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    스티프너를 이용한 박형 인쇄회로기판 및 그 제조방법
    3.
    发明授权
    스티프너를 이용한 박형 인쇄회로기판 및 그 제조방법 有权
    薄印刷电路板使用强化剂及其制造方法

    公开(公告)号：KR100671748B1

    公开(公告)日：2007-01-22

    申请号：KR1020050091466

    申请日：2005-09-29

    Applicant: 삼성전기주식회사

    Inventor： 고경환 ,  조순진

    IPC: H05K1/02

    CPC classification number: H05K1/0271 ,  H05K3/4038 ,  H05K7/1461

    Abstract: A thin printed circuit board using a stiffener and a fabrication method thereof are provided to prevent the bending of the board by attaching the stiffener on the board. In a thin printed circuit board, a core substrate(11) has a circuit in an inner layer or an outer layer. An electronic component is attached to a top plane or a bottom plane of the core substrate. A stiffener(20) is attached to the side of the core substrate, and prevents the bending of the core substrate. The electronic component is an integrated circuit chip(12) or a passive device component(13).

    Abstract translation: 提供使用加强件的薄印刷电路板及其制造方法，以通过将加强件附接在基板上来防止板的弯曲。 在薄的印刷电路板中，芯基板（11）在内层或外层具有电路。 电子部件附接到芯基板的顶平面或底平面。 加强件（20）附接到芯基板的侧面，并且防止芯基板的弯曲。 电子部件是集成电路芯片（12）或无源器件部件（13）。

    빌드업 다층 인쇄회로기판의 제조방법
    4.
    发明公开
    빌드업 다층 인쇄회로기판의 제조방법 失效
    制造多层印刷电路板的方法

    公开(公告)号：KR1020030056822A

    公开(公告)日：2003-07-04

    申请号：KR1020010087124

    申请日：2001-12-28

    Applicant: 삼성전기주식회사

    Inventor： 송창규 ,  강장규 ,  이존태 ,  고경환

    IPC: H05K3/46

    CPC classification number: H05K3/4652 ,  H05K3/0026 ,  H05K3/28 ,  H05K3/429

    Abstract: PURPOSE: A method is provided to be capable of forming a via hole of 70 to 80 percentages as compared with a conventional via hole without an additional laser processor. CONSTITUTION: A circuit pattern is formed on a copper stack plate, and insulation layers having a cover layer are stacked on upper and lower parts of the copper stack plate where the circuit pattern is formed. A via hole is formed by irradiating CO2 lasers at the stack plate to remove the insulation layers. The cover layers for surrounding the insulation layers are removed. Plating is performed at the stack plate to form a plating layer.

    Abstract translation: 目的：与常规通孔相比，提供了一种能够形成70至80个百分比通孔的方法，而没有附加的激光处理器。 构成：在铜叠层板上形成电路图案，并且在形成电路图案的铜叠板的上部和下部堆叠具有覆盖层的绝缘层。 通过在堆叠板处照射CO 2激光器以去除绝缘层来形成通孔。 用于围绕绝缘层的覆盖层被去除。 在堆叠板上进行电镀以形成镀层。

    인쇄회로다층기판의 제조방법
    5.
    发明公开
    인쇄회로다층기판의 제조방법 无效
    制造印刷电路多层板的方法

    公开(公告)号：KR1020020017252A

    公开(公告)日：2002-03-07

    申请号：KR1020000050464

    申请日：2000-08-29

    Applicant: 삼성전기주식회사

    Inventor： 탁철 ,  김원회 ,  강장규 ,  송창규 ,  고경환

    IPC: H05K3/46

    CPC classification number: H05K3/4652 ,  H05K3/429 ,  H05K3/4688

    Abstract: PURPOSE: A method for manufacturing a printed circuit multi layer board is provided to achieve an improved capacitance by fined line width, while prevent a short or circuit open due to the contact with an alien substance in advance. CONSTITUTION: A coating layer is formed at the upper and lower side of an insulation layer(100) attached to the grid shape fiber by a screen print. An electrode(120) is formed on the insulation layer(100) by etching the coating layer using etching solution. A resin layer(130) is formed on the insulation layer(100) by a screen print and a via hole(140) and a through hole(150) are formed thereon. A coating layer is formed at the upper side of the resin layer(130) by a screen print and an electrode(120a) is formed by etching the coating layer. A resin layer(170) is formed with one body at the upper side of the resin layer(130) by coating the resin. A via hole(140a) and a through hole(150a) are formed on the resin layer(170) by mechanical machining and a coating layer is coated thereon with one body to form an electrode(120b) by etching the coating layer.

