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公开(公告)号：KR1020000040802A
公开(公告)日：2000-07-05
申请号：KR1019980056529
申请日：1998-12-19
Applicant: 삼성전기주식회사
IPC: H01F1/00
Abstract: PURPOSE: A complex material is provided to obtain a high capacitance in the thickness of a printed layer by mixing a ferrite and a piezoelectric material. CONSTITUTION: A ferrite and a piezoelectric material is mixed. By mixing the ferrite and the piezoelectric material, a complex material for a device which has an excellent magnetic characteristics. According to the complex material for a device which has an excellent magnetic characteristics, a high capacitance in the thickness of a printed layer is obtained by mixing a ferrite and a piezoelectric material.
Abstract translation: 目的：通过混合铁氧体和压电材料，提供复合材料以获得印刷层厚度的高电容。 构成：混合铁素体和压电材料。 通过混合铁氧体和压电材料，可以获得具有优异磁特性的器件的复合材料。 根据具有优异磁特性的器件的复合材料，通过混合铁氧体和压电材料获得印刷层厚度的高电容。
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公开(公告)号：KR1019990048047A
公开(公告)日：1999-07-05
申请号：KR1019970066648
申请日：1997-12-08
Applicant: 삼성전기주식회사
Inventor： 이대형
IPC: H01F27/00
Abstract: 본 발명의 칩인덕터는 약 10장의 캐스팅시트가 합착된 베이스시트와, 베이스시트 위에 형성된 전극과, 베이스시트 위에 형성된 홀을 보유하는 자성체층과, 자성체층 위에 형성되어 홀을 통해 베이스시트 위의 자석과 접속되는 전극과, 자성체층 위에 형성되어 전극에 의한 단차를 제거하는 복수의 층간 자성체층 또는 캐스팅시트로 이루어진 중간층과, 중간층 위에 합착된 약 10장의 캐스팅시트로 이루어진 커버시트로 구성된다. 자성체층과 자석은 N번 적층되어 자석이 N/2회의 권선을 이루는 나선형상을 이룬다.
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公开(公告)号：KR1020130007321A
公开(公告)日：2013-01-18
申请号：KR1020110065187
申请日：2011-06-30
Applicant: 삼성전기주식회사
CPC classification number: H01L23/15 , B32B18/00 , B82Y30/00 , C04B37/006 , C04B2235/408 , C04B2235/616 , C04B2237/125 , C04B2237/32 , C04B2237/562 , C04B2237/62 , H01L21/4857 , H01L2924/0002 , H05K1/113 , H05K3/4061 , H05K3/4629 , H05K2203/025 , H05K2203/072 , H01L2924/00
Abstract: PURPOSE: A multilayer ceramic substrate and a manufacturing method thereof are provided to prevent the degradation of bonding strength between an external electrode and a ceramic laminated body through a via void. CONSTITUTION: A multilayer ceramic substrate(100) includes a ceramic laminated body(110) and an outer electrode(135). The ceramic laminated body includes a plurality of ceramic layers(112,114). First and second vias(122,124) are included in conductive material. Each ceramic layer is electrically connected by the first and second via. The first via is filled in a hole to penetrate surface ceramics. The second via is filled in a hole to be penetrate the ceramic.
