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公开(公告)号：KR1020050026251A
公开(公告)日：2005-03-15
申请号：KR1020030063266
申请日：2003-09-09
Applicant: 삼성전자주식회사 , 코닝정밀소재 주식회사
IPC: G02F1/13357
Abstract: A surface light source device, a method for manufacturing the same, and a liquid crystal display using the same are provided to extend the lifespan of the device by preventing a decrease of discharge gas through the use of protective films and a light reflector layer. A surface light source device comprises a light source body, a space divider wall(300), and a power apply unit(400). The light source body has space formed therein, and includes a protective film(240) for preventing a decrease of discharge gas and a fluorescent layer(260) formed on the protective film so as to change the non-visible light generated by the discharge gas into visible light. The space divider wall divides the space of the light source body into two discharge spaces. The power apply unit applies a discharge voltage to the discharge gas so as to generate the non-visible light from the discharge gas.
Abstract translation: 提供表面光源装置及其制造方法以及使用其的液晶显示器，以通过使用保护膜和光反射层防止放电气体的减少来延长器件的使用寿命。 面光源装置包括光源体，空间分隔壁（300）和电力施加单元（400）。 光源体具有形成在其中的空间，并且包括用于防止放电气体减少的保护膜（240）和形成在保护膜上的荧光层（260），以便改变由放电气体产生的不可见光 变成可见光。 空间分隔壁将光源体的空间分成两个放电空间。 供电单元对放电气体施加放电电压，以从放电气体产生不可见光。
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公开(公告)号：KR1020050010482A
公开(公告)日：2005-01-27
申请号：KR1020040044901
申请日：2004-06-17
Applicant: 삼성전자주식회사 , 코닝정밀소재 주식회사
IPC: G02F1/13357
Abstract: PURPOSE: A surface light source device is provided to compensate stress generated on a lower substrate while forming barrier walls on the lower substrate by that generated on the lower substrate while forming a reflection layer thereon, thereby preventing the deformation of the lower substrate formed with the barriers and the reflection layer. CONSTITUTION: A surface light source device includes an upper substrate(3), and a lower substrate(5) corresponding to the upper substrate. A plurality of barrier walls(10) are formed between the upper and lower substrates for forming discharging spaces(11) between the upper and lower substrates. The lower substrate is formed with a reflecting layer(15), and insides of the discharging spaces are respectively formed with fluorescent layers(20). As predetermined electric fields are applied into the discharging spaces from electrodes, plasma discharge is induced into the discharge spaces, generating UV rays. By the UV rays, fluorescent substances is excited from the fluorescent layer, and visible rays are generated from the fluorescent layer. The electrodes surrounds both outer surfaces of the upper or lower substrate.
Abstract translation: 目的：提供一种表面光源装置，用于补偿在下基板上产生的应力，同时在下基板上形成阻挡壁，同时在其上形成反射层，从而防止形成在下基板上的下基板的变形 障碍和反射层。 构成：表面光源装置包括上基板（3）和与上基板对应的下基板（5）。 在上基板和下基板之间形成有多个阻挡壁（10），用于在上基板和下基板之间形成放电空间（11）。 下基板形成有反射层（15），并且排出空间的内部分别形成有荧光层（20）。 当预定电场从电极施加到放电空间中时，等离子体放电被引入放电空间，产生紫外线。 通过紫外线，从荧光层激发荧光物质，从荧光层产生可见光。 电极围绕上或下基板的两个外表面。
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公开(公告)号：KR1020110095772A
公开(公告)日：2011-08-25
申请号：KR1020100015422
申请日：2010-02-19
Applicant: 삼성전자주식회사
IPC: H01L33/02
CPC classification number: H01L27/156 , H01L33/20 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
Abstract: PURPOSE: A semiconductor light emitting device with a multi cell array, a light emitting module, and a lighting device are provided to improve luminous efficiency by forming an uneven part the lower side of the substrate and/or separation region between light emitting cells. CONSTITUTION: A plurality of light emitting cells(C) is arranged on the upper side of a substrate(11). A plurality of light emitting cells has a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. A connection unit connects a plurality of light emitting cells in series, parallel, or the combination of series and parallel. An uneven part(P1) is formed on the lower side of the substrate or the upper side of a separation region between a plurality of light emitting cells. The separation region includes a region in which the first conductive semiconductor layer is exposed.
