公开(公告)号：KR101392442B1

公开(公告)日：2014-05-07

申请号：KR1020080003622

申请日：2008-01-11

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J113/00

Abstract: 본발명은전자부품용액상접착제및 이를이용하여리드프레임에도포하는방법에관한것으로서, 보다상세하게는접착력이우수하고반도체장치의리드프레임주변의부품간이나기타전자부품들의접착시충분한내열성및 신뢰성을가지며경시안정성이우수하고작업성또한우수한전자부품용액상접착제및 이를이용하여리드프레임에도포하는방법에관한것이다. 이를위해본 발명에따른전자부품용액상접착제는열경화성수지, 열가소성수지및 경화제를포함하는것을특징으로하고, 바람직하게는상기열가소성수지는카르복실기를포함하는 NBR로서, 1~20 중량%의카르복실기를포함하고, 중량평균분자량이 10,000~300,000인것을특징으로하며, 또한전자부품용액상접착제를이용하여리드프레임에도포하는방법은상기전자부품용액상접착제를사용하여디스펜스법또는잉크젯법으로리드프레임에도포하는것을특징으로한다.

公开(公告)号：KR1020100091737A

公开(公告)日：2010-08-19

申请号：KR1020090011071

申请日：2009-02-11

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  김우석 ,  문기정 ,  전해상

IPC: C09J7/02 ,  C09J163/00 ,  C09J135/04

CPC classification number: C09J135/04 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326

Abstract: PURPOSE: An adhesive tape composition for electronic components is provided to obtain excellent electrical reliability by controlling an electrical short circuit due to ion impurities when the electrical reliability is evaluated after fixing a lead frame. CONSTITUTION: An adhesive tape composition for electronic component comprises 100.0 parts by weight of an elastomer, 100-400 parts by weight of an epoxy-based resin, 10-100.0 parts by weight of a phenol-based resin, 0.01-10 parts by weight of a hardening catalyst, 0.01-20 parts by weight inorganic filler, 0.01-10 parts by weight of an ion-exchanger, and 1-50 parts of a monomer type resin. The glass transition temperature(Tg) of the elastomer is (-60)-200 °C. The elastomer contains 10-60 weight% of acrylonitrile and 1-30 wegith% of a carboxyl group.

Abstract translation: 目的：提供一种用于电子元件的胶带组合物，以便在固定引线框架之后评估电可靠性时，通过控制由于离子杂质引起的电短路来获得优异的电可靠性。 构成：电子部件用胶带组合物包含100.0重量份弹性体，100-400重量份环氧类树脂，10-100.0重量份苯酚系树脂，0.01-10重量份 的硬化催化剂，0.01-20重量份无机填料，0.01-10重量份离子交换剂和1-50份单体型树脂。 弹性体的玻璃化转变温度（Tg）为（-60）-200℃。 弹性体含有10-60重量％的丙烯腈和1-30重量％的羧基。

