公开(公告)号：WO2005123867A2

公开(公告)日：2005-12-29

申请号：PCT/US2005021116

申请日：2005-06-15

Applicant: SIEMENS WESTINGHOUSE POWER ,  SMITH JAMES DAVID BLACKHALL ,  STEVENS GARY ,  WOOD JOHN WILLIAM

Inventor： SMITH JAMES DAVID BLACKHALL ,  STEVENS GARY ,  WOOD JOHN WILLIAM

IPC: B32B27/04 ,  B32B27/12 ,  C08K3/14 ,  C08K3/22 ,  C09K5/00

CPC classification number: C08J5/10 ,  C08K3/14 ,  C08K3/22 ,  C08K2201/016 ,  D21H27/00 ,  Y10T442/20 ,  Y10T442/2992 ,  Y10T442/50

Abstract: In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 and a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the high thermal conductivity fillers are from 1-1000 nm in length and have an aspect ratio of between 3-100.

Abstract translation: 在一个实施方案中，本发明提供了一种高导热性树脂，其包含主体树脂基质32和高导热性填料30.高导热性填料与主体树脂基体形成连续的有机 - 无机复合物，并且高热 导电填料的长度为1-1000nm，纵横比在3-100之间。

公开(公告)号：WO1996021054A1

公开(公告)日：1996-07-11

申请号：PCT/GB1996000007

申请日：1996-01-03

Applicant: ONTARIO HYDRO ,  STEVENS, Gary, Don ,  PADOVANI, Francois, A.

Inventor： ONTARIO HYDRO

IPC: C30B29/06

CPC classification number: C30B29/06 ,  C30B13/00 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S117/90 ,  Y10T117/102

Abstract: A method and apparatus for forming semiconductor particles (42) for solar cells using an optical furnace (30). Uniform mass piles (26) of powered semiconductor feedstock are almost instantaneously optically fused to define high purity semiconductor particles without oxidation. The high intensity optical energy is directed and focused to the semiconductor feedstock piles (26) advanced by a conveyer medium (16) thereunder. The semiconductor feedstock piles (26) are at least partially melted and fused to form a single semiconductor particle (42) which can be later separated from a refractory layer (18) by a separator (50), preferably comprised of silica. The apparatus (10) and process is automated, providing a high throughput to produce uniform mass, high quality spheres for realizing high efficiency solar cells. The apparatus is energy efficient, whereby process parameters can be easily and quickly established.

Abstract translation: 一种用于使用光学炉（30）形成用于太阳能电池的半导体颗粒（42）的方法和装置。 动力半导体原料的均匀质量堆（26）几乎被瞬时光学融合，以限定高纯度半导体颗粒而没有氧化。 高强度光能被引导并聚焦到由其下的传送介质（16）前进的半导体原料桩（26）。 半导体原料桩（26）至少部分地熔化并熔化以形成单个半导体颗粒（42），其可以稍后通过隔板（50）从耐火层（18）分离，优选由二氧化硅组成。 设备（10）和工艺是自动化的，提供高产量以产生用于实现高效率太阳能电池的均匀质量，高质量的球体。 该装置是高能效的，由此可以容易且快速地建立工艺参数。

公开(公告)号：WO2008039279A1

公开(公告)日：2008-04-03

申请号：PCT/US2007/018280

申请日：2007-08-17

Applicant: SIEMENS POWER GENERATION, INC. ,  STEVENS, Gary ,  SMITH, James, D., B. ,  WOOD, John, W.

Inventor： STEVENS, Gary ,  SMITH, James, D., B. ,  WOOD, John, W.

IPC: C08K3/28 ,  C08K3/22 ,  C08K3/38

CPC classification number: C09K5/14 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/249959 ,  Y10T428/252 ,  Y10T428/26 ,  Y10T428/2916

Abstract: A high thermal conductivity resin that has a host resin matrix, and a high thermal conductivity filler. The high thermal conductivity filler (30) forms a continuous organic-inorganic composite with the host resin matrix. The fillers are from 1-1000 nm in length, and have average aspect ratios of between 3-100. At least a portion of the high thermal conductivity fillers comprise morphologies (31) chosen from one or more of hexagonal, cubic, orthorhombic, rhombohedral, tetragonal, whiskers and tubes. In particular, some of the fillers will aggregate into secondary structures.

Abstract translation: 具有主体树脂基体和高导热性填料的高导热性树脂。 高导热性填料（30）与主体树脂基体形成连续的有机 - 无机复合材料。 填料的长度为1-1000nm，平均纵横比在3-100之间。 高导热性填料的至少一部分包含选自六方晶系，立方晶型，正交型，菱方晶型，四方晶系，晶须和管中的一种或多种的形态（31）。 特别地，一些填料将聚集成二级结构。

公开(公告)号：WO2008013570A2

公开(公告)日：2008-01-31

申请号：PCT/US2007/000086

申请日：2007-01-03

Applicant: SIEMENS POWER GENERATION, INC. ,  SMITH, James, D., B. ,  STEVENS, Gary ,  WOOD, John, W.