    Abstract translation: 目的：提供一种制造印刷电路多层板的方法，以通过罚款线宽实现改善的电容，同时防止由于预先与外来物质接触而导致短路或电路断开。 构成：在通过丝网印刷附着在格子状纤维上的绝缘层（100）的上侧和下侧形成涂层。 通过使用蚀刻溶液蚀刻涂层，在绝缘层（100）上形成电极（120）。 通过丝网印刷在绝缘层（100）上形成树脂层（130），并且在其上形成通孔（140）和通孔（150）。 通过丝网印刷在树脂层（130）的上侧形成涂层，通过蚀刻涂层形成电极（120a）。 树脂层（170）通过涂覆树脂在树脂层（130）的上侧形成有一个主体。 通过机械加工在树脂层（170）上形成通孔（140a）和通孔（150a），并在其上涂覆一层涂层，通过蚀刻涂层形成电极（120b）。

    인쇄회로기판 및 인쇄회로기판의 제조 방법
    7.
    发明公开
    인쇄회로기판 및 인쇄회로기판의 제조 방법 审中-实审
    印刷电路板及其制造方法

    公开(公告)号：KR1020160149613A

    公开(公告)日：2016-12-28

    申请号：KR1020150086884

    申请日：2015-06-18

    Applicant: 삼성전기주식회사

    Inventor： 이재언 ,  목지수 ,  고영관 ,  정순오 ,  고경환 ,  백용호

    IPC: H05K1/18 ,  H05K3/46 ,  H05K3/28

    CPC classification number: H05K3/4697 ,  H05K3/282 ,  H05K3/4007 ,  H05K3/4644 ,  H05K3/4673

    Abstract: 본발명은인쇄회로기판및 인쇄회로기판의제조방법에관한것이다. 본발명의일 실시예에따르면, 제1 절연층, 제1 절연층상부에형성되는제1 회로층, 제1 절연층상부에형성되는제2 절연층, 제2 절연층상부에형성되며감광성재질로형성되는제2 회로층및 제2 절연층상부에형성되어제2 회로층을감싸보호하는보호층을포함하되, 보호층은관통형상의캐비티를포함하며, 제2 회로층의일부를외부로노출하도록형성되며, 제2 절연층은캐비티하부에위치한제1 회로층을외부로노출하도록형성된인쇄회로기판이제공된다.

    Abstract translation: 印刷电路板包括：第一绝缘层; 设置在所述第一绝缘层上方的第一电路层; 设置在所述第一绝缘层上方的第二绝缘层; 第二电路层，设置在所述第二绝缘层的上方并由感光材料构成; 以及保护层，其设置在所述第二绝缘层的上方并且围绕所述第二电路层，其中所述保护层包括隧道型腔并将所述第二电路层的一部分暴露于外部环境，并且其中所述第二绝缘层暴露出所述第二绝缘层的一部分 第一电路层位于空腔下面到外部环境。

    임베디드 기판 및 임베디드 기판의 제조 방법
    9.
    发明公开
    임베디드 기판 및 임베디드 기판의 제조 방법 无效
    嵌入式板和SMAE的制造方法

    公开(公告)号：KR1020160016494A

    公开(公告)日：2016-02-15

    申请号：KR1020140162759

    申请日：2014-11-20

    Applicant: 삼성전기주식회사

    Inventor： 이재언 ,  목지수 ,  고영관 ,  고경환 ,  백용호

    IPC: H05K3/46 ,  H05K1/18

    CPC classification number: H05K3/46 ,  H01L23/12 ,  H01L23/48 ,  H05K1/0271 ,  H05K1/18

    Abstract: 본발명은임베디드기판및 임베디드기판의제조방법에관한것이다. 본발명의실시예에따르면임베디드기판은하부에실장패드가형성된코어기판, 코어기판하부에형성되며, 제1 캐비티가형성된제1 기판및 제1 기판하부에형성되며, 제2 캐비티가형성된제2 기판을포함하며, 제1 캐비티와제2 캐비티는서로연결되며실장패드를외부로노출하도록형성된다.

    Abstract translation: 本发明涉及嵌入式电路板及其制造方法。 根据本发明实施例的嵌入式板包括在下部形成安装焊盘的芯板，形成在芯板的下部并具有第一腔的第一板和第二板 其形成在第一板的下部并具有第二腔。 第一腔和第二腔彼此连接并暴露安装垫。

    필름형태의 절연재를 적층하는 방법
    10.
    发明公开
    필름형태의 절연재를 적층하는 방법 无效
    电影绝缘材料堆叠方法

    公开(公告)号：KR1020030056819A

    公开(公告)日：2003-07-04

    申请号：KR1020010087121

    申请日：2001-12-28

    Applicant: 삼성전기주식회사

    Inventor： 이존태 ,  강장규 ,  고경환 ,  송창규

    IPC: H05K3/28

    CPC classification number: H05K3/0011

    Abstract: PURPOSE: A method is provided to be capable of improving a product reliability and a variation of an insulating distance by using an insulating material of a film type when forming an insulation layer. CONSTITUTION: An insulating material of a film type is placed and attached at upper and lower parts of a substrate. A resultant structure is put under vacuum so as to remove air between the insulating material and the substrate. A first press process is performed at a vacuum state. A second press process is carried out to minimize a variation of an insulating distance and level a surface of the insulating material. The vacuum is maintained during 30 to 50 seconds. Temperature and pressure conditions of the first press process are 90-100°C and 0.2-0.4MPa, and temperature and pressure conditions of the second press process are 80-100°C and 2-4MPa.

    Abstract translation: 目的：提供一种能够通过在形成绝缘层时使用膜型绝缘材料来提高产品可靠性和绝缘距离的变化的方法。 构成：将薄膜类型的绝缘材料放置并附着在基板的上部和下部。 将所得结构置于真空下，以除去绝缘材料和基底之间的空气。 在真空状态下进行第一压制处理。 执行第二压制过程以最小化绝缘距离的变化并使绝缘材料的表面水平。 在30至50秒内保持真空。 第一次压制工艺的温度和压力条件为90-100℃和0.2-0.4MPa，第二次压制过程的温度和压力条件为80-100℃和2-4MPa。

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