公开(公告)号：KR101637006B1

公开(公告)日：2016-07-08

申请号：KR1020090076537

申请日：2009-08-19

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J133/08 ,  C09J163/00 ,  C09J7/02

Abstract: 본발명은전자부품용접착테이프조성물에관한것으로서, 보다상세하게는접착력및 작업성이우수하고, 반도체장치의리드프레임주변의부품간 전자부품의접착시충분한내열성을지니고산, 염기처리시리드프레임및 접착제의부식을방지하고, 고온에서작업시우수한신뢰성을지니는전자부품용접착테이프조성물에관한것이다. 이를위해본 발명에따른전자부품용접착테이프조성물은아크릴계고분자 100중량부에대해에폭시수지 1 내지 200중량부, 페녹시수지 0.1 내지 100중량부, 부식억제제 0.01 내지 10중량부및 경화제 5 내지 20중량부를포함하는것을특징으로한다.

公开(公告)号：KR1020110139599A

公开(公告)日：2011-12-29

申请号：KR1020100059768

申请日：2010-06-23

Applicant: 도레이첨단소재 주식회사

Inventor： 김우석 ,  김상필 ,  문기정 ,  신현민 ,  황남익

IPC: C09J163/00 ,  C09J161/10 ,  C09J7/02 ,  C09J9/00

CPC classification number: H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  C09J163/00 ,  C09J7/25 ,  C09J7/35 ,  C09J9/00 ,  C09J161/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/10

Abstract: PURPOSE: A thermosetting double-sided adhesive film is provided to prevent the failure including the interfacial separation or the cracking of a package by the strong vapor pressure. CONSTITUTION: A thermosetting double-sided adhesive film is obtained by coating an adhesive layer(20) on both sides of a polyimide film(10). The adhesive layer contains the following: 100parts of NBR by weight containing 1-10wt% of carboxyl group; and 5-200 parts of epoxy resin based hardener by weight, 50-200 parts of phenol resin based hardener by weight, or 2-40 parts of amine or acid anhydride based hardener by weight.

Abstract translation: 目的：提供一种热固性双面粘合膜，以防止由于强烈的蒸汽压力引起的界面分离或包装破裂。 构成：通过在聚酰亚胺膜（10）的两面上涂布粘合剂层（20），得到热固性双面粘合膜。 粘合剂层包含以下物质：100份含有1-10重量％羧基的NBR重量份; 和5-200份重量的环氧树脂固化剂，50-200份重量的酚醛树脂固化剂，或2-40份基于胺或酸酐类固化剂的固化剂。

公开(公告)号：KR1020100082181A

公开(公告)日：2010-07-16

申请号：KR1020090001545

申请日：2009-01-08

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J109/02 ,  C09J163/00

Abstract: PURPOSE: A heat resistant adhesive composition is provided to have excellent adhesive force and workability, to obtain enough heat resistance when electronic parts are combined on a lead frame of a semiconductor device, and to obtain high reliability at a high temperature. CONSTITUTION: A heat resistant adhesive composition includes 1-400 parts by weight of an epoxy resin, 1-200 parts by weight of a phenolic resin, 0.01-50 parts by weight of an antioxidant, 0.01-10 parts by weight of an anticorrosive agent, 0.01-50 parts by weight of a hardener, and 0.001-10 parts by weight of a curing accelerator. The acrylonitrile butadiene rubber has the content of a carboxylic group of 0.1-10.0 weight%.

Abstract translation: 目的：提供耐热粘合剂组合物以具有优异的粘合力和可加工性，以在电子部件组合在半导体器件的引线框架上时获得足够的耐热性，并在高温下获得高可靠性。 构成：耐热粘合剂组合物包含1-400重量份的环氧树脂，1-200重量份的酚醛树脂，0.01-50重量份的抗氧化剂，0.01-10重量份的防腐剂 ，0.01-50重量份的硬化剂和0.001-10重量份的固化促进剂。 丙烯腈丁二烯橡胶的羧基含量为0.1-10.0重量％。