Inventor： SMITH, James, D., B. ,  STEVENS, Gary ,  WOOD, John, W.

IPC: D21H13/44 ,  D21H17/67 ,  D21H19/68 ,  B32B29/06 ,  B32B29/02 ,  H01B3/52

CPC classification number: B32B29/02 ,  B32B29/06 ,  B32B2255/12 ,  B32B2255/24 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/54 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2554/00 ,  B32B2581/00 ,  D21H13/44 ,  D21H17/67 ,  D21H17/69 ,  D21H19/64 ,  D21H21/54 ,  Y10T428/24793 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T442/2418 ,  Y10T442/2426 ,  Y10T442/2475 ,  Y10T442/2992

Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.

Abstract translation: 本发明提供了一种高导热性纸，其包括主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热性材料由纳米填料，直接位于主体基质上的金刚石类涂层和纳米填料上的金刚石类涂层组成。 在具体实施方案中，具体图案包括网格，边缘，条带定心及其组合中的一种或多种，​​并且高导热性材料覆盖主体基质表面的15-55％。 多个表面，包括我有图案的子层。

公开(公告)号：WO2007114876A1

公开(公告)日：2007-10-11

申请号：PCT/US2007/000126

申请日：2007-01-03

Applicant: SIEMENS POWER GENERATION, INC. ,  SMITH, James, D., B. ,  STEVENS, Gary ,  WOOD, James, W.

Inventor： SMITH, James, D., B. ,  STEVENS, Gary ,  WOOD, James, W.

IPC: B32B27/20 ,  B32B29/02 ,  H01B3/00

CPC classification number: B32B29/02 ,  B32B5/16 ,  B32B5/24 ,  B32B5/30 ,  B32B27/20 ,  B32B2255/04 ,  B32B2255/24 ,  B32B2260/021 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2581/00 ,  B32B2605/00 ,  H01B3/004

Abstract: In one embodiment of the present invention as used for impregnating a composite tape (56) with HTC particles provides for permeating a fabric layer (51) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape through the fabric layer (51). At least 5% of the HTC particles permeated into the fabric layer are carried out of the fabric layer and into a mica layer (52) bound to the fabric layer by the impregnating resin. In some embodiments the impregnating resin itself contains HTC particles.

Abstract translation: 在本发明的一个实施方案中，用于浸渍具有HTC颗粒的复合带（56）提供用HTC颗粒渗透复合带的织物层（51）并通过织物层将浸渍树脂浸渍到复合带中 51）。 渗透到织物层中的至少5％的HTC颗粒由织物层进行并通过浸渍树脂进入与织物层结合的云母层（52）中。 在一些实施方案中，浸渍树脂本身含有HTC颗粒。

公开(公告)号：WO2005123825A3

公开(公告)日：2006-05-04

申请号：PCT/US2005021115

申请日：2005-06-15

Applicant: SIEMENS POWER GENERATION INC ,  SMITH JAMES DAVID BLACKHALL ,  STEVENS GARY ,  WOOD JOHN WILLIAM

Inventor： SMITH JAMES DAVID BLACKHALL ,  STEVENS GARY ,  WOOD JOHN WILLIAM

IPC: C08L101/00 ,  C08K3/00 ,  C08K3/14 ,  C08K3/22 ,  C08K3/28 ,  C08K7/00 ,  C08K9/04 ,  C08L63/00 ,  H01B3/00

CPC classification number: C08J5/10 ,  C08J5/24 ,  C08K3/14 ,  C08K3/18 ,  C08K3/22 ,  C08K3/28 ,  C08K9/04 ,  C08K2201/016 ,  D21H17/33 ,  D21H17/67 ,  Y10T428/24994 ,  Y10T428/31511 ,  C08L63/00

Abstract: In one embodiment the present invention provides for high thermal conductivity materials (30) that have surface functional groups grafted thereto. These grafted surface functional groups then form a continuous bond with a host resin matrix (32) that the high thermal conductivity materials (30) are added to.

Abstract translation: 在一个实施方案中，本发明提供具有接枝到其上的表面官能团的高导热性材料（30）。 这些接枝的表面官能团随后与主要树脂基体（32）形成连续的结合，该主体树脂基质（32）被加入到高导热性材料（30）中。

公开(公告)号：WO2005123825A2

公开(公告)日：2005-12-29

申请号：PCT/US2005/021115

申请日：2005-06-15

Applicant: SIEMENS POWER GENERATION, INC. ,  SMITH, James David Blackhall ,  STEVENS, Gary ,  WOOD, John William

Inventor： SMITH, James David Blackhall ,  STEVENS, Gary ,  WOOD, John William

IPC: C08K9/04

CPC classification number: C08J5/10 ,  C08J5/24 ,  C08K3/14 ,  C08K3/18 ,  C08K3/22 ,  C08K3/28 ,  C08K9/04 ,  C08K2201/016 ,  D21H17/33 ,  D21H17/67 ,  Y10T428/24994 ,  Y10T428/31511 ,  C08L63/00

Abstract: In one embodiment the present invention provides for high thermal conductivity materials (30) that have surface functional groups grafted thereto. These grafted surface functional groups then form a continuous bond with a host resin matrix (32) that the high thermal conductivity materials (30) are added to.

