-
公开(公告)号：KR1020080084145A
公开(公告)日：2008-09-19
申请号：KR1020070025446
申请日：2007-03-15
Applicant: 삼성전자주식회사
IPC: H01L21/20 , H01L21/205
CPC classification number: C23C16/4412 , H01L21/67242
Abstract: A vapor deposition apparatus of semiconductor fabricating equipment is provided to exhaust waste gas while maintaining a vacuum state of the inside of a chamber by driving a switch valve in a manner that a main pump is stopped and a sub pump is automatically operated. Reaction gas is injected into a chamber(110). A main pipe(120) is connected to the chamber. A main pump(130) vacuums the inside of the chamber, connected to the main pipe in a manner that exhausts the waste gas in the chamber to the outside of the chamber. A sub pump(150) is installed in a detour pipe(140) connected to the main pipe. A switch valve(160) is installed in the detour pipe. A control part(170) controls the switch operation to the sub pump when the main pump operates abnormally. The sub pump can be installed in the case of the main pump.
Abstract translation: 提供一种半导体制造设备的气相沉积设备，用于通过以主泵停止并且副泵自动操作的方式驱动开关阀来维持室内的真空状态来排出废气。 将反应气体注入室（110）。 主管（120）连接到腔室。 主泵（130）以将粪便中的废气排出到室的外部的方式抽吸室内部，连接到主管。 副泵（150）安装在与主管连接的迂回管（140）中。 切换阀（160）安装在迂回管中。 当主泵异常运行时，控制部分（170）控制副泵的开关操作。 副泵可以安装在主泵的情况下。
-
公开(公告)号：KR1020070049458A
公开(公告)日：2007-05-11
申请号：KR1020050106614
申请日：2005-11-08
Applicant: 삼성전자주식회사
IPC: H01L21/304
Abstract: 본 발명은 자연산화막을 제거하기 위한 플라즈마 세정을 위한 공정 챔버 내부의 온도를 모니터링하는 반도체 제조 설비에 관한 것이다. 반도체 제조 설비는 PNC(Plasma Native Oxide Cleaning) 공정을 처리하는 플라즈마 세정 설비로, 공정 챔버 내부 일측에 내부 열전대를 구비하고, 공정 챔버 외부 일측에 외부 열전대를 구비한다. 내부 열전대는 공정 챔버 내벽과 배기부 사이의 일정 온도로 유지되도록 냉각되는 부위에 구비된다. 따라서 본 발명에 의하면, 내부 열전대를 이용하여 공정 진행 회수에 관계없이 실시간으로 공정 챔버 내부의 온도를 모니터링함으로써, 설비 관리가 용이하여 공정 불량 발생율을 낮출 수 있다.
반도체 제조 설비, 플라즈마, 자연산화막, 세정, 열전대, 온도 모니터링-
公开(公告)号：KR102235521B1
公开(公告)日：2021-04-05
申请号：KR1020150022302
申请日：2015-02-13
Applicant: 삼성전자주식회사
Abstract: 본발명의실시예에따른저장장치는데이터를저장하는메모리장치와, 및데이터스트로브라인및 복수의데이터라인을통해상기메모리장치와연결되는메모리컨트롤러를포함한다. 저장장치는읽기또는쓰기동작시에데이터앞에미리설정된특정패턴을부가하고, 특정패턴다음에입력되는데이터를유효데이터로처리한다. 상기특정패턴은 DQS 레이턴시사이클에맞추어(aligned) 제공된다. 상기메모리컨트롤러는읽기동작시에상기메모리장치로부터입력되는특정패턴을검출하고, 상기검출된특정패턴이내부에저장된특정패턴과일치하는경우에, 상기특정패턴다음에입력되는데이터를유효데이터로처리한다.
-
公开(公告)号：KR1020160087048A
公开(公告)日：2016-07-21
申请号：KR1020150004356
申请日：2015-01-12
Applicant: 삼성전자주식회사
CPC classification number: H01L33/46 , H01L33/486 , H01L33/505 , H01L2224/16225 , H01L2933/0041 , H01L33/50 , H01L33/36 , H01L33/60
Abstract: 본발명은제1면에서적어도일부가노출되는제1 및제2 전극구조를구비하는패키지기판; 상기제1 및제2 전극구조에부착되는제1 및제2 전극을갖는발광다이오드칩; 상기발광다이오드칩과분리되도록상기패키지기판의상기제1면상에배치되며상기발광다이오드칩보다작은두께를갖는반사층; 및상기발광다이오드칩과상기반사층의적어도일부영역을덮는파장변환부를포함하며, 상기파장변환부는, 상기패키지기판의상기제1면과실질적으로평행한상면; 및상기상면을향하여경사진측면을갖는것을특징으로하는발광다이오드패키지를제공한다.