Abstract translation: 目的：提供一种多层陶瓷基板及其制造方法，以防止外部电极与陶瓷层叠体之间的通孔通孔的接合强度降低。 构成：多层陶瓷基板（100）包括陶瓷层叠体（110）和外部电极（135）。 陶瓷层叠体包括多个陶瓷层（112,114）。 第一和第二通孔（122,124）被包括在导电材料中。 每个陶瓷层通过第一和第二通孔电连接。 第一个通孔填充在孔中以穿透表面陶瓷。 第二个通孔被填入一个洞，以穿透陶瓷。
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公开(公告)号：KR101089936B1
公开(公告)日：2011-12-05
申请号：KR1020100003167
申请日：2010-01-13
Applicant: 삼성전기주식회사
IPC: H05K3/46
CPC classification number: H05K3/4629 , C04B37/001 , C04B2237/64 , H05K3/107
Abstract: 본 발명의 일 측면은, 복수의 세라믹 그린 시트를 마련하는 단계와, 상기 복수의 세라믹 그린 시트 중 적어도 하나의 세라믹 그린 시트에 원하는 라인형상의 홈부와 상기 홈부에 연결된 비아홀을 형성하는 단계와, 상기 비아홀을 도전성 물질로 충전시켜 도전성 비아를 형성하는 단계와, 상기 홈부를 도전성 물질로 충전시켜 상기 도전성 비아에 연결된 회로라인을 형성하는 단계와, 상기 복수의 세라믹 그린시트를 적층하여 세라믹 그린시트 적층체를 형성하는 단계와, 상기 세라믹 그린시트 적층체를 소결하는 단계를 포함하는 다층 세라믹 회로 기판 제조방법을 제공한다.
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公开(公告)号：KR1020110107593A
公开(公告)日：2011-10-04
申请号：KR1020100026803
申请日：2010-03-25
Applicant: 삼성전기주식회사
CPC classification number: F27B21/04 , C04B35/64 , F27D1/0006 , F27D1/0043
Abstract: 본 발명의 일 실시예에 따르면, 본 발명은 내부에 단열재가 내입된 노 본체, 상기 노 본체의 내부에 배치되며, 세라믹 성형체가 상부에 적재된 세터, 상기 단열재의 상부에 배치되는 배기구, 상기 세라믹 성형체 주위에 적어도 하나 배치된 발열체 및 상기 노 본체의 내부가 균일한 온도 구배를 유지하도록 상기 세라믹 성형체 주위에 적어도 하나 배치되는 금속, 합금, 산화물 및 질화물 중에서 선택되는 적어도 하나로 이루어진 메쉬를 포함하는 세라믹 제품용 소성로 및 이를 이용한 소성방법을 제공한다.
본 발명의 실시예에 따르면, 소성로 내부의 온도편차를 최소화함으로써 소성시 온도구배차에 의한 세라믹 재품의 특성 변화를 방지할 수 있는 세라믹 제품용 소성로 및 이를 이용한 소성방법을 제공할 수 있다.Abstract translation: 要解决的问题：提供一种用于陶瓷制品的烘烤炉和使用其的烘烤方法。该方法：陶瓷制品的烘烤炉包括一个包含绝热材料的炉体; 设置在炉体内部并具有置于其上部的陶瓷模制件的固定器; 布置在绝热材料的上部的排气口; 布置在所述陶瓷模制件周围的至少一个加热元件; 以及至少一个布置在所述陶瓷模制件周围的网，使得所述炉体的内部保持均匀的温度梯度，所述网由选自金属，合金，氧化物和氮化物中的至少一种构成。 烘焙方法使用这种烤炉。 根据这些炉子和方法，可以通过使焙烧炉内的温度梯度最小化来防止由于烘烤中的温度梯度的差异导致的陶瓷制品的特性变化。
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Patent Agency Ranking
公开(公告)号：KR1020100109651A
公开(公告)日：2010-10-11
申请号：KR1020090028009
申请日：2009-04-01
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0201 , H01C1/148 , H01C7/003 , H05K1/0306 , H05K1/167 , H05K2201/066 , H05K2201/09909 , Y10T156/10
Abstract: PURPOSE: A circuit board module and a manufacturing method thereof are provided to prevent a short-circuit between a resistor mounted on a circuit board and a heat dissipation member by selectively forming an adhesive member. CONSTITUTION: A register(30) is arranged on a circuit board(10). A pad(20) covers the lateral edge of both sides of the register. An adhesive member(60a), which is consisted of an electrical insulation material, is formed on the partial region of the register and the pad. A heat-sink(70) is arranged on the register. The heat-sink is welded with the pad with the adhesive member. An insulating layer(40) is formed in a region except for the pad among the region of the circuit board. The insulating layer can be formed on the upper side of the register.
