公开(公告)号：US09411136B2

公开(公告)日：2016-08-09

申请号：US14066236

申请日：2013-10-29

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Charles Ian Daduya Ferraris

IPC: G02B13/00 ,  H04N5/225 ,  G02B3/00 ,  G02B7/08

CPC classification number: G02B13/0055 ,  G02B3/0037 ,  G02B7/08 ,  H04N5/2254

Abstract: An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame for covering the image sensing chip and a movable lens assembly movably disposed in the housing frame. The movable lens assembly includes a movable casing movably disposed in the housing frame, at least one optical lens group disposed in the movable casing, a microlens array substrate disposed in the movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.

Abstract translation: 图像捕获模块包括图像感测单元和光学辅助单元。 图像感测单元包括载体基板和设置在载体基板上并与载体基板电连接的图像感测芯片。 光学辅助单元包括用于覆盖图像感测芯片的壳体框架和可移动地设置在壳体框架中的可移动透镜组件。 可移动透镜组件包括可移动地设置在壳体框架中的可移动壳体，设置在可动壳体中的至少一个光学透镜组，设置在可动壳体中的微透镜阵列基板和设置在微透镜阵列基板上的非导电感光膜层， 增加光吸收能力。

公开(公告)号：US20160044213A1

公开(公告)日：2016-02-11

申请号：US14452635

申请日：2014-08-06

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Ching-Lung JAO ,  Chiang-Yuan CHUANG ,  Yu-Te CHOU

IPC: H04N5/225 ,  H05K3/32 ,  G03B13/36

CPC classification number: H04N5/2252 ,  G03B13/36 ,  G03B43/00 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2254 ,  H04N5/2257 ,  H05K3/32 ,  H01L2924/00014

Abstract: An image capturing module for saving focusing time and increasing assembly flatness and a method of assembling the same are disclosed. The image sensing chip has a first horizontal top surface, the optical filter has a second horizontal top surface, and the first horizontal top surface and second horizontal top surface are obtained by a horizontal correction system using a laser light source. The distance from the second horizontal top surface to the first horizontal top surface is defined as a predetermined fixed focusing distance. Whereby, the movable lens assembly is directly disposed on the second horizontal top surface to save the focusing time of the movable lens assembly relative to the image sensing chip, and the first horizontal top surface and the second horizontal top surface are horizontal to each other for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.

Abstract translation: 公开了一种用于节省聚焦时间和增加组装平面度的图像捕获模块及其组装方法。 图像感测芯片具有第一水平顶表面，滤光器具有第二水平顶表面，并且通过使用激光光源的水平校正系统获得第一水平顶表面和第二水平顶表面。 从第二水平顶表面到第一水平顶表面的距离被定义为预定的固定聚焦距离。 由此，可移动透镜组件直接设置在第二水平顶部表面上，以节省可移动透镜组件相对于图像感测芯片的聚焦时间，并且第一水平顶部表面和第二水平顶部表面彼此是水平的 增加可移动透镜组件相对于图像感测芯片的组装平面度。

公开(公告)号：US20160014307A1

公开(公告)日：2016-01-14

申请号：US14330334

申请日：2014-07-14

Applicant: Larview Technologies Corp.

Inventor： KUO-HAO PENG ,  PO-CHIH HSU

IPC: H04N5/225 ,  H04N3/06 ,  G03B13/34

CPC classification number: H04N5/2252 ,  G03B17/02 ,  G03B17/12 ,  H04N5/2254

Abstract: An image capturing module having a built-in flexible dustproof structure includes an image sensing unit, a housing frame, an actuator structure and a flexible ring. The image sensing unit includes a carrier substrate and an image sensing chip. The housing frame is disposed on the carrier substrate to surround the image sensing chip. The actuator structure is disposed on the housing frame. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. The flexible ring is disposed around an outer perimeter surface of the movable lens assembly and abutted against an inner surrounding surface of the lens holder. Whereby, the flexible ring is surroundingly disposed between the inner surrounding surface of the lens holder and the outer perimeter surface of the movable lens assembly to form the built-in flexible dustproof structure.

Abstract translation: 具有内置的柔性防尘结构的图像捕获模块包括图像感测单元，壳体框架，致动器结构和柔性环。 图像感测单元包括载体基板和图像感测芯片。 壳体框架设置在载体基板上以围绕图像感测芯片。 致动器结构设置在壳体框架上。 致动器结构包括设置在壳体框架上的透镜保持器和可移动地设置在透镜保持器内部的可移动透镜组件。 柔性环设置在可移动透镜组件的外周表面周围并抵靠透镜保持器的内周围表面。 由此，柔性环周围设置在透镜保持架的内周面和可动透镜组件的外周面之间，形成内置的柔性防尘结构。

公开(公告)号：US09161449B2

公开(公告)日：2015-10-13

申请号：US14066163

申请日：2013-10-29

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Shin-Dar Jan

IPC: H01L31/0232 ,  H01L31/0203 ,  H05K1/18

CPC classification number: H05K1/18 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10575 ,  Y02P70/611

Abstract: An image sensor module is provided. The image sensor module includes a circuit board, a flat material, an image sensing chip, a holder and a covering plate. The flat material disposed on an assembling surface of the circuit board has a supporting surface and a bottom surface opposite thereto. The image sensing chip with its base surface facing to the supporting surface is configured on the supporting surface. The holder is disposed on the flat material, and the bottom plane of the holder faces to the supporting surface. The supporting surface is used to make the base surface parallel to the bottom plane. The covering plate is arranged on the holder to seal the image sensing chip.