公开(公告)号：KR101171352B1

公开(公告)日：2012-08-10

申请号：KR1020100059768

申请日：2010-06-23

Applicant: 도레이첨단소재 주식회사

Inventor： 김우석 ,  김상필 ,  문기정 ,  신현민 ,  황남익

IPC: C09J163/00 ,  C09J161/10 ,  C09J7/02 ,  C09J9/00

CPC classification number: H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: 본 발명은 적층 CSP(chip scale package)에 사용되는 접착 필름에 관한 것으로서, 보다 상세하게는 적층되는 다이 간의 접착과 전기적 간섭 방지 및 와이어(wire) 공간 확보의 역할을 하는 양면 접착 필름으로서 고온 작업 시 패키지 내부에 흡습되어있는 수분의 강한 수증기압으로 인한 패키지의 팝콘 크래킹 현상이나 계면 박리 등의 불량을 방지할 수 있는 내열성과 접착력이 우수한 열경화성 양면 접착 필름에 관한 것이다. 이를 위해 본 발명에 따른 내열성과 접착력이 우수한 열경화성 양면 접착 필름은 폴리이미드 필름의 양면에 접착제 층이 코팅된 다이(Die) 간 접착 필름으로서, 상기 접착제 층은 카르복실기가 1~10 중량% 포함된 NBR 100중량부 대비 에폭시 수지 5~200중량부, 페놀 수지 50~200 중량부 및 아민 계 혹은 산무수물 계 경화제 중 선택된 1종 이상의 경화제 2~40 중량부, 디큐밀 퍼옥사이드 1~5 중량부를 함유하고, 상기 페놀 수지는 링 엔드 볼 방법(ring and ball method)에 의해 측정된 연화점이 60~120℃인 것을 특징으로 한다.

公开(公告)号：KR1020120070972A

公开(公告)日：2012-07-02

申请号：KR1020100132531

申请日：2010-12-22

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  김상필 ,  문기정 ,  김우석

IPC: C09J133/04 ,  C09J161/10 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J133/04 ,  C09J7/22 ,  C09J7/30 ,  C09J7/35 ,  C09J161/06 ,  C09J163/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/6836 ,  H01L2221/68327

Abstract: PURPOSE: An adhesive composition is provided to form close network, thereby providing an adhesive tape in which adhesion and thermal resistance at high temperatures are improved. CONSTITUTION: An adhesive composition comprises a modified acrylic copolymer, a resol type phenol resin, a polyfunctional epoxy resin, and one or more of a hardener selected from an acid anhydride hardener, and amine-based hardener, and filler. The comprised amount of the modified acrylic copolymer is 10-50 weight%, based on total solid phase. The resol type phenol resin is one or more kinds selected from phenol type, cresol type, alkyl type, bisphenol A type, and a copolymer thereof. The acid anhydride hardener is one or more kinds selected from succinic anhydride, maleic anhydride, ethoxyformic anhydride, acetic anhydride, phthalic anhydride, butyric acid anhydride, and trimellic anhydride.

Abstract translation: 目的：提供粘合剂组合物以形成紧密的网络，从而提供粘合带，其中高温下的粘合性和耐热性得到改善。 构成：粘合剂组合物包含改性丙烯酸共聚物，甲阶酚醛树脂型酚醛树脂，多官能环氧树脂，以及一种或多种选自酸酐硬化剂和胺类固化剂的硬化剂和填料。 改性丙烯酸共聚物的含量为10-50重量％，基于总固相。 甲阶型酚醛树脂是选自苯酚型，甲酚型，烷基型，双酚A型及其共聚物中的一种或多种。 酸酐固化剂是选自琥珀酸酐，马来酸酐，乙氧基甲酸酐，乙酸酐，邻苯二甲酸酐，丁酸酐和偏苯三酸酐中的一种或多种。

公开(公告)号：KR1020110076383A

公开(公告)日：2011-07-06

申请号：KR1020090133079

申请日：2009-12-29

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J109/02 ,  C09J179/08 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J109/02 ,  C09J7/22 ,  C09J7/35 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326

Abstract: PURPOSE: An adhesive composition for electronic application is provided to ensure excellent adhesive property and heat resistance and good heat dispersibility. CONSTITUTION: An adhesive composition for electronic application includes, based on 100 parts by weight of a nitrile-butadiene polymer, 1-100 parts by weight of an imide resin, 1-100 parts by weight of an epoxy resin, and 1-50 parts by weight of a phenoxy resin and 1-10 parts by weight of flame retardant. The adhesive composition further includes 1-5 parts by weight of polyhedral oligomeric silsesquioxane represented by chemical formula 1. In chemical formula 1, R is independently a hydrogen atom, halogen atom, C1-10 linear or branched alkyl group, cyclic alkyl group, aralkyl group, alkenyl group, oxalic acid, aryl group or aniline group.

