Abstract:
PURPOSE: A robot blade for fabricating a semiconductor device is provided to precisely and stably transfer a wafer without a slip of the wafer by including a rubber material which has friction force against the surface of the wafer. CONSTITUTION: Projections(110) are formed at both ends of a plate(102) to prevent the wafer from being separated. A supporting surface(104) is formed on the plate. A groove(106) is formed in the supporting surface. A member(108) has friction force against the surface of the wafer, inserted into the groove and protruding to the upper portion of the supporting surface.
Abstract:
PURPOSE: An input buffer is provided to use an input buffer by selecting the kind of the input buffer by merging two kinds of input buffers and to be operated with a HSTL input buffer or an LVTTL input buffer. CONSTITUTION: The input buffer includes a control circuit(30), a PMOS transistor(P20) and CMOS transmission gates(T1,T2). The control circuit(30) is composed of inverters(I18,I19,I20), a NOR gate(NOR) and a NAND gate(NAND). The CMOS transmission gate(T1) is connected between an inverter(I6) and an inverter(I10) and the CMOS transmission gate(T2) is connected to an inverter(I1) and an inverter(I10). The gate signal(PDOWNB) is permitted to the PMOS transistor(P20) and the power voltage is permitted to the source and the drain is connected to the output step of the CMOS transmission gate(T1). The output signal of the NAND gate(NAND) and the inverter(I19) is permitted to the CMOS transmission gate(T1) and the output signal of the NOR gate(NOR) and the inverter(I18) is permitted to the CMOS transmission gate(T2).
Abstract:
PURPOSE: A method for removing particles of a load-lock chamber is provided to collect particles by installing a particle support plate to a load-lock chamber. CONSTITUTION: A particle support plate formed with a multitude of mesh of a constant thickness is installed on a bottom portion of a load-lock chamber. The particles laminated on the particle support plate are removed according to a constant period after operating the load-lock chamber. The particle support plate is formed with a conductive material. The particles are collected with static electricity by applying the voltage to the particle support plate. The thickness of the mesh of the particle support plate is more than a mesh period.
Abstract:
식각제로 이용되는 가스에 내식성이 강한 물질로 구성 부품, 예컨대 플래퍼 또는 섀프트를 구비한 반도체 식각장치에 사용되는 쓰로트 밸브(throttle valve)에 관하여 개시한다. 반도체 식각장치의 쓰로트 밸브는 그 개폐수단으로서, 식각장치 내부에서 사용되는 가스에 대한 내식성이 강한 물질을 이용하여 형성된 플래퍼; 및 상기 플래퍼에 삽입되는 섀프트를 포함하여 구비한다. 이때, 플래퍼는 브롬화수소 및 염소에 대한 내식성이 강한 물질로 이루어지며, 이를 위하여 플래퍼는 애노다이즈된 알루미늄으로 이루어지는 것이 바람직하다. 한편, 상기 애노다이즈된 알루미늄은 알루미늄 합금, 예컨대 2024 알루미늄에 대하여 애노다이즈된 코팅을 하여 이용할 수 있다.
Abstract:
PURPOSE: A dry etching apparatus for chemically and physically removing layers to be etched by using a plasma state of reactant gas is provided to prevent failures and drawbacks caused by a slit port liner and an EPD port liner projected from a chamber wall. CONSTITUTION: The dry etching apparatus(10) has the chamber wall(13) forming a chamber(11) used for wafer fabrication. And, the apparatus(10) has the slit port liner(33), the EPD port liner(37) and a chamber wall liner(41), all joined to the chamber wall(13). Particularly, the slit port liner(33) and the EPD port liner(37) are inserted in respective corresponding grooves(32,36) formed in the chamber wall(13), and the chamber wall liner(41) is directly attached to an inner surface of the chamber wall(13) without a gap therebetween.