Abstract translation: 提供图像传感器模块。 图像传感器模块包括电路板，扁平材料，图像感测芯片，保持器和覆盖板。 设置在电路板的组装表面上的扁平材料具有支撑表面和与其相对的底表面。 其基面朝向支撑表面的图像感测芯片被配置在支撑表面上。 保持器设置在平坦材料上，并且保持器的底面面向支撑表面。 支撑面用于使底面平行于底面。 覆盖板布置在保持器上以密封图像感测芯片。

公开(公告)号：US20150116588A1

公开(公告)日：2015-04-30

申请号：US14063680

申请日：2013-10-25

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： CHARLES IAN DADUYA FERRARIS

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  G02B7/08 ,  G03B3/10 ,  G03B5/00 ,  H04N5/2257

Abstract: An image capturing module includes an image sensing unit and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate. The actuator structure includes a first actuator unit and a second actuator unit. The first actuator unit includes a first housing frame and a first movable assembly movably disposed inside the first housing frame and above the image sensing unit. The second actuator unit includes a second housing frame and a second movable assembly movably disposed inside the second housing frame and above the image sensing unit, and the second movable assembly includes a second movable casing movably disposed in the second housing frame, a microlens array substrate disposed in the second movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.

Abstract translation: 图像捕获模块包括图像感测单元和致动器结构。 图像感测单元包括载体基板和设置在载体基板上的图像感测芯片。 致动器结构包括第一致动器单元和第二致动器单元。 第一致动器单元包括第一壳体框架和可移动地设置在第一壳体框架内部和图像感测单元上方的第一可移动组件。 第二致动器单元包括第二壳体框架和可移动地设置在第二壳体框架内部和图像感测单元上方的第二可移动组件，并且第二可移动组件包括可移动地设置在第二壳体框架中的第二可移动壳体，微透镜阵列基板 设置在第二可移动壳体中，以及设置在微透镜阵列基板上的用于增加光吸收能力的非导电感光膜层。

公开(公告)号：US09432558B2

公开(公告)日：2016-08-30

申请号：US14333295

申请日：2014-07-16

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Kuo-Hao Peng ,  Po-Chih Hsu

IPC: H04N5/225 ,  H04N5/217

CPC classification number: H04N5/2252 ,  H04N5/2171 ,  H04N5/2253 ,  H04N5/2257

Abstract: An image capturing module having a built-in dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a substrate and an image sensing chip disposed on the substrate. The housing frame is disposed on the substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. More precisely, the lens holder has a first surrounding structure disposed on the inner surrounding surface thereof, and the movable lens assembly has a second surrounding structure disposed on the outer perimeter surface thereof and located above the first surrounding structure, and the first surrounding structure of the lens holder and the second surrounding structure of the movable lens assembly are mated with each other to form the built-in dustproof structure.

Abstract translation: 具有内置防尘结构的图像捕获模块包括图像感测单元，壳体框架和致动器结构。 图像感测单元包括基板和设置在基板上的图像感测芯片。 壳体框架设置在基板上以围绕图像感测芯片。 致动器结构包括设置在壳体框架上的透镜保持器和可移动地设置在透镜保持器内部的可移动透镜组件。 更准确地说，透镜架具有设置在其内周面上的第一周围结构，并且可移动透镜组件具有设置在其外周表面上并位于第一周围结构上方的第二周围结构，并且第一周围结构 可移动透镜组件的透镜保持器和第二周围结构彼此配合以形成内置的防尘结构。

公开(公告)号：US20160021282A1

公开(公告)日：2016-01-21

申请号：US14333295

申请日：2014-07-16

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： KUO-HAO PENG ,  PO-CHIH HSU

IPC: H04N5/225

CPC classification number: H04N5/2252 ,  H04N5/2171 ,  H04N5/2253 ,  H04N5/2257

Abstract: An image capturing module having a built-in dustproof structure includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a substrate and an image sensing chip disposed on the substrate. The housing frame is disposed on the substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. More precisely, the lens holder has a first surrounding structure disposed on the inner surrounding surface thereof, and the movable lens assembly has a second surrounding structure disposed on the outer perimeter surface thereof and located above the first surrounding structure, and the first surrounding structure of the lens holder and the second surrounding structure of the movable lens assembly are mated with each other to form the built-in dustproof structure.

