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公开(公告)号：KR102252992B1
公开(公告)日：2021-05-20
申请号：KR1020140179326
申请日：2014-12-12
Applicant: 삼성전자주식회사
Inventor： 송종섭
IPC: H01L33/50
Abstract: 본발명은지지기판상에제1 도전형반도체층, 활성층및 제2 도전형반도체층을포함하는복수의발광구조물을배치하는단계; 상기복수의발광구조물상에파장변환물질과유리조성물이함유된혼합물을성형하는단계; 상기혼합물을소결하여파장변환부를형성하는단계; 상기지지기판을제거하는단계; 및상기복수의발광구조물을개별소자단위로절단하는단계를포함하는것을특징으로하는반도체발광소자패키지의제조방법을제공할수 있다.
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公开(公告)号：KR1020170106575A
公开(公告)日：2017-09-21
申请号：KR1020160029453
申请日：2016-03-11
Applicant: 삼성전자주식회사
IPC: F21S10/00 , F21V9/10 , F21V15/01 , F21V7/00 , F21Y101/02
CPC classification number: F21K9/61 , F21K9/27 , F21V3/02 , F21V3/049 , F21V9/00 , F21V15/015 , F21V29/74 , F21V29/77 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , G02B6/00 , H01L33/486 , H01L33/60
Abstract: 본발명의예시적실시예에따른광원모듈은광원, 상기광원상에배치되며, 상면에홈부를구비하는도광판, 및상기도광판의상면에부착되며상기광원의광을부분적으로투과시키고부분적으로반사시키는패턴을가지는필터시트를포함할수 있다.
Abstract translation: 在根据本发明的示例性实施例的光源模块被放置在一个光源，所述光源，连接到光导板，以及具有顶表面上的凹槽的导光板的顶面，以及用于部分地透过的光源的光，并部分地反射 可以包括具有图案的过滤片。
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公开(公告)号：KR1020130039569A
公开(公告)日：2013-04-22
申请号：KR1020110104223
申请日：2011-10-12
Applicant: 삼성전자주식회사
CPC classification number: H01L24/97 , H01L2224/48091 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014
Abstract: PURPOSE: A light emitting device, a manufacturing method thereof, a light emitting device module, and a manufacturing method thereof are provided to improve the adhesion of a preliminary fluorescent substance sheet by forming a first and a second bump on a light emitting device. CONSTITUTION: Light emitting devices(500) are manufactured. A preliminary fluorescent substance sheet(100') is manufactured. The preliminary fluorescent substance sheet includes mounting regions for the light emitting devices. Adhesive is applied to the preliminary fluorescent substance sheet. The light emitting devices are mounted on the mounting regions. The preliminary fluorescent substance sheet having the light emitting devices is divided into chip units.
Abstract translation: 目的：提供一种发光器件及其制造方法，发光器件模块及其制造方法，以通过在发光器件上形成第一和第二凸块来改善预备荧光体片的粘合性。 构成：制造发光器件（500）。 制造初步荧光体片（100'）。 预备荧光物质片包括用于发光器件的安装区域。 将粘合剂施加到预备荧光体片。 发光装置安装在安装区域上。 具有发光装置的初步荧光物质片被分成芯片单元。
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公开(公告)号：KR1020160072340A
公开(公告)日：2016-06-23
申请号：KR1020140179326
申请日：2014-12-12
Applicant: 삼성전자주식회사
Inventor： 송종섭
IPC: H01L33/50
CPC classification number: H01L33/0095 , H01L2933/0041 , H01L33/50 , H01L33/501 , H01L33/502
Abstract: 본발명은지지기판상에제1 도전형반도체층, 활성층및 제2 도전형반도체층을포함하는복수의발광구조물을배치하는단계; 상기복수의발광구조물상에파장변환물질과유리조성물이함유된혼합물을성형하는단계; 상기혼합물을소결하여파장변환부를형성하는단계; 상기지지기판을제거하는단계; 및상기복수의발광구조물을개별소자단위로절단하는단계를포함하는것을특징으로하는반도체발광소자패키지의제조방법을제공할수 있다.
Abstract translation: 本发明提供了一种制造半导体发光器件封装的方法，包括以下步骤：在支撑衬底上布置包括第一导电半导体层，有源层和第二导电半导体层的多个发光结构; 在发光结构上形成含有波长转换材料和玻璃组合物的混合物; 通过烧结混合物形成波长转换单元; 移除支撑基板; 并用单个元件单元切割发光结构。
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Patent Agency Ranking
公开(公告)号：KR1020140102563A
公开(公告)日：2014-08-22
申请号：KR1020130016055
申请日：2013-02-14
Applicant: 삼성전자주식회사
IPC: H01L33/48
CPC classification number: H01L33/486 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/32225
Abstract: A light emitting device package is provided. The light emitting device package comprises: a package substrate including a first conductive layer and a second conductive layer which are spaced apart from each other; and a light emitting element mounted on the package substrate to overlap the first conductive layer with the second conductive layer, wherein a first slit is formed in a portion of the first conductive layer which is not overlapped with the light emitting element.