Abstract translation: 目的：提供具有多单元阵列的半导体发光器件，发光模块和照明器件，以通过在衬底的下侧和/或发光单元之间的分离区域形成不平坦部分来提高发光效率。 构成：在基板（11）的上侧配置有多个发光单元（C）。 多个发光单元具有第一导电半导体层，有源层和第二导电半导体层。 连接单元串联，并联或串联和并联的组合连接多个发光单元。 在基板的下侧或多个发光单元之间的分离区域的上侧形成有凹凸部（P1）。 分离区域包括暴露第一导电半导体层的区域。
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公开(公告)号：KR1020110059669A
公开(公告)日：2011-06-03
申请号：KR1020090114556
申请日：2009-11-25
Applicant: 삼성전자주식회사
Abstract: PURPOSE: A monolithic LED array with a serial or parallel wiring structure and a manufacturing method thereof are provided to implement a wiring structure with high reliability by forming a light emitting diode cell with a step structure through a mesa etching. CONSTITUTION: A substrate(101) has an uneven structure and an electric insulation property. A plurality of light emitting diode cells(C1,C2,C3) are respectively formed in a plurality of device areas surrounded by a convex part of an uneven structure. A plurality of light emitting diode cells have an n type semiconductor layer, a p type semiconductor layer, and an active layer between the n type semiconductor layer and the p type semiconductor layer. A wiring structure(105) electrically connects the n type semiconductor layer or p type semiconductor layer of the light emitting diode cell to the n type semiconductor layer or p type semiconductor layer of the other light emitting diode cell.
Abstract translation: 目的：提供具有串联或并联布线结构的单片LED阵列及其制造方法，以通过台面蚀刻形成具有台阶结构的发光二极管单元来实现具有高可靠性的布线结构。 构成：基板（101）具有不均匀的结构和电绝缘性能。 在由不均匀结构的凸部包围的多个器件区域中分别形成有多个发光二极管单元（C1，C2，C3）。 多个发光二极管单元在n型半导体层和p型半导体层之间具有n型半导体层，p型半导体层和有源层。 布线结构（105）将发光二极管单元的n型半导体层或p型半导体层电连接到另一个发光二极管单元的n型半导体层或p型半导体层。
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公开(公告)号：KR1020100028887A
公开(公告)日：2010-03-15
申请号：KR1020080087831
申请日：2008-09-05
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: PURPOSE: A light-emitting diode package is provided to improve thermal characteristic by reducing the thermal resistance between a package and an LED chip. CONSTITUTION: A light emitting device package comprises a package body(10), a first lead frame(21), a second lead frame(22), an LED chip(30), and an adhesive sheet(40). The package body comprises a space part(12). The first lead frame comprises a lower end surface exposing for emitting heat. A part of the second lead frame is exposed to the bottom surface of the space part of the package body. The LED chip is electrically connected to the first lead frame and the second lead frame. The adhesive sheet places the LED chip through the die bonding. The adhesive sheet is comprised of an adhesive resin. The adhesive resin contains an inorganic powder.
Abstract translation: 目的：提供一种发光二极管封装，通过降低封装和LED芯片之间的热阻来提高热特性。 构成：发光器件封装包括封装体（10），第一引线框架（21），第二引线框架（22），LED芯片（30）和粘合片（40）。 包装体包括空间部分（12）。 第一引线框架包括用于发热的露出的下端表面。 第二引线框架的一部分暴露于封装主体的空间部分的底表面。 LED芯片电连接到第一引线框架和第二引线框架。 粘合片将LED芯片通过芯片接合。 粘合片由粘合树脂构成。 粘合剂树脂含有无机粉末。
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Patent Agency Ranking
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公开(公告)号：KR1020130129102A
公开(公告)日：2013-11-27
申请号：KR1020130050080
申请日：2013-05-03
Applicant: 삼성전자주식회사
CPC classification number: H01L33/38 , H01L33/145 , H01L33/405 , H01L33/42
Abstract: The present invention relates to a semiconductor light emitting device comprising a light emitting structure in which a first conductivity type semiconductor layer and a second conductivity type semiconductor layer are sequentially arranged; first and second electrodes in which the first conductivity type semiconductor layer and the second conductivity type semiconductor layer are electrically connected. The second electrode comprises a pad reflection unit which is formed on one area among top surfaces of the second conductivity type semiconductor layer are; an opening unit which surrounds the pad reflection unit within a range beyond out of the pad reflection unit; a transparent electrode layer which is formed on the second conductivity type semiconductor layer; a finger reflection unit which is extended and formed on the pad reflection unit and partly formed on the transparent electrode layer; a pad electron unit which covers the pad reflection unit and touches the transparent electrode layer; an electron unit which covers the finger reflection unit and touches the transparent electrode layer. The semiconductor light emitting device of the present invention improves its light extraction efficiency .
