公开(公告)号：US20130259282A1

公开(公告)日：2013-10-03

申请号：US13736747

申请日：2013-01-08

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: H04R1/02

CPC classification number: H04R1/021 ,  H04R1/345 ,  H04R2499/11

Abstract: A back case includes a main body adapted to be coupled detachably to a rear surface portion of a portable electronic device, and a sound guide member connected to the main body. the sound guide member a sound guide surface that is adapted to face the rear surface portion of the portable electronic device, that has a corrugated surface part corresponding in position to a speaker of the portable electronic device, and that cooperates with the rear surface portion of the portable electronic device to define a sound guide space having a forward-facing opening.

Abstract translation: 后壳包括适于可拆卸地联接到便携式电子设备的后表面部分的主体和连接到主体的声音引导构件。 所述声音引导构件适于面向所述便携式电子设备的所述背面部分的声音引导表面，所述声音引导表面具有与所述便携式电子设备的扬声器对应的波纹状表面部分，并且与所述声音引导表面配合， 便携式电子设备来限定具有前向开口的声音引导空间。

公开(公告)号：US06753672B2

公开(公告)日：2004-06-22

申请号：US10178358

申请日：2002-06-25

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: H01M1046

CPC classification number: H01M12/065 ,  H01M4/12 ,  H01M4/70 ,  H01M2004/025 ,  H01M2004/027

Abstract: A metal-air fuel cell includes an anode and a cathode with an electrolyte between the anode and the cathode. The anode includes a plate-like body made of a composite anode plate including a reaction layer, a reaction-enhancing layer and a collector layer. A plurality of fins are formed on and extending from a surface of the anode plate. A plurality of openings are selectively defined in the anode plate in correspondence to the fins. The fins are arranged in an array with fins in adjacent rows aligned with each other or offset with respect to each other. The anode plate further includes a plurality of openings corresponding to each fin.

Abstract translation: 金属 - 空气燃料电池包括在阳极和阴极之间具有电解质的阳极和阴极。 阳极包括由包括反应层，反应增强层和集电体层的复合阳极板制成的板状体。 多个翅片形成在阳极板的表面上并从阳极板的表面延伸。 多个开口相应于翅片选择性地限定在阳极板中。 翅片布置成阵列，相邻排中的翅片彼此对准或相对于彼此偏移。 阳极板还包括对应于每个翅片的多个开口。

公开(公告)号：US20060093834A1

公开(公告)日：2006-05-04

申请号：US11285065

申请日：2005-11-21

Applicant: Yung-Jen Lin ,  Jung-Chang Hu ,  Chien-Ming Tseng ,  Hsuan-Peng Lin ,  Chih-Chao Hsu

Inventor： Yung-Jen Lin ,  Jung-Chang Hu ,  Chien-Ming Tseng ,  Hsuan-Peng Lin ,  Chih-Chao Hsu

IPC: B05D3/02 ,  B05D1/12 ,  B32B17/06 ,  B32B9/00 ,  B32B19/00

CPC classification number: C30B29/20

Abstract: A transparent ceramic structure and a method of surface treatment thereof are disclosed. A glass powder is applied over an unpolished surface of an intrinsically transparent ceramic structure. The ceramic structure is then placed in high temperature which is higher than the melting temperature of the glass powder and lower than 1,700 ° C. for about 1 minute to about 5 minutes. The transparent ceramic structure is removed from the environment and cooled down so as to obtain the desired transparency and strength of the ceramic structure.

Abstract translation: 公开了透明陶瓷结构及其表面处理方法。 将玻璃粉末涂覆在本体透明陶瓷结构的未抛光表面上。 然后将陶瓷结构放置在高于玻璃粉末的熔融温度的高温下，低于1,700℃约1分钟至约5分钟。 将透明陶瓷结构从环境中除去并冷却，以获得所需的陶瓷结构的透明度和强度。

公开(公告)号：US07615707B2

公开(公告)日：2009-11-10

申请号：US11163477

申请日：2005-10-20

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K3/0094 ,  H05K3/42 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2201/10666 ,  Y10T29/4913

Abstract: A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a through hole, wherein one side of the through hole of the substrate corresponds to a first diameter, and the other side of the through hole of the substrate corresponds to a second diameter. The second diameter is greater than the first diameter. The conductive layer is placed on the inner surface of the through hole for electrically connecting the two sides of the substrate.

