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公开(公告)号：KR100340425B1
公开(公告)日：2002-06-12
申请号：KR1020000050472
申请日：2000-08-29
Applicant: 삼성전기주식회사
IPC: C23C16/01
Abstract: 본 발명은 기판의 도금장치에 있어서, 기판이 고정되는 고정프레임을 승하강및 진동토록 함은 물론 기판이 침적되는 도금조내에 초음파 진동자를 설치하여 비어홀내의 도금 불량을 미연에 방지토록 하는 기판의 균일 도금 장치에 관한 것으로서 그 기술적인 구성은, 기판을 고정하면서 회전축이 돌출되는 고정프레임과, 상기 회전축이 모터에 연결되는 회전판에 편심고정될때 고정프레임을 진동및 회전토록 설치되는 기판요동부및, 상기 기판이 침적토록 설치되면서 도금액이 충진되는 내측에 초음파 진동자가 설치되는 도금조를 포함하는 구성되는 것을 요지로 한다.
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公开(公告)号：KR1020020017260A
公开(公告)日：2002-03-07
申请号：KR1020000050472
申请日：2000-08-29
Applicant: 삼성전기주식회사
IPC: C23C16/01
Abstract: PURPOSE: An apparatus for uniformly plating a substrate is provided which prevents plating defects inside via holes by installing a fixing frame for fixing the substrate so that the frame is ascended or descended and vibrated, and installing an ultrasonic oscillator on the inner side of a plating vessel into which the substrate is submersed. CONSTITUTION: The apparatus for uniformly plating a substrate comprises a fixing frame(100) to which a plurality of substrates(110) are fixed, and from both sides of which rotation axes are projected; a substrate fluctuation part in which rotation plates fixed through motors(240) and fixing axes(220) are installed at a supporter(210) to the lower parts of which ascent and descent cylinders(260) are connected so that the rotation axes are eccentrically connected to the rotation plates, and an oscillator(270) installed on the supporter is elastically connected to the upper side of the fixing frame(100); and a plating vessel(300) in which the fixing frame(100) is inserted, and an ultrasonic oscillator(320) is installed at the inner side of the plating vessel(300) in which a plating solution is filled, wherein the ultrasonic oscillator(320) installed in the plating vessel(300) is a round type.
Abstract translation: 目的：提供一种用于均匀镀覆基板的装置，其通过安装用于固定基板的固定框架使框架上升或下降和振动来防止通孔内的电镀缺陷，并且在电镀的内侧安装超声波振荡器 衬底浸入其中的容器。 构成：用于均匀镀覆基板的装置包括固定框架（100），多个基板（110）被固定到该固定框架上，并且从其两侧的旋转轴线被突出; 其中通过马达（240）和固定轴（220）固定的旋转板被安装在支撑件（210）上，连接到上下游缸（260）的下部，使得旋转轴偏心 连接到所述旋转板，并且安装在所述支撑件上的振荡器（270）弹性地连接到所述固定框架（100）的上侧; 以及插入固定框架（100）的电镀槽（300），在填充有电镀液的电镀槽（300）的内侧设置有超声波振荡器（320），其中，超声波振荡器 （320）是圆形的。
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公开(公告)号：KR1020020017255A
公开(公告)日：2002-03-07
申请号：KR1020000050467
申请日：2000-08-29
Applicant: 삼성전기주식회사
IPC: H05K3/06
CPC classification number: H05K3/288
Abstract: PURPOSE: An apparatus for removing a film from a substrate is provided to remove a cover film for protecting a dry film by using a film adhesion portion of a transfer roller. CONSTITUTION: A transfer roller(120) is fixed by a support portion(130). The transfer roller(120) is used for transferring a substrate(110) including a cover film(100). An elastic cover(170) is fixed to an outer circumference of the transfer roller(120). A film adhesion portion(150) has a multitude of circular groove holes and a multitude of groove holes. The film adhesion portion(150) is projected to an outer circumference of the elastic cover(170) and a multitude of absorption plates are formed thereby. The film adhesion portion(150) is formed by an adhesive tape. A film removal box(200) is installed on one side of the transfer roller(120). A stone plate(240) is connected with the film removal box(200). A brush(220) and an absorption tube(230) are installed on one side of the transfer roller(120).
Abstract translation: 目的：提供一种用于从基板上除去膜的装置，以通过使用转印辊的膜粘附部分去除用于保护干膜的覆盖膜。 构成：转印辊（120）由支撑部分（130）固定。 转印辊（120）用于转印包括覆盖膜（100）的基板（110）。 弹性盖（170）固定在转印辊（120）的外圆周上。 膜粘接部（150）具有多个圆形槽孔和多个槽孔。 膜粘附部分（150）突出到弹性盖（170）的外周，并且由此形成多个吸收板。 胶粘剂部分（150）由胶带形成。 移印盒（200）安装在转印辊（120）的一侧。 石板（240）与薄膜去除盒（200）连接。 刷子（220）和吸收管（230）安装在转印辊（120）的一侧上。
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公开(公告)号：KR1020170067447A
公开(公告)日：2017-06-16
申请号：KR1020150174135
申请日：2015-12-08
Applicant: 삼성전기주식회사
Abstract: 본발명에따른전자소자내장인쇄회로기판은, 제1 절연층, 제1 절연층에형성된회로패턴, 제1 절연층의일면에일부가삽입된전자소자및 제1 절연층의일면에적층되며전자소자를매립시키는제2 절연층을포함한다.
