公开(公告)号：US20060175085A1

公开(公告)日：2006-08-10

申请号：US11163477

申请日：2005-10-20

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: H05K1/11

CPC classification number: H05K3/0094 ,  H05K3/42 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2201/10666 ,  Y10T29/4913

Abstract: A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a through hole, wherein one side of the through hole of the substrate corresponds to a first diameter, and the other side of the through hole of the substrate corresponds to a second diameter. The second diameter is greater than the first diameter. The conductive layer is placed on the inner surface of the through hole for electrically connecting the two sides of the substrate.

Abstract translation: 公开了一种用于形成印刷电路板的印刷电路板和形成方法。 印刷电路板包括基板和导电层。 基板包括通孔，其中基板的通孔的一侧对应于第一直径，并且基板的通孔的另一侧对应于第二直径。 第二直径大于第一直径。 导电层被放置在通孔的内表面上，用于电连接衬底的两侧。