入引线还包括与引线主体同轴并且覆盖引线主体的部分的管状电极。 在一个示例中，腔壁的尺寸和形状被设计成将与导体耦合的导电插入件推向电极的内表面。 在另一示例中，环构件设置在管腔内并且导体被拉伸并与其连接。 在又一示例中，导电连接器通过凹槽或螺纹将第一和第二导体连接。 在另一示例中，轴向支撑构件将远端电极和引线体联接。 还讨论了与前述相关的方法。

公开(公告)号：US06761393B2

公开(公告)日：2004-07-13

申请号：US10182910

申请日：2002-08-02

Applicant: David Durand ,  Dominique Pastourel

Inventor： David Durand ,  Dominique Pastourel

IPC: B60J510

CPC classification number: B60J5/06 ,  B60J5/062 ,  B60J5/12 ,  B60J5/125 ,  E05D15/30 ,  E05F15/63 ,  E05F15/649 ,  E05Y2900/516 ,  E05Y2900/548 ,  Y10T16/35

Abstract: A motor vehicle trunk door articulated to the ends of a first arm mounted pivoting, at its other end, about a vertical lateral pin integral with a body. The truck door moves from a closing position towards an opening position, substantially perpendicular to the closing position, by the first arm having a curved shape, and a second arm. One of the ends of the second arm is secured to the trunk door and the other end is mounted pivoting on a sliding sleeve mounted on a guide rail.

Abstract translation: 铰链到第一臂的端部的机动车辆行李箱门，其安装在其另一端围绕与主体成一体的垂直侧向销枢转。 卡车门从关闭位置朝着基本上垂直于关闭位置的打开位置，由具有弯曲形状的第一臂和第二臂移动。 第二臂的一个端部被固定到行李箱门，另一端安装在安装在导轨上的滑动套筒上。

公开(公告)号：US5531020A

公开(公告)日：1996-07-02

申请号：US112225

申请日：1993-08-27

Applicant: David Durand ,  Roger A. Iannetta, Jr.

Inventor： David Durand ,  Roger A. Iannetta, Jr.

IPC: C09J163/00 ,  H01B1/22 ,  H01L21/48 ,  H01L21/60 ,  H01R4/04 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L24/83 ,  C09J163/00 ,  H01B1/22 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/81 ,  H01R4/04 ,  H05K3/1258 ,  H05K3/321 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H05K1/095 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/28 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith is disclosed. First, three dimensional, essentially square channels interspersed with lands are formed within a dielectric material on a substrate. The channels are then filled in one pass with a curable polymeric material containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components are place to engage the conductive material. The curable material is then cured after placing the electronic component(s).

Abstract translation: 公开了一种制造具有组装的至少一个电子电路部件的平面的地下电子电路的方法。 首先，在衬底上的电介质材料内形成散布有焊盘的三维，基本上为方形的通道。 然后将通道用含有导电金属填料的可固化聚合物材料一次填充，使得由该导电材料形成的电路迹线的上表面基本上与焊盘的上表面相同。 电路元件是与导电材料接合的地方。 然后在放置电子部件之后固化可固化材料。

公开(公告)号：US5455394A

公开(公告)日：1995-10-03

申请号：US112226

申请日：1993-08-27

Applicant: David Durand ,  Chon M. Wong ,  Roger A. Iannetta, Jr.

Inventor： David Durand ,  Chon M. Wong ,  Roger A. Iannetta, Jr.

IPC: H01L21/60 ,  H01L23/495 ,  H05K1/18

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A polymer lead frame is made from a flexible substrate with flexible conductive traces. The generally square lead frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.

Abstract translation: 聚合物引线框架由具有柔性导电迹线的柔性基板制成。 大致正方形的引线框架具有从拐角向中心部分延伸的对角切口，以及位于模具的占位面积内的中心孔。 模具直接粘合到引线框架上，优选地与各向异性的导电粘合剂粘合。 将模具放置在引线框架在夹具中。 施加保持力以固定模具，并且如果需要，在固化周期期间施加固化力。 固定装置允许将组件运送到固化炉并允许施加固化力。 模具具有接触垫，其特征在于非平面的非凸起状表面，其凹陷具有至少约各向异性导电粘合剂中导电颗粒直径的约七分之一的深度。

公开(公告)号：US5180523A

公开(公告)日：1993-01-19

申请号：US436199

申请日：1989-11-14

Applicant: David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Weiu

Inventor： David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Weiu

IPC: C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25

Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shrinkage of the polymeric carrier upon curing.