Abstract translation: 根据本发明的内置电子器件的印刷电路板包括第一绝缘层，形成在第一绝缘层上的电路图案，部分地插入第一绝缘层的一个表面中的电子元件， 以及填充该装置的第二绝缘层。
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公开(公告)号：KR100783467B1
公开(公告)日：2007-12-07
申请号：KR1020060018219
申请日：2006-02-24
Applicant: 삼성전기주식회사
IPC: H05K3/42
CPC classification number: H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09563 , H05K2203/1476 , Y10T29/49126 , Y10T29/49155
Abstract: 내부 관통홀이 형성된 코어층과, 상기 내부 관통 홀의 일측을 막아 상기 내부 관통홀 내에 잉여 공간이 형성된 제1 도금층과, 상기 잉여 공간이 충진 되며 상기 내부 관통홀의 타측을 막는 제2 도금층을 포함하는 인쇄회로기판 및 그 제조 방법에 관한 것이다. 코어층의 양면에 비대칭적으로 전류밀도를 인가함으로써 내부 관통 홀의 한쪽 표면에서 우선적으로 연결이 이루어지게 하는 것인데, 양면에 균일한 전류밀도를 인가하는 방법을 적용하였을 때 발생하는 문제인 관통 홀의 내부가 도금으로 충진 됨에 따라 내부의 중앙 부위가 먼저 연결되어 홀 내부 중심부의 교반 특성이 급격하게 저하되고, 미충진 영역(Void)이 생기는 문제점을 개선한다.
인쇄회로기판, 내부 관통홀, 충진, 도금-
Patent Agency Ranking
公开(公告)号：KR1020060027673A
公开(公告)日：2006-03-28
申请号：KR1020040076570
申请日：2004-09-23
Applicant: 삼성전기주식회사
Abstract: 본 발명은 스택형 비아홀 충전 동도금액의 재생 처리방법에 관한 것으로, 광택제에 대하여 선택적 제거 성능을 갖는 K
4 Nb
6 O
17 광촉매와 자외선을 이용한 광반응을 통해서 스택형 비아홀 충전 동도금폐액내의 불필요한 노화성분을 높은 선택성으로 처리하는 것을 특징으로 한다.
본 발명의 방법에 따르면, 변성광택제를 포함한 광택제의 상대적 선택제거가 가능하고, 높은 동농도하에서도 높은 광택제 제거효율을 나타내어 광택제 변성에 따른 스택형 비아홀 충전 성능을 제어함으로써 충분한 수준의 충전 도금성능을 기대할 수 있다. 또한, 전체 동도금액의 상태를 최적화시켜 건욕주기를 연장하여 건욕비용이 절감되는 이점이 있다.
스택, 비아홀, 충전 동도금액, 재생 처리, 광촉매, 자외선-
公开(公告)号：KR100433828B1
公开(公告)日：2004-05-31
申请号：KR1020010087120
申请日：2001-12-28
Applicant: 삼성전기주식회사
IPC: H01B3/00
Abstract: PURPOSE: A film type insulating material is provided to minimize the deviation of plating thickness and to obtain uniform insulating thickness when an insulating layer is formed in a PCB production process by a build-up method. CONSTITUTION: The film type insulating material comprises a cover film(10), an insulating layer forming film(20) and a Mylar film(30). The film type insulating material is characterized in that the insulating layer forming film(20) has a width less than that of the overlaying cover film(10) by 1 to 10 mm, and a flow interrupting jaw is formed at both ends of the cover film(10) or a flow interrupting dam(40) is formed at both ends of the insulating layer forming film(20) in which the jaw or dam(40) has a height equal to that of the insulating layer forming film(20) and a width of 1 to 10 mm in order to prevent the resin of the insulating layer forming film(20) from outflowing.
Abstract translation: 目的：提供薄膜型绝缘材料以最小化电镀厚度的偏差并且当通过积层方法在PCB制造过程中形成绝缘层时获得均匀的绝缘厚度。 构成：膜型绝缘材料包括覆盖膜（10），绝缘层形成膜（20）和聚酯薄膜（30）。 该薄膜型绝缘材料的特征在于，绝缘层形成膜（20）的宽度比覆盖覆盖膜（10）的宽度小1至10mm，并且在封盖的两端形成流动阻断钳口 在绝缘层形成膜（20）的两端形成薄膜（10）或阻流坝（40），其中颚或坝（40）的高度等于绝缘层形成薄膜（20）的高度， 并且为了防止绝缘层形成膜（20）的树脂流出而具有1〜10mm的宽度。
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公开(公告)号：KR1020030056837A
公开(公告)日：2003-07-04
申请号：KR1020010087139
申请日：2001-12-28
Applicant: 삼성전기주식회사
IPC: H05K3/18
CPC classification number: H05K3/181 , H05K2203/072
Abstract: PURPOSE: A method is provided to easily perform a copper plating work at a build-up substrate using a photosensitive insulating resin and obtaining a uniform current distribution without installing a separate plating line. CONSTITUTION: When patterning an insulating resin substrate(10) so as to form a product sheet where an inner circuit is formed at the insulating resin substrate and a concave part formed between an outer part of the substrate and each product sheet, an inner-layer circuit is formed by making a copper connection part remain at a predetermined position so that the outer part and the product sheet part are connected. An insulating layer(30) is stacked and an inner-layer penetration hole is formed. A non-electrolytic copper plating(40) is performed at the substrate to form a plating layer.