Abstract translation: 目的：提供用于电子应用的粘合剂组合物，以确保优异的粘合性能和耐热性以及良好的热分散性。 构成：用于电子应用的粘合剂组合物包括基于100重量份的腈 - 丁二烯聚合物，1-100重量份的酰亚胺树脂，1-100重量份的环氧树脂和1-50重量份 的苯氧基树脂和1-10重量份的阻燃剂。 粘合剂组合物还包含1-5重量份由化学式1表示的多面体低聚倍半硅氧烷。在化学式1中，R独立地为氢原子，卤素原子，C 1-10直链或支链烷基，环烷基，芳烷基 基团，烯基，草酸，芳基或苯胺基。

公开(公告)号：KR1020110019006A

公开(公告)日：2011-02-25

申请号：KR1020090076537

申请日：2009-08-19

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J133/08 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J7/385 ,  C09J11/06 ,  C09J133/06 ,  C09J2203/326

Abstract: PURPOSE: An adhesive tape composition for electronic components is provided to ensure enough thermal resistance in case of adhering electronic components and to prevent corrosion of a lead frame and adhesive. CONSTITUTION: An adhesive tape composition for electronic components contains 1-200 weight parts of epoxy resin composition, 0.1-100 weight parts of phenoxy, 0.01-10 weight parts of corrosion inhibitor, and 5-20 weight parts of hardener. The phenoxy resin is selected from bisphenol A type, bisphenol F type, phosphorous-based phenoxy, bisphenol S type, PKHB, PKHC, PKHH, PKHJ, PKFE, PKHP-200, PKHS-30, PKHM-30, LER derivative, SER-10, SER-25, and LEN-HB.

Abstract translation: 目的：提供一种用于电子部件的胶带组合物，用于在粘附电子部件的情况下确保足够的热阻，并防止引线框和粘合剂的腐蚀。 构成：电子部件用胶带组合物含有1-200重量份环氧树脂组合物，0.1-100重量份苯氧基，0.01-10重量份防腐蚀剂和5-20重量份硬化剂。 苯氧基树脂选自双酚A型，双酚F型，磷类苯氧基，双酚S型，PKHB，PKHC，PKHH，PKHJ，PKFE，PKHP-200，PKHS-30，PKHM-30，LER衍生物，SER- 10，SER-25和LEN-HB。

公开(公告)号：KR1020090077590A

公开(公告)日：2009-07-15

申请号：KR1020080003622

申请日：2008-01-11

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J113/00

CPC classification number: C09J113/00 ,  C08K5/132 ,  C08K5/17 ,  C09J9/00 ,  C09J11/06 ,  C09J161/04 ,  C09J163/00

Abstract: A liquid adhesive for electronic parts is provided to ensure excellent adhesive force, enough heat resistance and reliability in the adhesion between neighboring parts of a lead frame of a semiconductor device or other electronic components. A liquid adhesive(10) for electronic parts comprises a thermosetting resin, a thermoplastic resin and a hardener. The thermoplastic resin is NBR including a carboxyl group, contains a carboxyl group of 1~20 weight% and has weight average molecular weight of 10,000~300,000. Based on NBR 150 parts by weight containing the carboxyl group, the liquid adhesive comprises a multifunctional phenol resin 20~400 parts by weight and a multifunctional epoxy resin 3~300 parts by weight as a thermosetting resin; and triethylenetetramine 5 parts by weight and benzophenonetetracarboxylic anhydride 5 parts by weight as a hardener.

