Abstract:
The present invention relates to a telecommunications termination panel with a housing including a front opening and a rear opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. A cable path is defined along a bottom of the housing along the first side between the cable entry of the tray and the rear opening. A movable plate is positioned adjacent the first side and is movable between a first position defining an upper limit of the cable path when the tray is closed and a second position allowing access to the cable path when the tray is open. The movement of the plate between the first and second positions is actuated by the movement of the tray between the closed and open positions. The present invention further relates to a telecommunications termination panel with a housing including a front opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. The tray is pivotable between an open position and a closed position. The tray includes a cover which can be moved between an operational position and an access position when the tray is in the open position. With the cover in the operational position, the tray is prevented from moving from the open position to the closed position.
Abstract:
An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.
Abstract:
The present invention relates to a telecommunications termination panel with a housing including a front opening and a rear opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. A cable path is defined along a bottom of the housing along the first side between the cable entry of the tray and the rear opening. A movable plate is positioned adjacent the first side and is movable between a first position defining an upper limit of the cable path when the tray is closed and a second position allowing access to the cable path when the tray is open. The movement of the plate between the first and second positions is actuated by the movement of the tray between the closed and open positions. The present invention further relates to a telecommunications termination panel with a housing including a front opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. The tray is pivotable between an open position and a closed position. The tray includes a cover which can be moved between an operational position and an access position when the tray is in the open position. With the cover in the operational position, the tray is prevented from moving from the open position to the closed position.
Abstract:
An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shringage of the polymeric carrier upon curing.
Abstract:
A shielded plastic enclosure for housing electronic equipment is provided, on at least one interior surface thereof, with a layer of shielding composition which is a suspension of silver-coated magnetite particles in a U.V. cured cycloaliphatic epoxy resin. The layer of this shielding composition has a thickness sufficient to effectively shield against electromagnetic interference, radio frequency interference and electrostatic discharge.
Abstract:
A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.
Abstract:
A marking device is disclosed wherein a pen-type device is utilized to store and enable markings to be produced from a dye suspended in a suspension medium such as water. The dye is of the heat sublimatible type and is finely ground and maintained in suspension by rolling action of a ball trapped within a reservoir defined by the pen body. A primary chamber is positioned adjacent the reservoir and a porous marking element is in turn frictionally and slidably positioned in the primary chamber. Valve means normally urged to a closed position enables ink to move from the reservoir into the primary chamber when the valve is caused to open, as by pressure against the marking element.
Abstract:
An implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion. In one example, the lead body may comprise a heat-formed bias portion. In another example, an outer insulator is fused to the lead body. In such an example, a lead body fusable plug may be disposed distal to at least one conductor. In another example, the lead comprises an inner boot and an outer boot fused to one another. In another example, the lead includes an atraumatic tip fused to the lead distal end portion. In another example, the lead body is reducable in size using heat shrink tubing. In yet another example, two or more lead sections may be interconnected using an outer insulator fused to the respective lead bodies. In a further example, a stiffener member is fused to the lead body adjacent a lead component.
Abstract:
A polymer lead-frame is made from a flexible substrate with flexible conductive traces. The generally square lead-frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.
Abstract:
A method for fabricating a shielded plastic enclosure for housing electronic equipment involves applying to at least one interior surface of the enclosure a layer of shielding composition which is a suspension of silver-coated magnetite particles in a U.V. curable resin. The thickness of this layer of shielding material is such that it effectively shields against electromagnetic interference, radio frequency interference and electrostatic discharge. Thereafter the shielding material is cured by exposure to a U.V. source.