Abstract translation: 目的：提供一种使用感光绝缘树脂容易地在积层基板上执行铜电镀工作的方法，并且在不安装单独的电镀线的情况下获得均匀的电流分布。 构成：在图案化绝缘树脂基板（10）时，形成在绝缘性树脂基板上形成有内部电路的产品片和形成在基板的外部与各产品片之间的凹部，内层 电路通过使铜连接部分保持在预定位置而形成，使得外部部分和产品片部分连接。 层叠绝缘层（30），形成内层贯通孔。 在基板上进行非电解镀铜（40），形成镀层。
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公开(公告)号：KR100372688B1
公开(公告)日：2003-02-19
申请号：KR1020000050473
申请日：2000-08-29
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: PURPOSE: A method for manufacturing a printed circuit multi layer board is provided to make work process simple by filling a conductive paste into a via holes and a through hole using a screen print. CONSTITUTION: A coating layer is formed on an insulation layer(100) and an etching process is performed thereon to form an electrodes(120) having constant patterns. An epoxy layer(130) is formed at the upper and lower side of the insulation layer(100) and a via hole for connecting interlayer electrodes and a through hole(160) penetrating the board(150) are formed on the epoxy layer(130) by mechanical machining. A conductive paste(170) is filled into the via hole and the through hole by a screen print. A coating layer is formed at the upper side of the epoxy layer(130) and an etching process is performed thereon to form an electrodes(120a) having constant patterns. A second epoxy layer(130a) is formed at the upper and lower side of the epoxy layer(130) and a via hole(140a) for connecting interlayer electrodes and a through hole(160a) penetrating the board(150) are formed on the epoxy layer(130) by mechanical machining. A conductive paste(170a) is filled into the via hole and the through hole by a screen print. A coating layer is formed at the upper side of the epoxy layer(130a) and an etching process is performed thereon to form an electrodes(120b) having constant patterns.
Abstract translation: 目的：提供一种用于制造印刷电路多层板的方法，通过使用丝网印刷将导电膏填充到通孔和通孔中来使工作过程简单。 构成：在绝缘层（100）上形成涂层，并在其上进行蚀刻处理以形成具有恒定图案的电极（120）。 在绝缘层（100）的上侧和下侧形成环氧树脂层（130），并且在环氧树脂层（130）上形成用于连接层间电极的通孔和穿透板（150）的通孔（160） ）通过机械加工。 导电糊（170）通过丝网印刷填充到通孔和通孔中。 在环氧树脂层（130）的上侧形成涂层并在其上进行蚀刻处理以形成具有恒定图案的电极（120a）。 第二环氧树脂层130a形成在环氧树脂层130的上侧和下侧，并且用于连接层间电极的通孔140a和穿过基板150的通孔160a形成在 环氧树脂层（130）通过机械加工。 通过丝网印刷将导电膏（170a）填充到通孔和通孔中。 在环氧树脂层（130a）的上侧形成涂层，并在其上进行蚀刻处理以形成具有恒定图案的电极（120b）。
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公开(公告)号：KR1020160086181A
公开(公告)日：2016-07-19
申请号：KR1020150003598
申请日：2015-01-09
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4697 , H05K1/113 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/0011 , H05K3/3436 , H05K3/4007 , H05K3/4038 , H05K2201/10 , H05K1/182 , H01L23/12 , H05K1/0298 , H05K3/42 , H05K3/4626
Abstract: 본발명은인쇄회로기판, 패키지및 그제조방법에관한것이다. 보다구체적으로, 본발명의실시예에따른인쇄회로기판은제1 면에소자실장부와비실장부를포함하는코어기판, 코어기판의비실장부에형성된절연층, 절연층상에형성된동박적층판및 절연층및 동박적층판을관통하는제1 관통비아를포함하며, 제1 관통비아는코어기판내에형성된제2 관통비아와연결되도록형성된다.
Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及印刷电路板，封装及其制造方法。 更具体地，根据本发明的实施例，印刷电路板包括：芯基板，其具有在第一表面上的元件安装单元和非安装单元; 绝缘层，形成在所述芯基板的非安装单元上; 形成在绝缘层上的铜箔堆叠层; 以及穿过绝缘层和铜箔堆叠层的第一穿透，其中第一穿透通孔被配置为连接到形成在芯基板内部的第二穿透通孔。 本发明提供一种使翘曲最小化的印刷电路板。
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