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公开(公告)号：WO2006002010A3
公开(公告)日：2006-02-09
申请号：PCT/US2005020556
申请日：2005-06-13
Applicant: SIEMENS POWER GENERATION INC , SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
Inventor： SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
IPC: B32B1/00 , H01B17/00 , H01F27/22 , H01F27/32 , H02K3/30 , H02K3/34 , H02K9/22 , H01B3/00 , H01B19/04 , H01F5/06 , H01F41/12
CPC classification number: H02K3/30 , H01F27/22 , H01F27/323 , H02K3/34 , H02K9/22 , Y10T428/265
Abstract: In one embodiment the present invention improves the heat flow from an electrically insulated object 13 by providing an enhanced conduit at the interface between the layers of insulating tape 16. The tape 16 has been surface coated with a high thermal conductivity (HTC) material, so that the interface between the layers of tape 23 provides a pathway for the heat to reach the environment 24. The radiation of heat through the tape layers is also increased by the surface coatings
Abstract translation: 在一个实施例中，本发明通过在绝缘带16之间的界面处提供增强的导管来改善来自电绝缘物体13的热流。带16已经被表面涂覆有高导热性（HTC）材料，因此 胶带层23之间的界面提供了一种使热量达到环境24的途径。通过胶带层的热辐射也通过表面涂层
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2.发明申请NANO AND MESO SHELL-CORE CONTROL OF PHYSICAL PROPERTIES AND PERFORMANCE OF ELECTRICALLY INSULATING COMPOSITES 审中-公开电绝缘复合材料的物理性能和性能的纳米和外壳外壳控制
公开(公告)号：WO2008042076A2
公开(公告)日：2008-04-10
申请号：PCT/US2007019502
申请日：2007-09-06
Applicant: SIEMENS POWER GENERATION INC , STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
Inventor： STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
CPC classification number: H05K1/0373 , H05K2201/0209 , H05K2201/0224 , H05K2201/0248 , Y10T428/25 , Y10T428/251 , Y10T428/254 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/31511 , Y10T428/31993
Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1 -100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
Abstract translation: 由主体树脂基体（42）和高导热性填料（30）组成的高导热性树脂，其在主体树脂内混合以形成树脂混合物。 所述填料占所述树脂混合物的至少3-5重量％，并且所述填料在至少一个维度上平均为1-100nm，并且其中所述颗粒的平均粒径小于1000nm， 最长的尺寸。 主树脂基质在高热导率填料（30）周围形成有序树脂壳（40），由此树脂分子垂直于高热导率填料表面排列。 在高热导率填料之间形成有序树脂壳（44）的重叠，使得通过树脂混合物形成有序树脂壳的连续路径。
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公开(公告)号：WO2008039279A1
公开(公告)日：2008-04-03
申请号：PCT/US2007/018280
申请日：2007-08-17
Applicant: SIEMENS POWER GENERATION, INC. , STEVENS, Gary , SMITH, James, D., B. , WOOD, John, W.
Inventor： STEVENS, Gary , SMITH, James, D., B. , WOOD, John, W.
CPC classification number: C09K5/14 , H01F27/2871 , H01F41/127 , H01L21/316 , H02K3/40 , H02K9/22 , H05K1/0373 , H05K2201/0209 , H05K2201/0248 , Y10T428/249959 , Y10T428/252 , Y10T428/26 , Y10T428/2916
Abstract: A high thermal conductivity resin that has a host resin matrix, and a high thermal conductivity filler. The high thermal conductivity filler (30) forms a continuous organic-inorganic composite with the host resin matrix. The fillers are from 1-1000 nm in length, and have average aspect ratios of between 3-100. At least a portion of the high thermal conductivity fillers comprise morphologies (31) chosen from one or more of hexagonal, cubic, orthorhombic, rhombohedral, tetragonal, whiskers and tubes. In particular, some of the fillers will aggregate into secondary structures.