Abstract translation: 在一个实施方案中，本发明提供具有接枝到其上的表面官能团的高导热性材料（30）。 这些接枝的表面官能团随后与主要树脂基体（32）形成连续的结合，该主体树脂基体（32）加入高导热性材料（30）。

公开(公告)号：WO2006002010A3

公开(公告)日：2006-02-09

申请号：PCT/US2005020556

申请日：2005-06-13

Applicant: SIEMENS POWER GENERATION INC ,  SMITH JAMES D B ,  STEVENS GARY ,  WOOD JOHN W

Inventor： SMITH JAMES D B ,  STEVENS GARY ,  WOOD JOHN W

IPC: B32B1/00 ,  H01B17/00 ,  H01F27/22 ,  H01F27/32 ,  H02K3/30 ,  H02K3/34 ,  H02K9/22 ,  H01B3/00 ,  H01B19/04 ,  H01F5/06 ,  H01F41/12

CPC classification number: H02K3/30 ,  H01F27/22 ,  H01F27/323 ,  H02K3/34 ,  H02K9/22 ,  Y10T428/265

Abstract: In one embodiment the present invention improves the heat flow from an electrically insulated object 13 by providing an enhanced conduit at the interface between the layers of insulating tape 16. The tape 16 has been surface coated with a high thermal conductivity (HTC) material, so that the interface between the layers of tape 23 provides a pathway for the heat to reach the environment 24. The radiation of heat through the tape layers is also increased by the surface coatings

Abstract translation: 在一个实施例中，本发明通过在绝缘带16之间的界面处提供增强的导管来改善来自电绝缘物体13的热流。带16已经被表面涂覆有高导热性（HTC）材料，因此 胶带层23之间的界面提供了一种使热量达到环境24的途径。通过胶带层的热辐射也通过表面涂层

公开(公告)号：WO2005123867A3

公开(公告)日：2005-12-29

申请号：PCT/US2005/021116

申请日：2005-06-15

Applicant: SIEMENS POWER GENERATION, INC. ,  SMITH, James David Blackhall ,  STEVENS, Gary ,  WOOD, John William

Inventor： SMITH, James David Blackhall ,  STEVENS, Gary ,  WOOD, John William

IPC: H01B3/00 ,  C08L101/00 ,  C08K3/00 ,  C08K7/00

Abstract: In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 and a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the high thermal conductivity fillers are from 1-1000 nm in length and have an aspect ratio of between 3-100.

公开(公告)号：WO2012044523A1

公开(公告)日：2012-04-05

申请号：PCT/US2011/052921

申请日：2011-09-23

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  SUTTON, Simon ,  GEUSSENS, Theo ,  VAUGHAN, Alan, S. ,  STEVENS, Gary ,  DOW CHEMICAL COMPANY LTD ,  UNIVERSITY OF SOUTHAMPTON ,  GNOSYS UK LTD

Inventor： SUTTON, Simon ,  GEUSSENS, Theo ,  VAUGHAN, Alan, S. ,  STEVENS, Gary

IPC: C08L23/06 ,  C09D123/06

CPC classification number: C09D123/06 ,  C08L23/06 ,  C08L2205/02 ,  H01B3/307 ,  C08L2666/06

Abstract: The disclosure provides a process for producing a material with improved breakdown strength. The process includes heating a polymeric composition composed of a low density polyethylene (LDPE) and a minority amount of a high density polyethylene (HDPE). The polymeric composition is heated to at least the melting temperature of the HDPE. The process includes control-cooling the heated polymeric composition at a cooling rate from 0.1 °C/min to 20°C/min, and forming a polymeric composition. The control-cooled polymeric composition has a unique morphology which improves breakdown strength. Also provided is a coated conductor with an insulating layer composed of the polymeric composition with the unique morphology. The insulating layer exhibits improved breakdown strength.

Abstract translation: 本公开提供了制备具有改进的击穿强度的材料的方法。 该方法包括加热由低密度聚乙烯（LDPE）和少量高密度聚乙烯（HDPE）组成的聚合物组合物。 将聚合物组合物加热至至少HDPE的熔融温度。 该方法包括以0.1℃/ min至20℃/ min的冷却速度控制冷却加热的聚合物组合物，并形成聚合物组合物。 对照冷却的聚合物组合物具有独特的形态，其改善击穿强度。 还提供了具有由具有独特形态的聚合物组合物构成的绝缘层的涂覆导体。 绝缘层表现出改善的击穿强度。