Abstract translation: 提供了用于电子部件的液体粘合剂以确保优异的粘合力，足够的耐热性和半导体器件的引线框架的相邻部件之间的粘合力的可靠性或其他电子部件。 用于电子部件的液体粘合剂（10）包括热固性树脂，热塑性树脂和硬化剂。 热塑性树脂是包含羧基的NBR，含有1〜20重量％的羧基，重均分子量为10,000〜30万。 基于含有羧基的NBR 150重量份，液体粘合剂包含20〜400重量份的多官能酚醛树脂和3〜300重量份的多官能环氧树脂作为热固性树脂; 和三亚乙基四胺5重量份，二苯甲酮四羧酸酐5重量份作为硬化剂。

公开(公告)号：KR1020130081549A

公开(公告)日：2013-07-17

申请号：KR1020120002585

申请日：2012-01-09

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  서창호

IPC: H01M10/0565 ,  H01M10/052 ,  H01M4/36

CPC classification number: H01M10/0565 ,  H01M2/162 ,  H01M4/131 ,  H01M4/134 ,  H01M4/382 ,  H01M4/485 ,  H01M10/0525 ,  H01M2300/0082 ,  Y02E60/122

Abstract: PURPOSE: A polymer electrolyte composition with excellent durability and high temperature stability, and a lithium battery using the composition are provided to have excellent high tmerature characteristics, ion conducitivity, and mechanical property. CONSTITUTION: A polymer electrolyte composition is excellent in durability and high temperature stability and comprises a multifunctional cross linkage boron compound, an acryl-based polymer, a phenol resin, a lithium salt, and an organic solvent. The multifunctional cross linkage boron compound is at least one compound selected from the group consisting of compounds represented by Formula 1. The acryl-based polymer is an acrylonitrile-butadiene copolymer and an acrylonitrile-butadiene-acrylic acid terpolymer having a weight-average molecular weight of 2,000 to 2,000,000. The polymer eletroylte composition further comprises a curing agent, and the curing agent is an aliphatic polyamine curing agent. The aliphatic polyamine curing agent is at least one selected from the group consisting of diethylenetriamine, diethylene tetramine, diethylaminopropylamine, methane diamine, N-aminoethylpiperazine, M-xylene diamine, and isophoron diamine. An aromatic amine curing agent is at least one selected from the group consisting of metaphenylene diamine, 4-4'-dimethylaniline, and diaminodiphenylsulfone. [Reference numerals] (A1) Example 3; (A2) Example 4; (BB) Comparative example 2

Abstract translation: 目的：提供具有优异的耐久性和高温稳定性的高分子电解质组合物和使用该组合物的锂电池，具有优异的高特性，离子导电性和机械性能。 构成：聚合物电解质组合物的耐久性和高温稳定性优异，包括多官能交联硼化合物，丙烯酸类聚合物，酚醛树脂，锂盐和有机溶剂。 多功能交联硼化合物是选自由式1表示的化合物中的至少一种化合物。丙烯酰基聚合物是丙烯腈 - 丁二烯共聚物和具有重均分子量的丙烯腈 - 丁二烯 - 丙烯酸三元共聚物 2,000至2,000,000。 聚合物电解质组合物还包含固化剂，固化剂是脂族多胺固化剂。 脂肪族多胺固化剂是选自二亚乙基三胺，二亚乙基四胺，二乙基氨基丙胺，甲烷二胺，N-氨基乙基哌嗪，间二甲苯二胺，异佛尔酮二胺中的至少一种。 芳胺固化剂是选自间苯二胺，4-4'-二甲基苯胺和二氨基二苯砜中的至少一种。 （A1）实施例3 （A2）实施例4 （BB）比较例2

公开(公告)号：KR1020130081548A

公开(公告)日：2013-07-17

申请号：KR1020120002584

申请日：2012-01-09

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  서창호

IPC: C08L47/00 ,  C08K5/55 ,  C08F236/12 ,  H01L31/042

CPC classification number: Y02E10/542 ,  C08L47/00 ,  C08F236/12 ,  C08K5/55 ,  H01B1/20 ,  H01G9/2059 ,  H01L31/042 ,  Y02E10/549