Abstract translation: 本发明提供一种发光二极管封装。 发光二极管封装包括封装衬底，其包括至少部分地暴露在第一表面上的第一和第二电极结构; 发光二极管芯片，其具有附接到第一和第二电极结构的第一电极和第二电极; 反射层，其布置在所述封装基板的与所述发光二极管芯片分离的第一表面上，并且与所述发光二极管芯片相比具有较小的厚度; 以及覆盖反射层和发光二极管芯片的至少一部分的波长转换部。 波长转换部分具有几乎平行于封装基板的第一表面的上表面; 以及面向上表面的倾斜侧表面。 因此，可以提高发光二极管封装的颜色质量。
-
公开(公告)号：KR1020150115473A
公开(公告)日：2015-10-14
申请号：KR1020140040592
申请日：2014-04-04
Applicant: 삼성전자주식회사
IPC: G11C7/22 , G11C11/4076
Abstract: 본발명의실시예에따른메모리컨트롤러는데이터스트로빙을위한클락신호에응답하여, 각각이서로다른듀티비를갖는조절된클락신호들을생성하는듀티비 조절회로와, 선택신호들에응답하여, 상기클락신호와상기조절된클락신호들중에서어느하나를출력클락신호로서메모리장치로출력하는선택회로를포함한다.
Abstract translation: 根据本发明的实施例，存储器控制器包括：占空比控制电路，其对应于用于选通数据的时钟信号，并产生具有相互不同占空比的受控时钟信号; 以及选择电路，其对应于选择信号，并将时钟信号和受控时钟信号中的任一个输出到存储器件作为输出时钟信号。
-
Patent Agency Ranking
公开(公告)号：KR1020130013468A
公开(公告)日：2013-02-06
申请号：KR1020110075141
申请日：2011-07-28
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/52 , H01L33/505 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
Abstract: PURPOSE: A method for manufacturing a light-emitting device is provided to omit the process for forming a wavelength converting part in each module by using a flip chip bonding method. CONSTITUTION: A bonding layer(100) is formed on a substrate(110). Light emitting devices(10) are formed on the bonding layer. A pressing member compresses the light emitting devices to form the same height. A wavelength converting part for covering the light emitting devices is formed on the bonding layer. The pressing member compresses the wavelength converters to planarize the upper surface of the wavelength converters. The bonding layer is separated from the light emitting devices.
Abstract translation: 目的：提供一种制造发光器件的方法，以省略通过使用倒装芯片接合方法在每个模块中形成波长转换部件的工艺。 构成：在基板（110）上形成接合层（100）。 发光器件（10）形成在接合层上。 按压构件压缩发光装置以形成相同的高度。 在接合层上形成用于覆盖发光器件的波长转换部。 压制构件压缩波长转换器以使波长转换器的上表面平坦化。 结合层与发光器件分离。
-
公开(公告)号：KR1020130012818A
公开(公告)日：2013-02-05
申请号：KR1020110074223
申请日：2011-07-26
Applicant: 삼성전자주식회사
Inventor： 유재성
CPC classification number: H01L33/486 , H01L33/54 , H01L2924/0002 , H01L2933/005 , H01L33/48 , H01L33/52 , H01L2924/00
Abstract: PURPOSE: An LED module and a manufacturing method thereof are provided to reduce the cost for a package assembly by forming a lens on a substrate by COB(Chip On Board) method. CONSTITUTION: A substrate(100) is made of metal, silicon or ceramic. An electrode(200) is not overlapped with a groove(110) formed on the substrate. A light emitting device(300) is formed on the electrode by using a bump. A fluorescent material layer(400) includes a host material and an active material. A lens(500) is connected to the substrate through the groove.