Abstract translation: 在高湿度条件下具有基本上稳定的导电性和电阻特性的导电水泥包括两种环氧树脂的混合物，其中每种环氧树脂的比例被调节以提供4至16％的混合物的体积收缩率和导电的银特殊填料 包括具有与电气部件引线保持稳定的电接触的尺寸和表面特性的附聚物。 环氧混合物优选为高收缩率环氧树脂和较低收缩率的环氧树脂的组合，以适当的量，以产生所需的体积收缩特性。 导电颗粒填料优选为银薄片，银粉和有效量的银附聚物的混合物。 附聚物是具有多个表面凹陷和凹陷的不规则形状的颗粒，以产生许多粗边缘的凸起，并且具有约1:1:1的颗粒长度，宽度和厚度纵横比。 当固化时聚合物载体的体积收缩结果确定粘合连接时，有效量的这种附聚物似乎会影响表面氧化物的渗透。

公开(公告)号：US5093038A

公开(公告)日：1992-03-03

申请号：US472190

申请日：1990-01-30

Applicant: David Durand

Inventor： David Durand

IPC: H05K3/28 ,  C09D11/00 ,  C09D11/10 ,  H01B1/22 ,  H01F41/16 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24 ,  H05K9/00

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

公开(公告)号：US4960614A

公开(公告)日：1990-10-02

申请号：US365712

申请日：1989-06-14

Applicant: David Durand

Inventor： David Durand

IPC: H05K3/28 ,  C09D11/00 ,  C09D11/10 ,  H01B1/22 ,  H01F41/16 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24 ,  H05K9/00

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source having an output in the region between 360 nm and 420 nm in a pulsing manner consisting of 5 to 8 one-half second exposure periods where each exposure period is followed by a non-exposure period of about 2 to 3 seconds.

Abstract translation: 制造电路板的方法包括： 可固化油墨以期望的电路图案在基材上，并通过将其暴露于脉冲的U.V. 源以360nm至420nm之间的区域输出，脉冲方式由5至8个半秒的曝光期组成，其中每个曝光周期之后是约2至3秒的非曝光周期。

公开(公告)号：US4863757A

公开(公告)日：1989-09-05

申请号：US011975

申请日：1987-02-06

Applicant: David Durand

Inventor： David Durand

IPC: H01B1/22 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24

CPC classification number: H05K3/1283 ,  H01B1/22 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104

Abstract: A method for producing a circuit board having conductive circuit elements patterened on a non-conductive substrate involves printing a film of a U.V. curable ink composed of a suspension of silver-coated magnetite particles in a U.V. curable resin onto the substrate in a circuit pattern, subjecting the pattern to a magnetic field to move the magnetite particles to a position at or near the upper surface of the resin and effecting U.V. radiation cure of the U.V. curable ink.

Abstract translation: 一种具有导电电路元件的电路板的制造方法，其特征在于，印刷非导电性基板的膜。 可固化油墨由银涂覆的磁铁矿颗粒悬浮液组成。 以电路图案在基板上固化，使图案经受磁场使磁铁矿颗粒移动到树脂的上表面或其附近的位置，并实现U.V。 紫外线辐射治疗 可固化油墨。

公开(公告)号：US4668239A

公开(公告)日：1987-05-26

申请号：US648390

申请日：1984-09-07

Applicant: David Durand

Inventor： David Durand

IPC: B41F16/00 ,  B41M1/30 ,  B41M5/035 ,  H01H9/18 ,  B32B5/16 ,  B32B27/36 ,  B44C1/16 ,  D06P1/16

CPC classification number: H01H9/18 ,  B41F16/00 ,  B41M5/0358 ,  Y10T428/24901

Abstract: A method of applying a dye image to a plastic member and the image bearing member thereby formed. A disperse dye having a melting point which is below the thermal deflection temperature of the plastic of the member and a vaporization point which is above said deflection temperature is applied to a surface of the member in a desired image. The dye bearing plastic is then heated to a temperature which is above the melting point of the dye and below the thermal deflection temperature of the plastic, but which is nevertheless high enough to cause some softening of said plastic. The dye is then permitted to diffuse into the plastic to provide a sharp, clear and durable image thereon.

Abstract translation: 将染料图像施加到由此形成的塑料构件和图像承载构件的方法。 熔点低于构件的塑料的热变形温度和高于所述挠曲温度的蒸发点的分散染料以期望的图像施加到构件的表面。 然后将染料轴承塑料加热至高于染料熔点并低于塑料的热变形温度的温度，但仍然高到足以引起所述塑料的一些软化。 然后允许染料扩散到塑料中，以在其上提供清晰，透明和持久的图像。