Abstract translation: 具有主体树脂基体和高导热性填料的高导热性树脂。 高导热性填料（30）与主体树脂基体形成连续的有机 - 无机复合材料。 填料的长度为1-1000nm，平均纵横比在3-100之间。 高导热性填料的至少一部分包含选自六方晶系，立方晶型，正交型，菱方晶型，四方晶系，晶须和管中的一种或多种的形态（31）。 特别地，一些填料将聚集成二级结构。
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公开(公告)号：WO2008013570A2
公开(公告)日：2008-01-31
申请号：PCT/US2007/000086
申请日：2007-01-03
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James, D., B. , STEVENS, Gary , WOOD, John, W.
Inventor： SMITH, James, D., B. , STEVENS, Gary , WOOD, John, W.
CPC classification number: B32B29/02 , B32B29/06 , B32B2255/12 , B32B2255/24 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2264/104 , B32B2264/108 , B32B2307/206 , B32B2307/302 , B32B2307/54 , B32B2405/00 , B32B2457/00 , B32B2554/00 , B32B2581/00 , D21H13/44 , D21H17/67 , D21H17/69 , D21H19/64 , D21H21/54 , Y10T428/24793 , Y10T428/24851 , Y10T428/24893 , Y10T442/2418 , Y10T442/2426 , Y10T442/2475 , Y10T442/2992
Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
Abstract translation: 本发明提供了一种高导热性纸，其包括主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热性材料由纳米填料，直接位于主体基质上的金刚石类涂层和纳米填料上的金刚石类涂层组成。 在具体实施方案中，具体图案包括网格，边缘，条带定心及其组合中的一种或多种，并且高导热性材料覆盖主体基质表面的15-55％。 多个表面，包括我有图案的子层。
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5.发明申请
公开(公告)号：WO2007114876A1
公开(公告)日：2007-10-11
申请号：PCT/US2007/000126
申请日：2007-01-03
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James, D., B. , STEVENS, Gary , WOOD, James, W.
Inventor： SMITH, James, D., B. , STEVENS, Gary , WOOD, James, W.
CPC classification number: B32B29/02 , B32B5/16 , B32B5/24 , B32B5/30 , B32B27/20 , B32B2255/04 , B32B2255/24 , B32B2260/021 , B32B2260/025 , B32B2260/046 , B32B2264/102 , B32B2264/104 , B32B2264/108 , B32B2307/206 , B32B2307/302 , B32B2405/00 , B32B2457/00 , B32B2581/00 , B32B2605/00 , H01B3/004
Abstract: In one embodiment of the present invention as used for impregnating a composite tape (56) with HTC particles provides for permeating a fabric layer (51) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape through the fabric layer (51). At least 5% of the HTC particles permeated into the fabric layer are carried out of the fabric layer and into a mica layer (52) bound to the fabric layer by the impregnating resin. In some embodiments the impregnating resin itself contains HTC particles.
Abstract translation: 在本发明的一个实施方案中，用于浸渍具有HTC颗粒的复合带（56）提供用HTC颗粒渗透复合带的织物层（51）并通过织物层将浸渍树脂浸渍到复合带中 51）。 渗透到织物层中的至少5％的HTC颗粒由织物层进行并通过浸渍树脂进入与织物层结合的云母层（52）中。 在一些实施方案中，浸渍树脂本身含有HTC颗粒。
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Patent Agency Ranking6.发明申请
公开(公告)号：WO2008042076A3
公开(公告)日：2008-04-10
申请号：PCT/US2007/019502
申请日：2007-09-06
Applicant: SIEMENS POWER GENERATION, INC. , STEVENS, Gary , SMITH, James, D., B. , WOOD, John, W.
Inventor： STEVENS, Gary , SMITH, James, D., B. , WOOD, John, W.
Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1 -100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
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公开(公告)号：WO2008091494A3
公开(公告)日：2008-10-09
申请号：PCT/US2008000309
申请日：2008-01-09
Applicant: SIEMENS POWER GENERATION INC , STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
Inventor： STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
IPC: D21H17/13 , D21H17/62 , H01L21/316 , H02K3/40 , H05K1/03
CPC classification number: H01L21/316 , D21H13/44 , D21H17/13 , D21H17/20 , D21H25/005 , D21H27/00 , H01F27/2871 , H01F41/127 , H02K3/40 , H02K9/22 , H05K1/0373 , H05K2201/0209 , H05K2201/0248 , Y10T428/249953
Abstract: A method for the treatment of micro pores (24) within a mica paper (20) that includes obtaining a silane with a molecular weight of between approximately 15 and 300, and adding the silane to the mica paper (20). Then reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores (24) with the mica paper through the silane.