Abstract translation: 提供发光器件封装。 发光器件封装包括：封装衬底，其包括彼此间隔开的第一导电层和第二导电层; 以及安装在所述封装基板上以与所述第一导电层重叠的发光元件与所述第二导电层，其中在所述第一导电层的不与所述发光元件重叠的部分中形成第一狭缝。
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公开(公告)号：KR1020130013468A
公开(公告)日：2013-02-06
申请号：KR1020110075141
申请日：2011-07-28
Applicant: 삼성전자주식회사
IPC: H01L33/50
CPC classification number: H01L33/52 , H01L33/505 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
Abstract: PURPOSE: A method for manufacturing a light-emitting device is provided to omit the process for forming a wavelength converting part in each module by using a flip chip bonding method. CONSTITUTION: A bonding layer(100) is formed on a substrate(110). Light emitting devices(10) are formed on the bonding layer. A pressing member compresses the light emitting devices to form the same height. A wavelength converting part for covering the light emitting devices is formed on the bonding layer. The pressing member compresses the wavelength converters to planarize the upper surface of the wavelength converters. The bonding layer is separated from the light emitting devices.
Abstract translation: 目的：提供一种制造发光器件的方法，以省略通过使用倒装芯片接合方法在每个模块中形成波长转换部件的工艺。 构成：在基板（110）上形成接合层（100）。 发光器件（10）形成在接合层上。 按压构件压缩发光装置以形成相同的高度。 在接合层上形成用于覆盖发光器件的波长转换部。 压制构件压缩波长转换器以使波长转换器的上表面平坦化。 结合层与发光器件分离。
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公开(公告)号：KR1020130008900A
公开(公告)日：2013-01-23
申请号：KR1020110069578
申请日：2011-07-13
Applicant: 삼성전자주식회사
CPC classification number: H01L33/505 , H01L33/502 , H01L2933/0041
Abstract: PURPOSE: An apparatus for manufacturing a light emitting diode and a manufacturing method using the same are provided to control the thickness of fluorescent substance and to reduce the color deviation of the light emitting diode. CONSTITUTION: A light emitting device is installed on an adhesive film(20). The adhesive film is arranged on a lower plate mold(10). A medium plate mold(30) is arranged on the adhesive film. A separation mold is arranged in the upper or lower side of the adhesive film. A light emitting device acceptance mold is arranged to the opposite surface of the separation mold.
Abstract translation: 目的：提供一种制造发光二极管的装置及其制造方法，以控制荧光物质的厚度并减少发光二极管的颜色偏差。 构成：将发光装置安装在粘合膜（20）上。 粘合膜设置在下板模具（10）上。 中间板模具（30）布置在粘合膜上。 分离模具布置在粘合膜的上侧或下侧。 发光装置验收模具设置在分离模具的相对表面上。
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9.发明公开
公开(公告)号：KR1020120133264A
公开(公告)日：2012-12-10
申请号：KR1020110051845
申请日：2011-05-31
Applicant: 삼성전자주식회사
IPC: F21V5/04 , H01L33/58 , F21Y101/02
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/50 , H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
Abstract: PURPOSE: A light emitting device lens, a light emitting device module including the same, and a manufacturing method of the light emitting device module using the same are provided to form a florescent substance layer and the lens in a lump by arranging the lens after dispensing the florescent substance layer. CONSTITUTION: A substrate(200) is made of metal, silicon or ceramic. A light emitting device chip(300) is mounted in a cavity(210) of the substrate. A lens is composed of an upper part(110) and a lower part(120). The lens includes a first depression part and a second depression part. A florescent substance layer is formed in the shape having the same radius of curvature as the upper part of the lens.
Abstract translation: 目的：提供一种发光器件透镜，包括该发光器件的发光器件模块以及使用该发光器件模块的发光器件模块的制造方法，以通过在分配之后布置透镜来形成荧光物质层和透镜 荧光物质层。 构成：衬底（200）由金属，硅或陶瓷制成。 发光器件芯片（300）安装在基板的空腔（210）中。 透镜由上部（110）和下部（120）组成。 透镜包括第一凹陷部分和第二凹陷部分。 形成具有与镜片上部相同的曲率半径的形状的荧光物质层。
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公开(公告)号：KR1020170001898A
公开(公告)日：2017-01-05
申请号：KR1020150091401
申请日：2015-06-26
Applicant: 삼성전자주식회사
IPC: H01L33/58
CPC classification number: H01L33/58 , F21V3/02 , H01L33/24 , H01L33/382 , H01L33/505 , H01L2224/73204 , H01L2224/97 , H01L2933/0058
Abstract: 본발명의일 실시형태에따른광학소자는, 사각형인제1면과, 상기제1면과반대에위치한볼록한곡면인제2면을갖는돔 구조의광학소자로서, 상기사각형의대각선방향에서의단면이비구면형상을가지고, 상기사각형의대향하는양 변의중앙을연결하는방향에서의단면이반원형상을가질수 있다. 상기제2면은상기반원형상의단면과상기비구면형상의단면사이에서연속하여변화할수 있다.
Abstract translation: 光学装置可以包括具有四边形形状的第一表面; 以及设置成与第一表面相对并包括凸曲面的第二表面。 所述光学元件沿着所述四边形的对角方向具有非球面形状，并且沿着连接所述四边形的第一侧的中心部分的方向截取的横截面为半圆形， 第二侧与四边形的第一侧相对。 在光学装置的横截面图中，第二表面在横截面的半圆形状和横截面的非球面形状之间连续变化。
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