Abstract translation: 具有内置防尘结构的图像捕获模块包括图像感测单元，壳体框架和致动器结构。 图像感测单元包括基板和设置在基板上的图像感测芯片。 壳体框架设置在基板上以围绕图像感测芯片。 致动器结构包括设置在壳体框架上的透镜保持器和可移动地设置在透镜保持器内部的可移动透镜组件。 更准确地说，透镜架具有设置在其内周面上的第一周围结构，并且可移动透镜组件具有设置在其外周表面上并位于第一周围结构上方的第二周围结构，并且第一周围结构 可移动透镜组件的透镜保持器和第二周围结构彼此配合以形成内置的防尘结构。

公开(公告)号：US20160006964A1

公开(公告)日：2016-01-07

申请号：US14324296

申请日：2014-07-07

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： CHING-LUNG JAO ,  CHIANG-YUAN CHUANG ,  YU-TE CHOU

IPC: H04N5/374 ,  H04N5/225 ,  G03B13/34

CPC classification number: H04N5/374 ,  G03B13/32 ,  G03B13/34 ,  G03B17/12 ,  G03B43/00 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254

Abstract: An image capturing module includes an image sensing unit, a housing frame, an actuator structure and a reflecting material. The image sensing unit includes a carrier substrate and an image sensing chip, and the image sensing chip has a first horizontal top surface on the top side thereof. The housing frame is disposed on the carrier substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. The reflecting material is movably and temporarily placed on the movable lens assembly, and the reflecting material has a second horizontal top surface on the top side thereof. The first horizontal top surface and the second horizontal top surface are horizontal to each other, for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.

Abstract translation: 图像捕获模块包括图像感测单元，壳体框架，致动器结构和反射材料。 图像感测单元包括载体基板和图像感测芯片，并且图像感测芯片在其顶侧具有第一水平顶表面。 壳体框架设置在载体基板上以围绕图像感测芯片。 致动器结构包括设置在壳体框架上的透镜保持器和可移动地设置在透镜保持器内部的可移动透镜组件。 反射材料可移动地临时地放置在可移动透镜组件上，并且反射材料在其顶侧具有第二水平顶表面。 第一水平顶表面和第二水平顶表面彼此水平，用于增加可移动透镜组件相对于图像感测芯片的组装平面度。

公开(公告)号：US20160006963A1

公开(公告)日：2016-01-07

申请号：US14324279

申请日：2014-07-07

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： CHING LUNG JAO ,  CHIANG YUAN CHUANG ,  YU TE CHOU

IPC: H04N5/374 ,  H04N5/225 ,  G03B13/36

CPC classification number: H04N5/374 ,  G03B13/32 ,  G03B13/36 ,  G03B17/12 ,  G03B43/00 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254

Abstract: An image capturing module includes an image sensing unit, a housing frame, an actuator structure and a reflecting material. The image sensing unit includes an image sensing chip having a first horizontal top surface. The reflecting material is temporarily placed on the movable lens assembly of the actuator structure. The reflecting material has a second horizontal top surface. The distance from the laser light source to the first horizontal top surface is defined as a first horizontal distance, the distance from the laser light source to the second horizontal top surface is defined as a second horizontal distance, and a predetermined fixed focusing distance from the second horizontal top surface to the first horizontal top surface is obtained by subtracting the second horizontal distance from the first horizontal distance, for shortening the focusing time of the movable lens assembly relative to the image sensing chip.

Abstract translation: 图像捕获模块包括图像感测单元，壳体框架，致动器结构和反射材料。 图像感测单元包括具有第一水平顶表面的图像感测芯片。 反射材料暂时放置在致动器结构的可移动透镜组件上。 反射材料具有第二水平顶面。 从激光光源到第一水平顶面的距离被定义为第一水平距离，从激光光源到第二水平顶表面的距离被定义为第二水平距离，并且预定的固定聚焦距离 通过从第一水平距离减去第二水平距离获得第一水平顶表面的第二水平顶表面，以缩短可移动透镜组件相对于图像感测芯片的聚焦时间。

公开(公告)号：US09154675B2

公开(公告)日：2015-10-06

申请号：US14065390

申请日：2013-10-28

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Shin-Dar Jan

IPC: H04N5/225

CPC classification number: H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212 ,  H04N5/23245

Abstract: An image capturing module for reducing assembly tilt angle includes an image sensing unit, an optical auxiliary unit and a leveling auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame disposed on the carrier substrate to cover the image sensing chip and a lens assembly disposed inside the housing frame and above the image sensing chip. The leveling auxiliary unit includes a plurality of adhesive materials disposed on the image sensing chip and a light-transmitting leveling substrate supported above the image sensing chip by the adhesive materials. The housing frame directly contacts and downwardly abuts against the light-transmitting leveling substrate, and each adhesive material is formed by mixing adhesive glue and a plurality of micro support bodies.

Abstract translation: 一种用于减小组装倾斜角度的图像捕获模块包括图像感测单元，光学辅助单元和调平辅助单元。 图像感测单元包括载体基板和设置在载体基板上并与载体基板电连接的图像感测芯片。 光学辅助单元包括设置在载体基板上以覆盖图像感测芯片的壳体框架和设置在壳体框架内部和图像感测芯片上方的透镜组件。 调平辅助单元包括设置在图像感测芯片上的多个粘合材料和通过粘合材料支撑在图像感测芯片上方的透光调平基板。 壳体框架直接接触并向下抵靠光透射调平基板，并且每个粘合材料通过混合胶粘剂和多个微支撑体而形成。