Abstract translation: 目的：提供一种电路板模块及其制造方法，以通过选择性地形成粘合构件来防止安装在电路板上的电阻与散热构件之间的短路。 构成：在电路板（10）上布置一个寄存器（30）。 垫（20）覆盖寄存器两侧的侧边缘。 在寄存器和垫的部分区域上形成由电绝缘材料构成的粘合构件（60a）。 散热器（70）布置在寄存器上。 散热器与焊盘与粘合部件焊接。 绝缘层（40）形成在除了电路板的区域内的焊盘之外的区域中。 绝缘层可以形成在寄存器的上侧。
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公开(公告)号：KR1020040025266A
公开(公告)日：2004-03-24
申请号：KR1020020057147
申请日：2002-09-19
Applicant: 삼성전기주식회사
IPC: H03H9/00
CPC classification number: H01P1/20345 , H01G4/40 , H01P1/2088 , H03H7/1775
Abstract: PURPOSE: A multilayer LC filter is provided to prevent a cambering phenomenon and a blistering phenomenon due to the stress between a dielectric layer and a magnetic layer by using a buffer layer including Ba-Nd-Ti-based material, Ni-Zn-Cu-Fe-based material, and Bi-based glass material of 5 to 10 weight percent. CONSTITUTION: A multilayer LC filter includes a stacked body, which is formed with one or more dielectric layers(30b,30c) and one or more magnetic layers(30a,30d). The dielectric layers(30b,30c) and the magnetic layers(30a,30d) include predetermined conductive patterns for forming capacitor elements and inductor elements. The dielectric layers(30b,30c) are formed with Ba-Nd-Ti-based materials. The magnetic layers(30a,30d) are formed with Ni-Zn-Cu-Fe-based materials. A buffer layer including Ba-Nd-Ti-based material, Ni-Zn-Cu-Fe-based material, and Bi-based glass material of 5 to 10 weight percent is formed between the dielectric layers(30b,30c) and the magnetic layers(30a,30d).
Abstract translation: 目的：提供一种多层LC滤波器，通过使用包括Ba-Nd-Ti基材料，Ni-Zn-Cu-基材料的缓冲层，防止介电层和磁性层之间的应力引起的弯曲现象和起泡现象， Fe基材料和5至10重量％的Bi基玻璃材料。 构成：多层LC滤波器包括由一个或多个电介质层（30b，30c）和一个或多个磁性层（30a，30d）形成的层叠体。 电介质层（30b，30c）和磁性层（30a，30d）包括用于形成电容器元件和电感器元件的预定导电图案。 电介质层（30b，30c）由Ba-Nd-Ti基材料形成。 磁性层（30a，30d）由Ni-Zn-Cu-Fe系材料形成。 在电介质层（30b，30c）和磁性体之间形成有包含Ba-Nd-Ti系材料，Ni-Zn-Cu-Fe系材料和5〜10重量％Bi系玻璃材料的缓冲层 层（30A，30D）。
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公开(公告)号：KR1020020049189A
公开(公告)日：2002-06-26
申请号：KR1020000078295
申请日：2000-12-19
Applicant: 삼성전기주식회사
IPC: H01F27/28
Abstract: PURPOSE: A chip inductor in which a plurality of coil are formed is provided to achieve a small size chip inductor by forming the chip inductor having a 1/2 pattern in a second region of a plurality of magnetic material layer. CONSTITUTION: A plurality of magnetic material layer(1a-1e) are respectively divided into a plurality of region. The plurality of magnetic material layer(1a-1e) have a cover sheet(12) and a plurality of casting sheet. A plurality of pattern(2a1-2e1,2a2-2e2) are formed through a 1/2 wound coil in each region of each magnetic material layer(1a-1e). The plurality of pattern(2a1-2e1,2a2-2e2) contact with a neighboring layer to form a one wound coil. An input/output terminal is formed outside the plurality of magnetic material layer(1a-1e).