Abstract translation: 本发明涉及一种包括发光结构的半导体发光器件，其中第一导电类型半导体层和第二导电类型半导体层依次布置; 第一和第二电极，其中第一导电类型半导体层和第二导电类型半导体层电连接。 第二电极包括形成在第二导电类型半导体层的顶表面之间的一个区域上的焊盘反射单元; 打开单元，其在超出所述衬垫反射单元的范围内围绕所述衬垫反射单元; 形成在第二导电型半导体层上的透明电极层; 手指反射单元，其延伸并形成在所述垫反射单元上并部分地形成在所述透明电极层上; 覆盖所述焊盘反射单元并接触所述透明电极层的焊盘电子单元; 覆盖手指反射单元并接触透明电极层的电子单元。 本发明的半导体发光器件提高其光提取效率。
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公开(公告)号：KR1020050116203A
公开(公告)日：2005-12-12
申请号：KR1020040041257
申请日：2004-06-07
Applicant: 삼성전자주식회사 , 코닝정밀소재 주식회사
IPC: G02F1/13357
CPC classification number: H01J9/247 , G02F1/133604 , H01J61/305 , H01J65/046
Abstract: 평판형광램프, 이의 제조 방법 및 이를 이용한 표시장치가 개시되어 있다. 평판형광램프는 플레이트 형상을 갖고, 비가시광선을 발생시키는 몸체 및 비가시광선을 가시광선으로 변경하기 위해, 몸체 상에 배치된 형광몸체 및 형광몸체 상에 형성되어 가시광선의 발생량을 증가시키기 위한 휘도향상패턴을 갖는 형광층을 포함한다. 휘도향상패턴에 의하여 형광층에서 발생되는 가시광선의 광량을 증가 및 휘도 균일도를 증가시킬 수 있고, 이로 인해 표시장치에서의 영상의 표시품질을 보다 향상시킬 수 있다.
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公开(公告)号：KR101601624B1
公开(公告)日：2016-03-09
申请号：KR1020100015422
申请日：2010-02-19
Applicant: 삼성전자주식회사
IPC: H01L33/02
CPC classification number: H01L27/156 , H01L33/20 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
Abstract: 본발명의일 관점은, 기판과, 상기기판상면에배열되며각각상기기판상면에순차적으로형성된제1 도전형반도체층, 활성층및 제2 도전형반도체층을갖는복수의발광셀과, 상기복수의발광셀을직렬, 병렬또는직렬및 병렬의조합으로연결되도록형성된연결부와, 상기복수의발광셀사이의분리영역상면과상기기판하면중 적어도일 면에형성된요철부를포함하는반도체발광장치를제공한다. 본발명의다른관점은, 단위면적당전류밀도를개선하여광효율을향상시키는동시에, 반사구조를이용하여광경로를개선하도록분리영역에반사부재를적용한반도체발광장치를제공한다. 본발명의또 다른관점은, 단위면적당전류밀도를개선하여광효율을향상시키면서균일한전류분산을도모하도록패드의구조및 위치를개선한반도체발광장치를제공한다.
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公开(公告)号：KR1020130011767A
公开(公告)日：2013-01-30
申请号：KR1020110073161
申请日：2011-07-22
Applicant: 삼성전자주식회사
IPC: H01L33/36
CPC classification number: H01L33/405 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/44
Abstract: PURPOSE: A semiconductor light emitting device is provided to improve the efficiency of external optical extraction by maximizing the area of the reflective metal layer of an electrode pad. CONSTITUTION: A light emitting structure includes a first conductivity type semiconductor layer, an active layer and a second conductive semiconductor layer. A first electrode(40) is electrically connected to the first conductivity type semiconductor layer. A light-transmission conductive layer(30) is formed on the second conductive semiconductor layer and has the open area for exposing a part of the second conductive semiconductor layer. The second electrode includes a reflective metal layer(51), an insulating layer, an electrode part and a branch electrode(54). The reflective metal layer is formed on the exposed second conductive semiconductor layer through the open area.
Abstract translation: 目的：提供半导体发光器件，以通过使电极焊盘的反射金属层的面积最大化来提高外部光学提取的效率。 构成：发光结构包括第一导电型半导体层，有源层和第二导电半导体层。 第一电极（40）电连接到第一导电类型半导体层。 在第二导电半导体层上形成有透光导电层（30），并具有露出第二导电半导体层的一部分的开放区域。 第二电极包括反射金属层（51），绝缘层，电极部分和分支电极（54）。 反射金属层通过开放区域形成在暴露的第二导电半导体层上。
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