Abstract translation: 目的：提供一种LED模块及其制造方法，通过COB（Chip On Board）方法在基板上形成透镜来降低封装组件的成本。 构成：衬底（100）由金属，硅或陶瓷制成。 电极（200）不与形成在基板上的槽（110）重叠。 通过使用凸块在电极上形成发光器件（300）。 荧光材料层（400）包括主体材料和活性材料。 透镜（500）通过凹槽连接到基板。
-
公开(公告)号：KR1020130008900A
公开(公告)日：2013-01-23
申请号：KR1020110069578
申请日：2011-07-13
Applicant: 삼성전자주식회사
CPC classification number: H01L33/505 , H01L33/502 , H01L2933/0041
Abstract: PURPOSE: An apparatus for manufacturing a light emitting diode and a manufacturing method using the same are provided to control the thickness of fluorescent substance and to reduce the color deviation of the light emitting diode. CONSTITUTION: A light emitting device is installed on an adhesive film(20). The adhesive film is arranged on a lower plate mold(10). A medium plate mold(30) is arranged on the adhesive film. A separation mold is arranged in the upper or lower side of the adhesive film. A light emitting device acceptance mold is arranged to the opposite surface of the separation mold.
Abstract translation: 目的：提供一种制造发光二极管的装置及其制造方法，以控制荧光物质的厚度并减少发光二极管的颜色偏差。 构成：将发光装置安装在粘合膜（20）上。 粘合膜设置在下板模具（10）上。 中间板模具（30）布置在粘合膜上。 分离模具布置在粘合膜的上侧或下侧。 发光装置验收模具设置在分离模具的相对表面上。
-
公开(公告)号：KR1020130003835A
公开(公告)日：2013-01-09
申请号：KR1020110065442
申请日：2011-07-01
Applicant: 삼성전자주식회사
Inventor： 유재성
CPC classification number: G03B15/05 , G03B2215/0582 , G03B2215/0592 , H04N5/225 , G03B15/03
Abstract: PURPOSE: A camera flash module is provided to improve productivity not by forming the gap between a lens and a light emitting device. CONSTITUTION: A cavity(110) is formed in a light emitting device package body(100). A light emitting device(200) is mounted on the cavity. A lens(400) is formed on the light emitting device package body. A refracting surface(421) of the lens is curved in the light emitting direction. A reflector(500) is connected to the light emitting device package body. The reflector controls the direction of the light emitted from the lens.
Abstract translation: 目的：提供相机闪光灯模块，以提高生产率，而不是通过在透镜和发光装置之间形成间隙。 构成：在发光器件封装主体（100）中形成空腔（110）。 发光器件（200）安装在腔体上。 在发光器件封装主体上形成透镜（400）。 透镜的折射面（421）在发光方向上弯曲。 反射器（500）连接到发光器件封装主体。 反射器控制从透镜发射的光的方向。
-
20.发明公开
公开(公告)号：KR1020120133264A
公开(公告)日：2012-12-10
申请号：KR1020110051845
申请日：2011-05-31
Applicant: 삼성전자주식회사
IPC: F21V5/04 , H01L33/58 , F21Y101/02
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/50 , H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
Abstract: PURPOSE: A light emitting device lens, a light emitting device module including the same, and a manufacturing method of the light emitting device module using the same are provided to form a florescent substance layer and the lens in a lump by arranging the lens after dispensing the florescent substance layer. CONSTITUTION: A substrate(200) is made of metal, silicon or ceramic. A light emitting device chip(300) is mounted in a cavity(210) of the substrate. A lens is composed of an upper part(110) and a lower part(120). The lens includes a first depression part and a second depression part. A florescent substance layer is formed in the shape having the same radius of curvature as the upper part of the lens.
Abstract translation: 目的：提供一种发光器件透镜，包括该发光器件的发光器件模块以及使用该发光器件模块的发光器件模块的制造方法，以通过在分配之后布置透镜来形成荧光物质层和透镜 荧光物质层。 构成：衬底（200）由金属，硅或陶瓷制成。 发光器件芯片（300）安装在基板的空腔（210）中。 透镜由上部（110）和下部（120）组成。 透镜包括第一凹陷部分和第二凹陷部分。 形成具有与镜片上部相同的曲率半径的形状的荧光物质层。
-
-
-
-
-
-
-
-
-
Search Results
48
records
(took 0.03 seconds)
