公开(公告)号：KR1020120002465A

公开(公告)日：2012-01-05

申请号：KR1020110063428

申请日：2011-06-29

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오다기리마사야 ,  무라끼유우스께 ,  후지하라진

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/67

CPC classification number: H01L21/6719 ,  C23C16/401 ,  C23C16/4582 ,  C23C16/46 ,  H01L21/67109 ,  H01L21/68742 ,  H01L21/68771 ,  H01L21/68785 ,  Y10T156/17 ,  Y10T156/1702

Abstract: PURPOSE: A substrate stage, a substrate processing apparatus and a substrate processing system are provided to perform a temperature management of the surface of a substrate accurately by adjusting a gap between the peripheral part and a system substrate. CONSTITUTION: A board loading stand(20) is arranged within a process chamber(10). A protrusion(30) is installed in the top side of the board loading stand. A plurality of support pins(28) supporting the substrate(W) are installed in the process chamber An elevating mechanism(29) raises the support pin up and down and is comprised of a driving part(29a) and a lifting unit(29b). A periphery loading member(40) loads a substrate rim part(W1). A center loading member(50) loads a substrate central part(W2).

Abstract translation: 目的：提供基板台，基板处理装置和基板处理系统，通过调整周边部和系统基板之间的间隙，精确地进行基板表面的温度管理。 构成：在加工室（10）内布置有板装载台（20）。 突起（30）安装在板装载台的顶侧。 支撑衬底（W）的多个支撑销（28）安装在处理室中。升降机构（29）上下支撑销，并由驱动部分（29a）和提升单元（29b）组成， 。 外围装载构件（40）装载基板边缘部分（W1）。 中心加载构件（50）装载基板中心部分（W2）。