Abstract translation: 目的：提供形成多个线圈的芯片电感器，以在多个磁性材料层的第二区域中形成具有1/2图案的芯片电感器来实现小尺寸芯片电感器。 构成：将多个磁性体层（1a-1e）分别分割为多个区域。 多个磁性体层（1a-1e）具有覆盖片（12）和多个铸片。 通过每个磁性材料层（1a-1e）的每个区域中的1/2绕组线圈形成多个图案（2a1-2e1,2a2-2e2）。 多个图案（2a1-2e1,2a2-2e2）与相邻层接触以形成一个缠绕线圈。 在多个磁性体层（1a-1e）的外部形成有输入输出端子。
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公开(公告)号：KR1020000040803A
公开(公告)日：2000-07-05
申请号：KR1019980056530
申请日：1998-12-19
Applicant: 삼성전기주식회사
IPC: H03H7/075
CPC classification number: H01P1/20345 , H01G4/28 , H01G4/40 , H03H9/46
Abstract: PURPOSE: A composite material for an IC and a method for fabricating EMI(Electro-Magnetic Interference) LC filter using thereof are provided to form and sinter electrodes under the temperature lower than the prior plasticized temperature CONSTITUTION: A composite material for an IC comprises 20-80 wt% Ni-Zn ferrite or Ni-Zn-Cu ferrite, 20-80 wt% dielectric material and glass having 10-30 wt% ratio to the ferrite and dielectric material. The method for fabricating EMI(Electro-Magnetic Interference) LC filter comprises steps of: mixing 20-80 wt% Ni-Zn ferrite or Ni-Zn-Cu ferrite, 20-80 wt% dielectric material and glass having 10-30 wt% ratio to the ferrite and dielectric material, adding binder to the mixture to fabricate it in sheet shape; punching holes suitable to desired pattern and printing, then stacking them; sintering under the temperature higher than 850°C.
Abstract translation: 目的：提供用于IC的复合材料和使用其的EMI（电磁干扰）LC滤波器的制造方法，以在低于现有塑化温度的温度下形成和烧结电极。用于IC的复合材料包括20 -80重量％的Ni-Zn铁氧体或Ni-Zn-Cu铁氧体，20-80重量％的介电材料和与铁素体和介电材料的比例为10-30重量％的玻璃。 制造EMI（电磁干扰）LC滤波器的方法包括以下步骤：将20-80重量％的Ni-Zn铁氧体或Ni-Zn-Cu铁氧体，20-80重量％的电介质材料和10-30重量％ 与铁素体和介电材料的比例，向混合物中加入粘合剂以将其制成片状; 冲孔适合所需的图案和印刷，然后堆叠; 在高于850℃的温度下烧结。
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公开(公告)号：KR1020000018655A
公开(公告)日：2000-04-06
申请号：KR1019980036331
申请日：1998-09-03
Applicant: 삼성전기주식회사
IPC: H01F17/00
Abstract: PURPOSE: A composite material for a chip inductor is provided to supply a composite material adapted to elements of a chip inductor used in a frequency band between an existing chip inductor with a magnetic material and a chip inductor with a low dielectric constant material. CONSTITUTION: A composite material for a chip inductor relates to a composite material obtained by mixing a magnetic material with a spinel structure and a non-magnetic material according to a constant ratio. The composite material is formed by containing a dielectric material of 20-40wt% to a ferrite of Ni-Zn series or a ferrite of Ni-Zn-Cu series. the dielectric material contained in the ferrite is BaTiO3 of 20-30wt% or Al2O3 of 30-40wt%.
Abstract translation: 目的：提供一种用于芯片电感器的复合材料，以提供适合于在具有磁性材料的现有芯片电感器和具有低介电常数材料的芯片电感器之间的频带中使用的芯片电感器的元件的复合材料。 构成：芯片电感用复合材料涉及通过以恒定比例将磁性材料与尖晶石结构和非磁性材料混合而获得的复合材料。 复合材料通过含有Ni-Zn系铁氧体或Ni-Zn-Cu系铁氧体的20-40重量％的电介质材料而形成。 铁素体中所含的电介质材料为BaTiO3为20-30wt％或Al2O3为30-40wt％。
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