Abstract translation: 公开了一种用于形成印刷电路板的印刷电路板和形成方法。 印刷电路板包括基板和导电层。 基板包括通孔，其中基板的通孔的一侧对应于第一直径，并且基板的通孔的另一侧对应于第二直径。 第二直径大于第一直径。 导电层被放置在通孔的内表面上，用于电连接衬底的两侧。

公开(公告)号：US20060093738A1

公开(公告)日：2006-05-04

申请号：US10979880

申请日：2004-11-01

Applicant: Yung-Jen Lin ,  Jung-Chang Hu ,  Chien-Ming Tseng ,  Hsuan-Peng Lin ,  Chih-Chao Hsu

Inventor： Yung-Jen Lin ,  Jung-Chang Hu ,  Chien-Ming Tseng ,  Hsuan-Peng Lin ,  Chih-Chao Hsu

IPC: B05D3/02 ,  B05D1/36 ,  B05D3/00

CPC classification number: C30B29/20

Abstract: A transparent ceramic structure and a method of surface treatment thereof are disclosed. A glass powder is applied over an unpolished surface of an intrinsically transparent ceramic structure. The ceramic structure is then placed in high temperature which is higher than the melting temperature of the glass powder and lower than 1,700° C. for about 1 minute to about 5 minutes. The transparent ceramic structure is removed from the environment and cooled down so as to obtain the desired transparency and strength of the ceramic structure.

Abstract translation: 公开了透明陶瓷结构及其表面处理方法。 将玻璃粉末涂覆在本体透明陶瓷结构的未抛光表面上。 然后将陶瓷结构放置在高于玻璃粉末的熔融温度的高温下，低于1,700℃约1分钟至约5分钟。 将透明陶瓷结构从环境中除去并冷却，以获得所需的陶瓷结构的透明度和强度。

公开(公告)号：US20130256188A1

公开(公告)日：2013-10-03

申请号：US13750427

申请日：2013-01-25

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: B65D25/00

CPC classification number: B65D25/00 ,  G06F1/1626 ,  G06F1/1632

Abstract: A supporting device is adapted for supporting a mobile apparatus thereon. The mobile apparatus is supported at an inline on the supporting device. The supporting device includes a base and a first supporting element. The base has two first lateral surfaces spaced apart from each other in a first direction, and two second lateral surfaces spaced apart from each other in a second direction. The first supporting element is connected to the base and has a supporting surface. The first supporting element is convertible from a storage state toward a supporting state, where one of the first lateral surfaces and the supporting surface cooperate with each other to support a connecting section of the mobile apparatus thereon.

Abstract translation: 支撑装置适于在其上支撑移动装置。 移动装置被支撑在支撑装置上的内联处。 支撑装置包括基座和第一支撑元件。 基部具有在第一方向上彼此间隔开的两个第一侧表面和在第二方向上彼此间隔开的两个第二侧表面。 第一支撑元件连接到基座并具有支撑表面。 第一支撑元件从存储状态转换到支撑状态，其中第一侧表面和支撑表面中的一个彼此协作以支撑移动设备的连接部分。

公开(公告)号：US20070258023A1

公开(公告)日：2007-11-08

申请号：US11429052

申请日：2006-05-08

Applicant: Chao-Shih Huang ,  Yung-Jen Lin

Inventor： Chao-Shih Huang ,  Yung-Jen Lin

IPC: G02F1/1347 ,  G02F1/1335

CPC classification number: G02F1/1347 ,  G02F1/13718 ,  G02F2201/44

Abstract: A dual-panel display panel includes a first display panel, and a second display panel located on the first display panel, wherein the second display panel includes a second lower plate having a plurality of thin-film transistors and a second upper plate having transparent electrodes, and a cholesteric liquid crystal layer formed between the second lower plate and the second upper plate.

Abstract translation: 双面显示面板包括第一显示面板和位于第一显示面板上的第二显示面板，其中第二显示面板包括具有多个薄膜晶体管的第二下板和具有透明电极的第二上板 以及形成在第二下板和第二上板之间的胆甾醇型液晶层。

公开(公告)号：US07126061B2

公开(公告)日：2006-10-24

申请号：US10861455

申请日：2004-06-07

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: H05K1/16

CPC classification number: H05K3/403 ,  H05K1/116 ,  H05K3/0052 ,  H05K3/42 ,  H05K2201/09463 ,  H05K2201/09663

Abstract: A printed circuit board for avoiding producing burrs, the printed circuit board includes a packaging substrate, at least one plated through hole, at least one first conductive portion, at least one non-conductive portion, at least one second conductive portion and at least one cut section. The plated through hole is formed on the packaging substrate. The first conductive portion and the second conductive portion respectively are adjacent to two sides of a peripheral of the plated through hole and separated by the non-conductive portion. Furthermore, the cut section is arranged on the non-conductive portion, thus the packaging substrate is cut without passing through the first conductive portion, and it will not cause the burrs on the first conductive portion.