Abstract: PURPOSE: A polymer electrolyte composition for a dye sensitized solar cell, and a dye sensitized solar cell using the composition are provided to have excellent ion conductivity and durability, to implement a large-size and flexible solar cell since a polymer electrolyte is capable of roll-to-roll manufacture, and to have an excellent light energy conversion efficiency. CONSTITUTION: A polymer electrolyte composition is for a dye sensitized solar cell and comprises a multifunctional cross linkage boron compound, a nitrile butadiene polymer, a phenol resin, a curing agent, a metal salt, and an organic solvent. The nitrile butadiene polymer is an acrylonitrile-butadiene copolymer and an acrylonitrile-butadiene-acrylic acid terpolymer having a weight-average molecular weight of 2,000 to 2,000,000. The nitrile butadiene polymer contains 1 to 20% of carboxyl group and 1 to 40% of acrylonitrol group at a chain terminal. The curing agent is an aliphatic polyamine curing agent and an aromatic amine curing agent. [Reference numerals] (AA) Current density Isc (mA/cm^2); (BB) Voltage (Voc); (C1) Example 2; (C2) Example 4; (DD) Comparative example 2

Abstract translation: 目的：提供用于染料敏化太阳能电池的聚合物电解质组合物和使用该组合物的染料敏化太阳能电池，以具有优异的离子传导性和耐久性，以实现大尺寸和柔性的太阳能电池，因为聚合物电解质能够滚动 并且具有优异的光能转换效率。 构成：聚合物电解质组合物用于染料敏化太阳能电池，包括多官能交联硼化合物，丁腈聚合物，酚醛树脂，固化剂，金属盐和有机溶剂。 腈丁二烯聚合物是丙烯腈 - 丁二烯共聚物和丙烯腈 - 丁二烯 - 丙烯酸三元共聚物，其重均分子量为2,000至2,000,000。 腈丁二烯聚合物在链末端含有1〜20％的羧基和1〜40％的丙烯腈基。 固化剂是脂族多胺固化剂和芳香胺固化剂。 （标号）（AA）电流密度Isc（mA / cm ^ 2）; （BB）电压（Voc）; （C1）实施例2 （C2）实施例4 （DD）比较例2

公开(公告)号：KR1020110137861A

公开(公告)日：2011-12-26

申请号：KR1020100057830

申请日：2010-06-18

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  김상필 ,  문기정 ,  김우석

IPC: C09J9/00 ,  C09J133/08 ,  C09J163/00 ,  H01L21/58

CPC classification number: C09J9/00 ,  C08K5/541 ,  C09J11/00 ,  C09J11/04 ,  C09J133/08 ,  C09J163/00 ,  C09J2203/326 ,  C09J2479/086

Abstract: PURPOSE: An adhesive composition for electronic parts and an adhesive film including the same are provided to prevent the escape of lead pins due to pressures and impacts. CONSTITUTION: An adhesive composition for electronic parts includes a thermoplastic resin, a thermosetting resin, a hardener, and an additive. The storage modulus of elasticity of the composition is between 1 and 10 MPA at a range of 150-200 degrees Celsius if the temperature raising speed is 3degrees Celsius/minute from the room temperature. The surface hardness of the composition is between 1 and 20 MPa after a drying process. The average molecular weight of the thermoplastic resin is between 10,000 and 500,000. The thermoplastic resin is an acrylic acid ester copolymer. An electrode part includes a base film(11) and an adhesive layer(12) based on the composition.

Abstract translation: 目的：提供用于电子部件的粘合剂组合物和包含该粘合剂组合物的粘合剂膜以防止由于压力和冲击引起的引脚的逸出。 构成：用于电子部件的粘合剂组合物包括热塑性树脂，热固性树脂，硬化剂和添加剂。 如果升温速度为室温3℃/分钟，则组合物的储能弹性模量在150-200摄氏度的范围内为1至10MPA。 干燥处理后，组合物的表面硬度为1〜20MPa。 热塑性树脂的平均分子量在10,000至500,000之间。 热塑性树脂是丙烯酸酯共聚物。 基于该组合物，电极部分包括基膜（11）和粘合剂层（12）。