Abstract translation: 一种处理云母纸（20）内的微孔（24）的方法，该方法包括获得分子量约为15-300的硅烷，并将该硅烷添加到云母纸（20）中。 然后使硅烷与云母纸内微孔的内表面反应。 之后，将树脂浸渍到云母纸中，并且树脂通过硅烷与云母纸结合到微孔（24）的内表面。
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公开(公告)号：WO2008013570A3
公开(公告)日：2008-04-03
申请号：PCT/US2007000086
申请日：2007-01-03
Applicant: SIEMENS POWER GENERATION INC , SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
Inventor： SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
CPC classification number: B32B29/02 , B32B29/06 , B32B2255/12 , B32B2255/24 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2264/104 , B32B2264/108 , B32B2307/206 , B32B2307/302 , B32B2307/54 , B32B2405/00 , B32B2457/00 , B32B2554/00 , B32B2581/00 , D21H13/44 , D21H17/67 , D21H17/69 , D21H19/64 , D21H21/54 , Y10T428/24793 , Y10T428/24851 , Y10T428/24893 , Y10T442/2418 , Y10T442/2426 , Y10T442/2475 , Y10T442/2992
Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
Abstract translation: 本发明提供高导热率纸，其包含主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热率材料由一种或多种纳米填料，直接位于主体基质上的类金刚石涂层和纳米填料上的类金刚石涂层组成。 在特定实施例中，特定图案包括网格，边缘，带状居中以及它们的组合中的一个或多个，并且高热导率材料覆盖主体基质表面的15-55％。 多个表面，包括子图层我都有图案。
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公开(公告)号：WO2006002012A1
公开(公告)日：2006-01-05
申请号：PCT/US2005/020560
申请日：2005-06-13
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James D., B. , STEVENS, Gary , WOOD, John, W. , LUTZ, Andreas
Inventor： SMITH, James D., B. , STEVENS, Gary , WOOD, John, W. , LUTZ, Andreas
IPC: H02K3/30
Abstract: The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin (32), which produces a resin impregnated matrix. The high thermal conductivity material (30) comprises 5-60% by volume of the resin (32). This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.
Abstract translation: 本发明提供了一种用高导热性填充树脂（32）浸渍基质的方法，其产生树脂浸渍基质。 高导热性材料（30）包含5-60体积％的树脂（32）。 这被压缩大约5-30％，并且装载在树脂中的高热导率材料之间的距离减小，然后树脂固化。
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公开(公告)号：WO2006002011A1
公开(公告)日：2006-01-05
申请号：PCT/US2005/020557
申请日：2005-06-13
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James, D., B. , STEVENS, Gary , WOOD, John W.
Inventor： SMITH, James, D., B. , STEVENS, Gary , WOOD, John W.
IPC: C09C3/06
CPC classification number: H01B3/006 , B82Y30/00 , C01P2004/13 , C01P2004/20 , C01P2004/32 , C01P2004/50 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C09C1/028 , C09C1/043 , C09C1/3054 , C09C1/3661 , C09C1/407 , C09C3/063 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , Y10T428/2991 , Y10T428/2998
Abstract: In one embodiment the present invention provides for a diamond like coating on small particles. This comprises small particles (10) in the size range of approximately 1-1000 nm and a diamond like coating on the small particles. The diamond like coating is distributed over approximately 50-100% of the surface of the small particles and the diamond like coating is one micron or less in thickness. These small particles then may be applied to materials such as resins (12) and insulating tapes
Abstract translation: 在一个实施方案中，本发明提供了在小颗粒上的类金刚石涂层。 这包括尺寸范围为约1-1000nm的小颗粒（10）和在小颗粒上的金刚石样涂层。 金刚石状涂层分布在小颗粒表面的大约50-100％之上，并且类似金刚石的涂层的厚度为1微米或更小。 然后，这些小颗粒可以应用于诸如树脂（12）和绝缘带的材料
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