Abstract translation: 一种用于避免产生毛刺的印刷电路板，印刷电路板包括封装基板，至少一个电镀通孔，至少一个第一导电部分，至少一个非导电部分，至少一个第二导电部分和至少一个第二导电部分 切割部分。 电镀通孔形成在封装基板上。 第一导电部分和第二导电部分分别与电镀通孔的周边的两侧相邻并且被非导电部分分开。 此外，切断部配置在非导电部分上，因此封装基板被切割而不穿过第一导电部分，并且不会在第一导电部分上引起毛刺。

公开(公告)号：US07078127B2

公开(公告)日：2006-07-18

申请号：US10458253

申请日：2003-06-11

Applicant: She-Huang Wu ,  Yung-Jen Lin ,  Mu-Rong Yang ,  Wen-Jen Liu ,  Yi-Shiuan Chen

Inventor： She-Huang Wu ,  Yung-Jen Lin ,  Mu-Rong Yang ,  Wen-Jen Liu ,  Yi-Shiuan Chen

IPC: H01M4/36 ,  H01M4/50 ,  C01D1/02

CPC classification number: H01M4/525 ,  H01M4/485 ,  H01M4/505

Abstract: A method for producing a positive electrode material adapted to the Li-ion secondary batteries is disclosed. The produced material has the following formula (I), Li1+xMn2−yMyO4   (I) wherein M is Mg, Al, Cr, Fe, Co, or Ni; 0≦x≦0.4, and 0≦y≦0.2. The method is achieved by co-precipitating a gel salts with an organic acid. First, salts of Li, Mn and M are mixed with at least a solvent to form an initial solution. The mole ratio of Li, Mn and M ions in their respective salts is (1+x):(2−y):y. Next, at least a chelate is added into the initial solution to form a suspension, which is then filtered to obtain a co-precipitate. Finally, the co-precipitate is calcined and heated to obtain the final product.

Abstract translation: 公开了一种适用于锂离子二次电池的正极材料的制造方法。 所生产的材料具有下式（I），<？in-line-formula description =“In-line Formulas”end =“lead”？> Li 1 + x Mn 2 （I）<αin-line-formula description =“In-line Formulas”end =“tail”？>其中M 是Mg，Al，Cr，Fe，Co或Ni; 0 <= x <= 0.4，0 <= y <= 0.2。 该方法通过将凝胶盐与有机酸共沉淀来实现。 首先，将Li，Mn和M的盐与至少一种溶剂混合以形成初始溶液。 其各自盐中的Li，Mn和M离子的摩尔比为（1 + x）：（2-y）：y。 接下来，将至少一种螯合物加入到初始溶液中以形成悬浮液，然后过滤以获得共沉淀物。 最后，将共沉淀物煅烧并加热以获得最终产物。

公开(公告)号：US20050072596A1

公开(公告)日：2005-04-07

申请号：US10861455

申请日：2004-06-07

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K7/06

CPC classification number: H05K3/403 ,  H05K1/116 ,  H05K3/0052 ,  H05K3/42 ,  H05K2201/09463 ,  H05K2201/09663

Abstract: A printed circuit board for avoiding producing burrs, the printed circuit board includes a packaging substrate, at least one plated through hole, at least one first conductive portion, at least one non-conductive portion, at least one second conductive portion and at least one cut section. The plated through hole is formed on the packaging substrate. The first conductive portion and the second conductive portion respectively are adjacent to two sides of a peripheral of the plated through hole and separated by the non-conductive portion. Furthermore, the cut section is arranged on the non-conductive portion, thus the packaging substrate is cut without passing through the first conductive portion, and it will not cause the burrs on the first conductive portion.

Abstract translation: 一种用于避免产生毛刺的印刷电路板，印刷电路板包括封装基板，至少一个电镀通孔，至少一个第一导电部分，至少一个非导电部分，至少一个第二导电部分和至少一个第二导电部分 切割部分。 电镀通孔形成在封装基板上。 第一导电部分和第二导电部分分别与电镀通孔的周边的两侧相邻并且被非导电部分分开。 此外，切断部配置在非导电部分上，因此封装基板被切割而不穿过第一导电部分，并且不会在第一导电部分上引起毛刺。